Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 7488445 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 02/10/2009 |
| 7425299 | Lead-free solder balls and method for the production thereof Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by w... | 09/16/2008 |
| 7422721 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 09/09/2008 |
| 7338567 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/04/2008 |
| 7335269 | Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P) A Pb-free solder alloy based on Sn as matrix is provided, which is a metal that has no toxicity and is environmental friendly. The Pb-free solder comprises a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.4 weight % Ag, and 0.6 to ... | 02/26/2008 |
| 7250135 | Pb-free solder alloy Provided is a Pb-free solder alloy used for mounting electronic parts on a printed circuit board. The Pb-free solder alloy is highly resistant to oxidation and impact. The Pb-free solder alloy includes Ag of 2.8 wt % to 4.2 wt %, Cu of 0.3 wt % to 0.8 wt %, Ge of 0.... | 07/31/2007 |
| 7235886 | Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby A chip-join process to reduce elongation mismatch between the adherents involves thermally expanding each of a coefficient of thermal expansion mismatched semiconductor chip and substrate a substantially equal amount from their room temperature state in a direction ... | 06/26/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7219825 | SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third elemen... | 05/22/2007 |
| 7193326 | Mold type semiconductor device A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of s... | 03/20/2007 |
| 7179417 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/20/2007 |
| 7175805 | Tin-zinc lead-free solder, its mixture, and solder-joined part An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/13/2007 |
| 7172726 | Lead-free solder A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and ... | 02/06/2007 |
| 7173188 | Straight angle conductor and method of manufacturing the same A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals... | 02/06/2007 |
| 7148426 | Lead-free solder, and connection lead and electrical component using said lead-free solder In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip ... | 12/12/2006 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps a... | 12/05/2006 |
| 7141878 | Semiconductor device and manufacturing method thereof A semiconductor device is comprised of a semiconductor element having a low dielectric constant insulating film, first electrode pads and barrier metal layers; and a substrate having second electrode pads corresponding to the first electrode pads. The first electrod... | 11/28/2006 |
| 7138086 | Soldering alloy There is disclosed a soldering alloy which prevents an iron tip of a soldering iron from being deteriorated. The soldering alloy comprises: 0.3 to 3% by weight of Cu; 0.01 to 0.1% by weight of Fe; 0.001 to 0.004% by weight of Ga; and a remainder including Sn and una... | 11/21/2006 |
| 7122894 | Wiring substrate and process for manufacturing the same A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer. ... | 10/17/2006 |
| 7111771 | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of ... | 09/26/2006 |
| 7061025 | Optoelectronic device packaging assemblies and methods of making the same Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. T... | 06/13/2006 |
| 7038142 | Circuit board and method for fabricating the same, and electronic device The circuit board for mounting semiconductor elements comprises a core substrate 10 formed of a fiber reinforced metal, an insulating layer 14 formed on the core substrate 10, and an interconnection layer 20 formed on the insulating layer... | 05/02/2006 |
| 7029542 | Lead-free solder alloy A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high ... | 04/18/2006 |
| 7022282 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 04/04/2006 |
| 7005745 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 02/28/2006 |
| 7005106 | Lead-free solder alloy and electronic components using it Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire h... | 02/28/2006 |
| 6936219 | Lead-free alloy Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt. %. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder ... | 08/30/2005 |
| 6924964 | Relay device and relay device mounting structure Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a c... | 08/02/2005 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6843862 | Solders A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A sol... | 01/18/2005 |
| 6837947 | Lead-free solder This invention discloses a lead-free Sn—Zn—Al—Ag solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, and the balance of Sn; and a lead-free Sn—Zn—Al—Ag—Ga solder alloy, which is composed of 7-10 wt % of Zn, u... | 01/04/2005 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a... | 10/19/2004 |
| 6774490 | Electronic device An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large... | 08/10/2004 |
| 6702176 | Solder, method for processing surface of printed wiring board, and method for mounting electronic part A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.... | 03/09/2004 |
| 6692691 | Pb-free soldering alloy A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the ... | 02/17/2004 |
| 6689488 | Lead-free solder and solder joint A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetal... | 02/10/2004 |
| 6687324 | Coated metal articles A metallic uranium article having a protective coating of a copper-tin alloy containing from 45 to 50% by weight of copper and from 55 to 50% by weight of tin, said alloy being firmly bonded to the metallic uranium.... | 02/03/2004 |
| 6669077 | High-strength solder joint A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a sold... | 12/30/2003 |
| 6660226 | Lead free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of, Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or... | 12/09/2003 |
| 6555052 | Electron device and semiconductor device An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock ca... | 04/29/2003 |
