Class 420/558 - Lead containing

Subclass of Class 420 - Alloys or metallic compositions
Definition: Alloy, or metallic composition which additionally contains lead.
No. of patents: 32
Last issue date: 12/18/2007

Number	Title	Issue Date
7309647	Method of mounting an electroless nickel immersion gold flip chip package A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process...	12/18/2007
7291549	Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri...	11/06/2007
7111771	Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of ...	09/26/2006
7097090	Solder ball A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder...	08/29/2006
7041180	Method for joining workpieces using soldering alloy A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum;...	05/09/2006
7017795	Solder pastes for providing high elasticity, low rigidity solder joints Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity w...	03/28/2006
7005745	Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri...	02/28/2006
6921497	Composition of matter tailoring: system I The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character. ...	07/26/2005
6689488	Lead-free solder and solder joint A lead-free solder, which contains from 1.0 to 3.5% of Ag, from 0.1 to 0.7% of Cu, and from 0.1 to 2.0% of In, the balance consisting of unavoidable impurities and Sn, is appropriate for ball-grid array (BGA). The solute Cu suppresses growth of intermetal...	02/10/2004
6423154	Solder-coating method, and solder paste suitable for use therein A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energ...	07/23/2002
6319617	Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T...	11/20/2001
6231693	Alloy, in particular a solder alloy, for joining workpieces The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed ...	05/15/2001
6221514	High-current circuit trace and composition and method therefor A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder c...	04/24/2001
6210547	Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer rat...	04/03/2001
6160224	Solder material and electronic part using the same An object of this invention is to provide a solder material capable of, when joining an electronic component to a substrate with the solder material, improving heat fatigue resistance thereof and reducing damage of Ni film interposed therebetween. A solut...	12/12/2000
6071359	Shot for use as ammunition Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, les...	06/06/2000
5550407	Semiconductor device having an aluminum alloy wiring line A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device c...	08/27/1996
5538686	Article comprising a PB-free solder having improved mechanical properties Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183° C.&#b1;10° C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The nove...	07/23/1996
5384090	Fine wire for forming bump electrodes using a wire bonder This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil...	01/24/1995
5382300	Solder paste mixture A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one ...	01/17/1995
5308578	Fatigue resistant lead-tin eutectic solder The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with about 0.1 to 0.8 weight % of a dopant selected from cadmium, indium antimony and mixtures thereof. The doped eutectic solder exhibits increased resistance to thermal...	05/03/1994
5120498	Solders having exceptional adhesion to glass Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium, rubidium, cesium, calcium, or magnesium into the heavy metal so...	06/09/1992
5066544	Dispersion strengthened lead-tin alloy solder An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic....	11/19/1991
5011658	Copper doped low melt solder for component assembly and rework Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level...	04/30/1991
4938924	Copper doping of eutectic solder Eutectic solder, including a combination of tin, lead and silver is doped by the addition of copper to substantially improve its effectiveness in soldering printed wiring cards which have been screen printed with conductors and mounting pads for component...	07/03/1990
4588657	Solder composition A solder is disclosed which consists essentially of from about 55 to about 65 percent by weight of tin, from about 2 to about 3.9 percent by weight of calcium with the remainder being lead. The calcium modified tin-lead solders of this invention are chara...	05/13/1986
4563541	Package providing high heat dissipation, in particular for microelectronics A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means ...	01/07/1986
4512950	Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more ...	04/23/1985
4318741	Rare earth metal stannides A new family of rare earth-rhodium-tin intermetallic compounds, with the representative formula (RE)Rhx Sny, has been synthesized in single crystal form. The compounds containing the heavier rare earths are superconducting and those ...	03/09/1982
4106930	Solder alloys for soldering difficultly solderable material Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180° C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60...	08/15/1978
4070192	Aluminium soldering composition There is described a composition for soft soldering aluminium or alloys thereof using a fluxed solder composition. The fluxed solder composition comprises a soldering flux suitable for use in soft soldering aluminium and its alloys and a soft solder alloy...	01/24/1978
3998677	Technique for using solder etch resist in generation of patterns on printed wiring boards A technique is described for the generation of a pattern on printed wiring boards bearing a layer of copper. The technique involves the use of a solder cream as an etch resist, the cream comprising a slurry of solder suspended in a curable resin flux. The...	12/21/1976

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Class 420/558 - Lead containing