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| Number | Title | Issue Date |
| 7374651 | Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it The present invention pertains to an electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1500 μm (or more) to 20000 μm in an electrolytic copper plating method employing a phosphorous copper anode... | 05/20/2008 |
| 7261760 | Member having separation structure and method for manufacture thereof A member having a separated structure made by an alloy consisting of two regions having different compositions with each other is formed by casting a molten alloy into a prescribed shape, or by spray-quenching the same from a temperature of Tc+10° C. or more, where... | 08/28/2007 |
| 7180176 | Radiation plate and power semiconductor module IC package Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to h... | 02/20/2007 |
| 6858102 | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi... | 02/22/2005 |
| 6241831 | Copper alloy The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weigh... | 06/05/2001 |
| 6202703 | Corrosion resistant copper alloy tube and fin-tube heat exchanger The copper alloy tube disclosed here contains 0.05 to 1.5 wt. % of Mn and deoxidized copper containing oxygen concentration at 100 ppm or less. At least one element selected from a group of elements comprising P, B, Li, Pb and Sb can be added at the amoun... | 03/20/2001 |
| 6103188 | High-conductivity copper microalloys obtained by conventional continuous or semi-continuous casting We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from th... | 08/15/2000 |
| 6093265 | Copper alloy having improved stress relaxation A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the... | 07/25/2000 |
| 6059901 | Bismuthized Cu-Ni-Mn-Zn alloy Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range: Nickel=12-28 Manganese=12-28 Zinc=12-28 Aluminum=0.5-2.00 Bismuth=2-6 Phosp... | 05/09/2000 |
| 5997810 | High-strength copper based alloy free from smutting during pretreatment for plating A high-strength Cu based alloy, consists of: Ni: 0.5 to 2.0%; Sn: 1.2 to 2.5%; Si: 0.04 to 0.1%; Zn: 0.1 to 1%; Mg: 0.0001 to 0.02%; Mn: 0.0001 to 0.1%; P: 0.0001 to 0.02%; and Cu and inevitable impurities: the balance, wherein the total content of Mg, Mn and P is 0.001... | 12/07/1999 |
| 5980656 | Copper alloy with magnesium addition A copper alloy achieves high electrical conductivity, in excess of 70% IACS; high strength, ultimate tensile strength in excess of 75 ksi; good surface cosmetics; and good stampability, above 25% break, by controlled additions of magnesium, iron and phosp... | 11/09/1999 |
| 5942056 | Plumbing fixtures and fittings employing copper-bismuth casting alloys A plumbing fixture or fitting fabricated from a bismuth and mischmetal containing copper alloy.... | 08/24/1999 |
| 5868877 | Copper alloy having improved stress relaxation A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the... | 02/09/1999 |
| 5851957 | Oxide superconductor precursors A composite for preparation of an oxide superconductor includes a primary alloy phase of constituent elements of a desired oxide superconductor; and a secondary phase comprising copper, the secondary phase supported by the primary alloy phase. The composi... | 12/22/1998 |
| 5667752 | Copper alloy sheet for connectors and connectors formed of same There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of: Mg: 0.3-2% by weight; P: 0.001-0.02% by weight; C: 0.0002-0.0013% by weight; O: 0.0002-0.001% by weight; and Cu and inevitable impurities: the b... | 09/16/1997 |
| 5665480 | Copper-lead alloy bearing A copper-lead alloy bearing having a high corrosion resistance, especially a high corrosion resistance to sulfur, comprising a back metal and a copper-lead-based bearing alloy bonded thereto. The copper-lead-based bearing alloy consists of more than 10 bu... | 09/09/1997 |
| 5637132 | Powder metallurgy compositions Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders having about 90 parts copper, about 10 parts tin and an amount of bi... | 06/10/1997 |
| 5637160 | Corrosion-resistant bismuth brass There is provided a machinable +ଲ brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100° C.-3... | 06/10/1997 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
| 5507885 | Copper-based alloy A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous soluti... | 04/16/1996 |
| 5489417 | Spray cast copper-manganese-zirconium alloys having reduced porosity Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from th... | 02/06/1996 |
