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| Number | Title | Issue Date |
| 7276731 | Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same In a method for fabricating a thin film transistor array substrate, a glass substrate undergoes an oxygen plasma treatment. A silver or silver alloy-based conductive layer is deposited onto the substrate, and patterned to thereby form a gate line assembly proceeding... | 10/02/2007 |
| 7208870 | Silver alloy used in an organic electroluminescent panel An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a... | 04/24/2007 |
| 7118707 | Silver-platinum alloy and methods of manufacturing same A silver-platinum alloy formulated to provide improved tarnish resistance and hardness as compared to sterling silver. The alloy can be incorporated in various jewelry, flatware, and like articles. The alloy generally includes silver and platinum, with silver being ... | 10/10/2006 |
| 6936117 | Silver alloy with color fastness A silver alloy with color fastness includes silver as major component; and a small quantity of copper, zinc and nickel so that it can be prevented to oxidize, and it can use metal with easy procurement without special metal and manufacture a alloy with color fastnes... | 08/30/2005 |
| 6913657 | Hard precious metal alloy member and method of manufacturing same A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted o... | 07/05/2005 |
| 6860949 | High strength, tarnish resistant composition of matter A high strength, tarnish resistant composition of matter includes approximately 90 percent Ag, 3 to 5 percent Pt and 7 to 5 percent Cu. In a preferred embodiment, the composition of matter includes 90 percent Ag, 3 percent Pt and 7 percent Cu. In another preferred e... | 03/01/2005 |
| 6723281 | Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials The present invention relates to a metal material for electronic parts, electronic parts, electronic apparatuses, a method of processing metal materials, and electro-optical parts. For example, the present invention is applied to liquid crystal display panels, vario... | 04/20/2004 |
| 6413649 | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 an... | 07/02/2002 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer rat... | 04/03/2001 |
| 5876862 | Sliding contact material, clad compoosite material, commutator employing said material and direct current motor employing said commutator Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-contain... | 03/02/1999 |
| 5833774 | High strength silver palladium alloy A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected ... | 11/10/1998 |
| 5817195 | Silver colored alloy with low percentage of nickel and copper A silver colored alloy highly tarnish resistant, sterling silver is provided or having included therein: 90% to 92.5% by weight Silver; 5.75% to 7.5% by weight Zinc; 0.25% to less than 1% by weight Copper; 0.25% to 0.5% by weight Nickel; 0.1% to 0.25% by ... | 10/06/1998 |
| 5484569 | Silver palladium alloy A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selecte... | 01/16/1996 |
| 5422190 | Via fill paste and method of using the same containing specific amounts of silver, gold and refractory oxides The present invention provides a new and useful via fill paste for use in the construction of electronic circuit devices. The unique via fill paste is capable of electrically connecting conductive layers made of dissimilar metals such as gold and silver. ... | 06/06/1995 |
| 5242305 | Method and composition for removing mercury vapor from dental restorations The amount of mercury released from amalgam restorations in the teeth of living beings is significantly reduced without changing the composition of the silver-tin-copper alloy or changing the mercury-alloy ratio. This is achieved by introducing a mercury-... | 09/07/1993 |
| 5185125 | Dental alloy and amalgam thereof A dental alloy having, upon amalgamation, a desirable combination of physical properties and both a desirable condense time and carve time. The alloy contains from 48.75 to 50.75% silver, 20.25 to 21.75% copper, 28.25 to 29.25% tin, 0.05 to 0.8% palladium... | 02/09/1993 |
| 5171643 | Electric contact material and electric contact using said material An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at l... | 12/15/1992 |
| 5149362 | Contact forming material for a vacuum interrupter An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag... | 09/22/1992 |
| 5075285 | Silver alloy sheathing material for ceramic superconducting wires The invention relates to a sheathing material for superconducting wires which are deformed during manufacture by drawing or a similar procedure. The superconducting material of the wires is composed of an oxide whose superconducting properties worsen duri... | 12/24/1991 |
| 5045411 | Alloy compositions A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved col... | 09/03/1991 |
| 5037708 | Silver palladium alloy A silver colored metal alloy having improved tarnish resistance is disclosed, which is intended primarily for solid sterling jewelry and utensils and may also be used in silver plating, and does not easily tarnish and corrode. The alloy consists essential... | 08/06/1991 |
| 5000779 | Palladium based powder-metal alloys and method for making same The subject of this invention is the development of new alloys along with new processing approaches for the utilization of the alloys. A particular class of alloys comprises at least one noble metal selected from the group comprising gold, palladium, silv... | 03/19/1991 |
