Class 420/563 - LEAD BASE

Subclass of Class 420 - Alloys or metallic compositions
Definition: Alloy, or metallic composition containing over 50 percent of lead by weight.
No. of patents: 28
Last issue date: 12/28/2004

Number	Title	Issue Date
6835332	PROCESS FOR PRODUCING AN ELECTRODE MATERIAL FOR A RECHARGEABLE LITHIUM BATTERY, AN ELECTRODE STRUCTURAL BODY FOR A RECHARGEABLE LITHIUM BATTERY, PROCESS FOR PRODUCING SAID ELECTRODE STRUCTURAL BODY, A RECHARGEABLE LITHIUM BATTERY IN WHICH SAID ELECTRODE STRUCTURAL BODY IS USED, AND A PROCESS FOR PRODUCING SAID RECHARGEABLE LITHIUM BATTERY A process for producing an electrode material for a rechargeable lithium battery, comprising the steps of mixing a metal compound (a) of a metal (a′) capable of being electrochemically alloyed with lithium, a transition metal compound (b) of a transition metal (b�...	12/28/2004
6319617	Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T...	11/20/2001
6306516	Article comprising oxide-bondable solder The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to prom...	10/23/2001
6224723	Electrowinning anodes which rapidly produce a protective oxide coating An anode for use in zinc electrowinning is described. The anode is made of a lead-silver alloy which has been cast as a billet rolled and subjected to heat treatment either during or after rolling. The temperature of treatment is high enough to cause recr...	05/01/2001
6210547	Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer rat...	04/03/2001
6086691	Metallurgical process for manufacturing electrowinning lead alloy electrodes Lead and lead-alloy anodes for electrowinning metals such as zinc, copper, lead, tin, nickel and manganese from sulfuric acid solutions, whereby the electrodes are processed by a repetitive sequence of cold deformation and recrystallization heat treatment...	07/11/2000
6016947	Non-destructive low melt test for off-composition solder A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly...	01/25/2000
5690890	Solder A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus...	11/25/1997
5681975	Single source metalloorgranic precursors to type 14-16 semiconductors The present invention relates to a single source metalloorganic precursor compound of the formula: (2-NR-Q-)l M-Am (I=0-4, m=0-4, l+m=2 or 4) wherein M is selected form the Group 14 elements of Germanium, Tin or Lead; A and R are independently...	10/28/1997
5514334	Fine lead alloy wire for forming bump electrodes This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil...	05/07/1996
5384090	Fine wire for forming bump electrodes using a wire bonder This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil...	01/24/1995
5207885	Target for reactive sputtering Target for reactive sputtering in a vacuum coating apparatus consists of at least one of tin and lead doped with 20 to 200 ppm gallium and 2 to 20 ppm phosphorus....	05/04/1993
5192377	Process of producing continuously cast monotectic aluminum-silicon alloy strip and wire In a process of producing strip or wire, which consists of a monotectic aluminum-silicon alloy comprising a matrix consisting of aluminum and an aluminum-silicon eutectic system and as a minority phase 1 to 50% by weight lead or bismuth included in said m...	03/09/1993
5019187	Brazing paste for bonding metal and ceramic According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazin...	05/28/1991
4891284	Lead-aluminum material A composition of lead and aluminum is disclosed with particular utility as a battery grid material. Rapid solidification techniques permit manufacture of a composition with between about 0.1% and 20% by weight aluminum, and the balance lead....	01/02/1990
4867858	Insoluble anode made of lead alloy The corrosion resistance of an insoluble anode for use under high current condition, which anode may be made from iron or copper for example, is improved by coating the anode with an alloy of lead, tin and indium....	09/19/1989
4797328	Soft-solder alloy for bonding ceramic articles Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium....	01/10/1989
4699764	Method for alloying metals having significantly different melting points A system for alloying lead with minor amounts of alloyants which have a higher melting point than, and a lower solid solubility in, lead. The system includes a melting furnace retaining Pb melt at a first temperature, a sealed vessel containing chunks of ...	10/13/1987
4676338	Composite material The present invention relates to a composite material comprising a porous lead alloy containing from 0.7 to 1.0% silver or 0.1 to 1.0% calcium or 0.7 to 1.0% silver and 0.1 to 1.0% calcium and having its pores filled by a resin such as epoxy resin. The pr...	06/30/1987
4654275	Storage life of Pb-In-Ag solder foil by Sn addition A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of ...	03/31/1987
4581070	Multiphase backing materials for piezoelectric broadband transducers An acoustical transducer is provided with an acoustically absorbant backing material having an acoustical impedance precisely matching the impedance of the piezoelectric element in the transducer. The backing material is a multiphase mixture of selected m...	04/08/1986
4539041	Process for the reduction of metallic compounds by polyols, and metallic powders obtained by this process A process for reducing in a liquid phase a solid compound selected from the oxide, hydroxide or salt of a metal selected from the group consisting of gold, palladium, iridium, osmium, copper, silver, nickel, cobalt, lead and cadmium comprises heating said...	09/03/1985
4512950	Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more ...	04/23/1985
4439398	Method of alloying calcium and aluminum into lead Calcium and aluminum are alloyed into lead by adding a eutectic calcium-aluminum alloy to molten lead preferably at a temperature of at least 1020°. The eutectic alloy contains about 73% calcium and about 27% aluminum....	03/27/1984
4427629	Process for metal-enrichment of lead bullion A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an en...	01/24/1984
4396677	Metal, carbon, carbide and other composites thereof As an article for manufacture, a tin, lead, indium, and alloys of each, admixed with a carbide or carbonyl former, for forming these with said tin, lead and indium, and their alloys into an "active" alloy form; these "active" alloy forms are suitable for ...	08/02/1983
4332343	Process for in-situ modification of solder comopsition Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints....	06/01/1982
3966470	Photo-conductive coating containing Ge, S, and Pb or Sn As a photoconductive material there is provided a carrier having a coating thereon of a germanium-sulphur-lead alloy or a germanium-sulphur-tin alloy....	06/29/1976

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Class 420/563 - LEAD BASE