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| Number | Title | Issue Date |
| 7169650 | Semi-solid metal injection methods for electronic assembly thermal interface To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capa... | 01/30/2007 |
| 7148426 | Lead-free solder, and connection lead and electrical component using said lead-free solder In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip ... | 12/12/2006 |
| 7132020 | Solder for use on surfaces coated with nickel by electroless plating A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, ... | 11/07/2006 |
| 7097090 | Solder ball A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder... | 08/29/2006 |
| 6404122 | Low-pressure mercury vapor discharge lamp A low-pressure mercury vapor discharge lamp is provided with a discharge vessel (10) enclosing a discharge space (11) containing a filling of mercury and a rare gas, an amalgam (63) which communicates with the discharge space (11), and means for maintaini... | 06/11/2002 |
| 6319617 | Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T... | 11/20/2001 |
| 6033488 | Solder alloy A solder alloy includes tin (Sn) of 50-80 wt %, antimony (Sb) of 0.05-10 wt %, silver (Ag) of 0.0001-5 wt %, phosphorus (P) of 0.0001-0.5 wt %, unavoidable impurities, and lead for the remaining wt %. Numerical limitation to the content amount of the resp... | 03/07/2000 |
| 5871690 | Low-temperature solder compositions Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154°-162° C. The solder compositions have microstr... | 02/16/1999 |
| 5738692 | Fuel treatment device A fuel treatment device treats fuel prior to combustion in order to improve combustion efficiency and reduce exhaust emissions in hydrocarbon fuel burning systems. The fuel treatment device includes at least one element comprising tin, antimony, lead and ... | 04/14/1998 |
| 5728913 | Moisture based method of improving the performance of hydrocarbon fuels A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used internal and external combustion engines The catalyst is a base metal alloy catalyst including tin antimony, lead and mer... | 03/17/1998 |
| 5690890 | Solder A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus... | 11/25/1997 |
| 5625118 | Method of improving the performance of hydrocarbon fuels A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used in internal and external combustion engines. The catalyst is a base metal alloy catalyst including tin, antimony, lead an... | 04/29/1997 |
| 5538686 | Article comprising a PB-free solder having improved mechanical properties Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183° C.b1;10° C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The nove... | 07/23/1996 |
| 5487868 | Tin based solder alloy containing lead, antimony, and tellurium The invention is a solder alloy which can alleviate the fatigue rupture which occurs at a soldered joint due to a heat cycle. The solder alloy also shows effective use of the addition of Cu. This solder alloy comprises 57 to 65% Sn, 0.1 to 0.5% Sb, 0.002 ... | 01/30/1996 |
| 5480731 | Hot dip terne coated roofing material Various metal coatings have been used for many years to inhibit oxidation of metals exposed to the natural elements of the atmosphere over a period of time. Terne alloy coatings which normally contain about 20% tin and about 80% lead are some of the most ... | 01/02/1996 |
| 5455004 | Lead-free alloy containing tin, zinc, indium and bismuth A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190°... | 10/03/1995 |
| 5437737 | Repair coating for superalloy articles, such as gas turbine engine components A repair coating for superalloy articles, such as gas turbine engine components, includes a volatile organic carrier or water-based carrier, a fluxing agent, a thickening agent, balance a filler mix. The filler mix consists of at least two distinct partic... | 08/01/1995 |
| 5435968 | A lead-free solder composition An enhanced bonding design utilizing tin and copper to create tin alloy solders for use in the manufacturing of heat exchangers and other soldering applications. The tin alloy solders contain as primary constituent metals 3.0-15.0 wt. % copper and 79.0-97... | 07/25/1995 |
| 5393723 | Catalyst for improving the combustion and operational qualities of hydrocarbon fuels The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percen... | 02/28/1995 |
| 5384090 | Fine wire for forming bump electrodes using a wire bonder This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 01/24/1995 |
| 5382300 | Solder paste mixture A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one ... | 01/17/1995 |
| 5354624 | Coated copper roofing material A copper metal roofing system coated with a highly corrosive resistant material is disclosed which can be used to collect potable water. The copper roofing system is highly malleable allowing on site formation of the copper roofing materials into a variet... | 10/11/1994 |
| 5328660 | Lead-free, high temperature, tin based multi-component solder Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy containing a major portion of Sn, and effective amounts of Ag, Bi and In. Preferably the solder alloy contains 78.4 weight percent Sn, 2.0 weight... | 07/12/1994 |
| 5314758 | Hot dip terne coated roofing material Various metal coatings have been used for many years to inhibit oxidation of metals exposed to the natural elements of the atmosphere over a period of time. Terne alloy coatings which normally contain about 20% tin and about 80% lead are some of the most ... | 05/24/1994 |
| 5308578 | Fatigue resistant lead-tin eutectic solder The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with about 0.1 to 0.8 weight % of a dopant selected from cadmium, indium antimony and mixtures thereof. The doped eutectic solder exhibits increased resistance to thermal... | 05/03/1994 |
| 5229070 | Low temperature-wetting tin-base solder paste A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The se... | 07/20/1993 |
| 5120498 | Solders having exceptional adhesion to glass Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium, rubidium, cesium, calcium, or magnesium into the heavy metal so... | 06/09/1992 |
| 4962003 | Development of fusible alloy composites In summary of this disclosure, the present invention provides novel metal matrix fibrous composites which can be used as a fusible core in molding plastics. Modifications are possible within the scope of this invention.... | 10/09/1990 |
| 4937045 | High-speed solder compositions A solder composition for use in high-speed hand-soldering of art work or other artifacts consisting essentially of from about 51% to about 56% by weight tin, from about a trace to about 1.0% by weight antimony, and the balance being substantially lead.... | 06/26/1990 |
| 4869871 | Pb-Sn-Sb-In solder alloy Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.... | 09/26/1989 |
| 4173468 | Alloy for soldering aluminum An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and... | 11/06/1979 |
| 4150983 | Tin base white metal bearing alloys Bearing alloys are made by adding chromium, one or more rare earth elements and/or magnesium to the conventional Sn-base white metal bearing alloys. The addition of such additives, even only with slow cooling after casting, enables the refining of cubic c... | 04/24/1979 |
| 4106930 | Solder alloys for soldering difficultly solderable material Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180° C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60... | 08/15/1978 |
| 4083718 | Bismuth-tin-indium-lead alloy Disclosed is a bismuth-tin-indium-lead alloy consisting essentially of 28 to 72 weight % of bismuth, 25 to 52 weight % of tin, 2 to 12 weight % of indium and 1 to 8 weight % of lead. This alloy has excellent sealing property and oxidation resistance, and ... | 04/11/1978 |
| 3949118 | Process for soldering difficultly solderable material having oxide surface and a solder alloy therefor Difficultly solderable material having an oxide surface such as glass, ceramics or such metals as Si, Ge, Al, Ti, Zr or Ta is soldered using a solder alloy composed of 2-98.5% by wt. of Pb, 1-97.5% by wt. of Sn and 0.1-15% by wt. of rare earth metals, whi... | 04/06/1976 |
| 3945556 | Functional alloy for use in automated soldering processes A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance ... | 03/23/1976 |