| 4948557 | Tarnish resistant gold colored alloy with enhanced gold color A gold colored, tarnish and corrosion resistant alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 24 to 27 percent palladium, 19 to 22 percent indium, 5 to 30 percent copper, 1 to 20 percent gold, and ... | 08/14/1990 |
| 4895701 | Gold colored alloy composition with zero percent gold A gold colored, tarnish and corrosion resistant gold free alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 24 to 27 percent palladium, 19 to 22 percent indium, 5 to 30 percent copper, and the balance ... | 01/23/1990 |
| 4859240 | Dental amalgam alloy The present invention relates to a dental amalgam alloy comprising by weight, as alloying ingredients, from about 30 to 70% silver, from about 20 to 35% tin, from about 10 to 30% cooper, from 0 to about 5% indium, from 0 to about 1% zinc and from about 0.... | 08/22/1989 |
| 4775511 | Method of sulfide tarnish inhibiting of silver-copper, silver-gold and silver-copper-gold alloys Sulfide tarnish inhibiting of silver base alloys selected from the group consisting of Ag-Cu, Ag-Au, and Ag-Cu-Au is achieved by adding to silver base alloys at least one element with passivating ability and with heat of sulfide formation which exceeds th... | 10/04/1988 |
| 4686082 | Dental amalgam alloy The present disclosure relates to a dental amalgam alloy comprising by weight, as alloying ingredients, from about 30 to 70% silver, from about 20 to 35% tin, from about 10 to 30% copper, from 0 to about 5% indium, from 0 to about 1% zinc and from about 0... | 08/11/1987 |
| 4664629 | Dental composition mixture By the present invention a dental alloy mixture is provided that is a combination of 20 to 70 percent by weight of cut alloy comprising silver, tin, and copper, with the copper present in an amount of 0 to 30 percent by weight of the cut alloy; and 30 to ... | 05/12/1987 |
| 4623513 | Ductile low temperature brazing alloy Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controll... | 11/18/1986 |
| 4528034 | Selenium-containing amalgam alloys for dental restoration and method for the preparation thereof Selenium-containing amalgam alloys for dental restoration comprises 0.1-50% by weight of any one of the following alloy powders (A), (B) and (C) mixed with 50-99.9% by weight of the following amalgam alloy powders (D). (A): Silver alloy powders containing no l... | 07/09/1985 |
| 4522783 | Metallic alloys to be used in dentistry The present invention relates to a method for obtaining metallic alloys, to be used particularly in the field of dentistry. This method allows to accomplish a basic face-centered cubic lattice adapted to form the alloys, in which a homogeneous distribution of ... | 06/11/1985 |
| 4385892 | Setting compositions for dental purposes A novel setting composition for dental purposes comprises a dental silver amalgam alloy composed mainly of silver and tin, and including one or more of copper, zinc, indium, palladium and gold; mercury in an amount sufficient to amalgamate said alloy: and... | 05/31/1983 |
| 4374085 | Silver-tin-copper-palladium alloy and amalgam thereof A silver-tin-copper-palladium alloy containing from 30 to 70% silver, 15 to 37% tin, at least 13% copper and from 0.05 to 0.95% palladium; and an amalgam thereof.... | 02/15/1983 |
| 4370164 | Yellow metal alloy An alloy of about 4 to 10% gold, silver, copper, palladium, indium, zinc and boron producing an alloy with a pleasing yellow color. Tarnish resistance, wear resistance and heft are similar to 10 karat gold with a lesser cost due to the low gold content.... | 01/25/1983 |
| 4369162 | Silver base casting alloy for dental use Silver base casting alloys for dental use which have a yellow color. They are useful for the manufacture of crowns, bridges and other dental prosthesis and such dental prosthesis are within the scope of the invention. The dental alloys consist essentially... | 01/18/1983 |
| 4350527 | Gold-colored, acid and corrosion resistant alloy A gold-colored, acid and corrosion resistant alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 15 to 20 weight percent of indium, 7 to 20 weight percent of copper, 5 to 15 weight percent of palladium, ... | 09/21/1982 |
| 4255191 | Gold-silver alloys with good tarnish resistance for the dental art Gold-silver alloys with good tarnish resistance for the dental art are prepared which, contrary to the known tarnish resistant alloys, still contain copper and thus have a deeper gold color and a high ductility. The alloys contain 33 to 48% gold, 0-5% pla... | 03/10/1981 |
| 4149883 | Electrical contact The present invention provides electrical contacts having at least one contact surface consisting essentially of a silver palladium alloy containing 10-50 percent by weight palladium, 0.1-8 percent copper, 0.1-6 percent indium, 0.1-6 percent tin, and the ... | 04/17/1979 |
| 4124380 | Silver-copper-germanium alloys having high oxidation resistant melts A silver-copper-germanium base alloy is disclosed consisting by weight of 40 to 85% silver, 15 to 60% copper and 0.1 to 10% germanium. Optionally, up to 15% by weight of the base alloy may be replaced with tin and up to 10% by weight of at least one of go... | 11/07/1978 |