| 5441555 | Powder metallurgy compositions Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of about 90 parts copper, about 10 parts tin and an amount of bismuth in the range fr... | 08/15/1995 |
| 5441696 | Copper-nickel based alloy A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.... | 08/15/1995 |
| 5334346 | Copper alloys for electrical and electronic parts This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper... | 08/02/1994 |
| 5286444 | Copper bearing alloy Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue... | 02/15/1994 |
| 5167726 | Machinable lead-free wrought copper-containing alloys Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a... | 12/01/1992 |
| 5137685 | Machinable copper alloys having reduced lead content Machinable copper alloys having a reduced lead concentration are disclosed. An additive to the alloy accumulates both at the grain boundaries and intragranularly. The additive facilitates chip fracture or lubricates the tool. One additive is a mixture of ... | 08/11/1992 |
| 5077005 | High-conductivity copper alloys with excellent workability and heat resistance There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of ________________________... | 12/31/1991 |
| 5066456 | Phosphorous copper based alloy with tin and antimony A phosphorous copper based alloy having combined tin and antimony contents up to approximately six percent each for brazing filler metal joining copper and copper alloys producing strong clean joints at lower brazing temperatures. Silver added in amounts ... | 11/19/1991 |
| 5019157 | Method of making eutectic mixture of copper and tricopper phosphide Disclosed is a method of making a eutectic mixture of copper and tricopper phosphide by reacting elemental copper with phosphine. The elemental copper is heated to a temperature above about 714° C. and the liquid eutectic mixture runs off of the cooper a... | 05/28/1991 |
| 5004520 | Method of manufacturing film carrier There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled cop... | 04/02/1991 |
| 4971758 | Copper-based alloy connector for electrical devices A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to... | 11/20/1990 |
| 4853184 | Contact material for vacuum interrupter The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding ... | 08/01/1989 |
| 4732732 | Migration resistant phosphor bronze alloy A phosphor bronze alloy excellent in migration resistance, which containing from 3.0 to 9.0% by weight of Sn, from 0.03 to 0.35% by weight of P, from 1.0 to 5.0% by weight of Zn, and the substantial balance of Cu and impurities. The phosphor bronze alloy ... | 03/22/1988 |
| 4717436 | Wire for bonding a semiconductor device The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. In accordance with one aspect of the present invention, at least one rare earth element, or at least one e... | 01/05/1988 |
| 4710349 | Highly conductive copper-based alloy A highly conductive copper-based alloy containing 0.001 percent to 0.02 percent of tellurium, 0.05 percent to 0.3 percent of one element selected from iron and chromium, and 0 percent to 0.01 percent of phosphorous with the balance being copper and incide... | 12/01/1987 |
| 4704253 | Copper alloy for a radiator fin A copper alloy for use in the manufacture of a radiator fin contains 10 to 150 ppm of tellurium and 20 to 110 ppm of phosphorus, both by weight, as well as copper and unavoidable impurities.... | 11/03/1987 |
| 4631237 | Wire electrode for spark-eroding systems A wire electrode for a spark-eroding system for erosion cutting of workpieces using intermittent electrical charges includes a core of a current-conducting material and a wire coating of a material with a lower evaporation temperature, for example zinc. T... | 12/23/1986 |
| 4624833 | Liquid metal ion source and apparatus A liquid metal ion source for emitting P ions, wherein a Cu alloy which contains at most 25 at. % of P and if necessary, further contains Ag, C or Si, and/or B is melted and fed to an emitter tip so as to generate an ion beam under a high electric field.... | 11/25/1986 |
| 4575451 | Contact material for vacuum circuit breaker A contact material for a vacuum circuit breaker consists essentially of copper as the basic component, and, as the other components, 35% by weight or below of chromium and 50% by weight or below of niobium, the total quantity of chromium and niobium in sa... | 03/11/1986 |
