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| Number | Title | Issue Date |
| 6649306 | Alloy for thin positive grid for lead acid batteries and method for manufacture of grid A lead acid battery grid made from a lead based alloy containing calcium, tin, and silver having the following composition: calcium above 0.06 and below 0.082%, tin above 1.0% and below 1.2%, silver between 0.005 and 0.020%, and optionally containing up t... | 11/18/2003 |
| 6319617 | Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T... | 11/20/2001 |
| 6224723 | Electrowinning anodes which rapidly produce a protective oxide coating An anode for use in zinc electrowinning is described. The anode is made of a lead-silver alloy which has been cast as a billet rolled and subjected to heat treatment either during or after rolling. The temperature of treatment is high enough to cause recr... | 05/01/2001 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer rat... | 04/03/2001 |
| 6160224 | Solder material and electronic part using the same An object of this invention is to provide a solder material capable of, when joining an electronic component to a substrate with the solder material, improving heat fatigue resistance thereof and reducing damage of Ni film interposed therebetween. A solut... | 12/12/2000 |
| 6086691 | Metallurgical process for manufacturing electrowinning lead alloy electrodes Lead and lead-alloy anodes for electrowinning metals such as zinc, copper, lead, tin, nickel and manganese from sulfuric acid solutions, whereby the electrodes are processed by a repetitive sequence of cold deformation and recrystallization heat treatment... | 07/11/2000 |
| 5831336 | Ternary solder for the enhancement of C-4 fatigue life An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A... | 11/03/1998 |
| 5690890 | Solder A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus... | 11/25/1997 |
| 5514334 | Fine lead alloy wire for forming bump electrodes This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 05/07/1996 |
| 5384090 | Fine wire for forming bump electrodes using a wire bonder This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 01/24/1995 |
| 5051316 | Overlay alloy or plain bearing A Pb-based overlay alloy of a plain bearing contains 3%-20% of In and more than 0.5% to 9% of Sb, and, preferably 0.1%-5% of Ag, Cu, Ni, and/or Mn, and exhibits improved properties at a high temperature and corrosive condition of deteriorated lubricating ... | 09/24/1991 |
| 5019457 | Conductor used as a fuse A conductor for a fuse has a main composition of a Pb-Ag alloy containing silver of 0.5 to 20 wt. % and lead and unavoidable impurity for the rest. A conductor for a fuse in another example includes a Pb-Ag-Cu or/and Te alloy obtained by adding copper or/... | 05/28/1991 |
| 4869871 | Pb-Sn-Sb-In solder alloy Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.... | 09/26/1989 |
| 4797328 | Soft-solder alloy for bonding ceramic articles Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.... | 01/10/1989 |
| 4676338 | Composite material The present invention relates to a composite material comprising a porous lead alloy containing from 0.7 to 1.0% silver or 0.1 to 1.0% calcium or 0.7 to 1.0% silver and 0.1 to 1.0% calcium and having its pores filled by a resin such as epoxy resin. The pr... | 06/30/1987 |
| 4654275 | Storage life of Pb-In-Ag solder foil by Sn addition A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of ... | 03/31/1987 |
| 4622205 | Electromigration lifetime increase of lead base alloys Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substa... | 11/11/1986 |
| 4608230 | Pb-Sn-Sb-Ag solder alloy A solder alloy which is particularly effective for use in automotive radiator applications comprises 87.5%-96.5% lead, 3%-10% tin, 0.5%-2.0% antimony, and 0-0.5% silver. The solder has high mechanical strength, is resistant to galvanic corrosion, and is r... | 08/26/1986 |
| 4563541 | Package providing high heat dissipation, in particular for microelectronics A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means ... | 01/07/1986 |
| 4524241 | Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors Insulated multiwire electric cable formed of solderable electric conductors protected by a lead alloy, remaining individually separate even after an operation for the electric insulation of their ply with electric conductors individually coated with a lay... | 06/18/1985 |
| 4517027 | Bulk production of alloys by deposition from the vapor phase and apparatus therefor A reuseable collector for use in a process for the bulk production of alloy by deposition from the vapor phase. The collector employs a coating of solder alloy on the deposition surface such that after deposition has been completed the solder alloy may be... | 05/14/1985 |
| 4512950 | Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more ... | 04/23/1985 |
| 4504849 | Semiconductor devices and a solder for use in such devices A semiconductor device, for example a power rectifier, formed in a semiconductor body has a contact area coated with a metal layer of, for example, gold. A metallic member is soldered to the layer with an alloy comprising at least 80% lead, the balance be... | 03/12/1985 |
| 4456579 | Low antimony lead-based alloy and method A lead-based alloy containing, based upon the total weight of the alloy, 0.8-1.6% antimony, 0.08-0.16% arsenic, 0.006-0.012% silver and, optionally, 0.2-0.5% tin, is disclosed for making lead-acid battery grids using a continuous casting process.... | 06/26/1984 |
| 4427629 | Process for metal-enrichment of lead bullion A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an en... | 01/24/1984 |
| 4173468 | Alloy for soldering aluminum An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and... | 11/06/1979 |
| 4107407 | Battery and grid for positive electrode for lead storage batteries An improved grid for the production of positive electrodes for use in electric storage batteries is disclosed. The grid is formed of a base of lead or a lead alloy which is essentially antimony-free and the base is coated with a lead alloy containing one ... | 08/15/1978 |
| 4092462 | Electrode grids for lead accumulators An electrode grid for lead accumulators, said grid being formed from a lead alloy free from antimony and consisting of tellurium, arsenic and silver in a total concentration of at most 0.1% by weight, at least 0.1% tin by weight of the alloy, and the bala... | 05/30/1978 |
| 4070192 | Aluminium soldering composition There is described a composition for soft soldering aluminium or alloys thereof using a fluxed solder composition. The fluxed solder composition comprises a soldering flux suitable for use in soft soldering aluminium and its alloys and a soft solder alloy... | 01/24/1978 |
| 4032059 | Method using a soldering alloy for connecting parts of which at least some are made of aluminium The soldering alloy comprises at least: 65 to 85% lead in weight 12 to 30% cadmium in weight 1 to 6% antimony in weight 0.5 to 1% tin in weight. In a method for soldering metal parts, the parts are submitted to an organic flux on the portions thereof to be connecte... | 06/28/1977 |
| 3993480 | Lead-antimony alloy A lead-antimony alloy is disclosed containing 0.5-3.5% by weight antimony, 0.025-0.3% by weight arsenic, 0.005-0.1% by weight selenium, 0.002-0.05% by weight tin, 0.01-0.1% by weight copper, balance lead. The alloy also preferably contains from 0.025-0.1%... | 11/23/1976 |
| 3990893 | Lead alloy for battery grid Lead alloy for the grids of lead storage batteries, which comprises from 1.0 to 3.5 % antimony, 0.025 to 0.2 % arsenic, 0.005 to 0.1 % selenium, 0.05 to 0.5 % tin, and the remainder lead. Preferably the alloy also contains 0.025 to 0.1 % silver.... | 11/09/1976 |
