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| Number | Title | Issue Date |
| 7670548 | Lead free solder containing Sn, Ag and Bi A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has impr... | 03/02/2010 |
| 7422721 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 09/09/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7338567 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/04/2008 |
| 7331498 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature... | 02/19/2008 |
| 7291791 | Resin substrate A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over ... | 11/06/2007 |
| 7282174 | Lead-free solder and soldered article The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the... | 10/16/2007 |
| 7282175 | Lead-free solder A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point ... | 10/16/2007 |
| 7275315 | Method for repair soldering of multi-pole miniature plug connectors A method for repair soldering of multi-pole miniature plug connectors on printed circuit boards, having signal contact pins in the SMT design and shroud pins in the THR design. The plug connectors have shrouds whose shroud pins project out on the back of the printed... | 10/02/2007 |
| 7224066 | Bonding material and circuit device using the same A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, a... | 05/29/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7215030 | Lead-free semiconductor package A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximate... | 05/08/2007 |
| 7179417 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/20/2007 |
| 7175805 | Tin-zinc lead-free solder, its mixture, and solder-joined part An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/13/2007 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps a... | 12/05/2006 |
| 7132020 | Solder for use on surfaces coated with nickel by electroless plating A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, ... | 11/07/2006 |
| 7111771 | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of ... | 09/26/2006 |
| 7059512 | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet.... | 06/13/2006 |
| 7037559 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 05/02/2006 |
| 7029542 | Lead-free solder alloy A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high ... | 04/18/2006 |
| 7022282 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 04/04/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
| 7013564 | Method of producing an electronic device having a PB free solder connection A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi al... | 03/21/2006 |
| 6984254 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that ... | 01/10/2006 |
| 6963264 | Alloy type thermal fuse and wire member for a thermal fuse element The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the ope... | 11/08/2005 |
| 6960396 | Pb-free solder-connected structure and electronic device Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whisk... | 11/01/2005 |
| 6936219 | Lead-free alloy Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt. %. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder ... | 08/30/2005 |
| 6933505 | Low temperature, bump-bonded radiation imaging device An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium co... | 08/23/2005 |
| 6926849 | Solder paste A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids ... | 08/09/2005 |
| 6924044 | Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of m... | 08/02/2005 |
| 6911892 | Alloy type thermal fuse and fuse element thereof The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° ... | 06/28/2005 |
| 6884389 | Lead-free solder alloy and lead-free solder paste using the same Disclosed is a lead-free solder alloy containing 43 to 47% by weight of bismuth, 0.5 to 2.5% by weight of silver, 0.25 to 0.75% by weight of copper, 0.25 to 0.75% by weight of indium, 0.02 to 0.09% by weight of nickel and the balance of tin. ... | 04/26/2005 |
| 6849805 | Printed wiring board and electronic apparatus A printed wiring board is provided in which lift-off and land peeling do not occur during soldering of an inserted component onto the printed wiring board, and hence pattern breakage does not occur, but with no increase in cost. A plurality of lands 6 are eac... | 02/01/2005 |
| 6837947 | Lead-free solder This invention discloses a lead-free Sn—Zn—Al—Ag solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, and the balance of Sn; and a lead-free Sn—Zn—Al—Ag—Ga solder alloy, which is composed of 7-10 wt % of Zn, u... | 01/04/2005 |
| 6692691 | Pb-free soldering alloy A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the ... | 02/17/2004 |
| 6649127 | Lead-free solder material having good wettability New and improved substantially lead-free solder compositions are provided exhibiting excellent wettability and mechanical properties. In an embodiment, an improved solder material is a substantially silver-free material including from about 0.5 to about 1... | 11/18/2003 |
| 6521176 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.... | 02/18/2003 |
| 6503338 | Lead-free solder alloys A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.00... | 01/07/2003 |
| 6488888 | Lead-free solder alloys A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to... | 12/03/2002 |
| 6458279 | Fuel filter and production process A fuel filter having a formulation of a stable intermetallic compound of materials such as tin and antimony. The filter may have an integral porous structure or may be in the form of particles. It removes trace metal ions such as Ca and Na ions.... | 10/01/2002 |
