Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 7220494 | Metal dusting resistant product A product resistant or immune to carburization, metal dusting, coking, oxidation, and having sufficient mechanical strength for use at temperatures greater than 400° C. The product consists of a load-bearing member and a corrosion resistant member, wherein the corr... | 05/22/2007 |
| 7186370 | Copper-base alloy and its use A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, ... | 03/06/2007 |
| 6749699 | Silver containing copper alloy A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impur... | 06/15/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6440854 | Anti-agglomeration of copper seed layers in integrated circuit metalization The present invention pertains to systems and methods for reducing the agglomeration of copper deposited by physical vapor deposition. More specifically, the invention pertains to systems and methods for depositing copper seed layers on a semiconductor wa... | 08/27/2002 |
| 6413649 | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 an... | 07/02/2002 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 5997810 | High-strength copper based alloy free from smutting during pretreatment for plating A high-strength Cu based alloy, consists of: Ni: 0.5 to 2.0%; Sn: 1.2 to 2.5%; Si: 0.04 to 0.1%; Zn: 0.1 to 1%; Mg: 0.0001 to 0.02%; Mn: 0.0001 to 0.1%; P: 0.0001 to 0.02%; and Cu and inevitable impurities: the balance, wherein the total content of Mg, Mn and P is 0.001... | 12/07/1999 |
| 5955176 | Integrated suspension using a high strength conductive material A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a suppo... | 09/21/1999 |
| 5911949 | Abrasion resistant copper alloy An abrasion resistant copper alloy suitable for the material of an overlaid layer formed at the valve seat of an engine cylinder head formed of aluminum alloy. The copper alloy consists essentially of nickel in an amount ranging from 10 to 30% by weight; ... | 06/15/1999 |
| 5705125 | Wire for electric railways A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, 0.05 to 0.15% Sn, and 10 ppm or less O, and if required, further contains 0.01 to 0.1% Si, or 0.01 to 0.1% Si and 0.00... | 01/06/1998 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
| 5441696 | Copper-nickel based alloy A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.... | 08/15/1995 |
| 5296057 | High abrasion resistant aluminum bronze alloy, and sliding members using same The object of the present invention is to provide an abrasion resistant aluminum bronze alloy for sliding members of various industrial machines. The abrasion resistant aluminum bronze alloy consists of Al: 7-12%, Mn: 1.5-5.5%, Si: 0.45-2.7%, respectively in w... | 03/22/1994 |
| 5286444 | Copper bearing alloy Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue... | 02/15/1994 |
| 5246509 | Copper base alloy superior in resistances to seizure, wear and corrosion suitable for use as material of sliding member A copper base alloy suitable for use as a material of a sliding member, superior in seizure resistance, wear resistance and corrosion resistance. The alloy comprises 1.0 to 3.5 wt % Mn, 0.3 to 1.5 wt % Si, 11.5 to 25 wt % Zn, 5 to 18 wt % Pb and the balan... | 09/21/1993 |
| 5215711 | Age-hardening type special Cu alloy An age-hardening type special Cu alloy prepared by compounding 0.1 to 5% by weight of Ni, 0.01 to 7% by weight of Si, 0.01 to 10% by weight of Fe, 0.01 to 7% by weight of Ti and 0.001 to 1% by weight of B in Cu as the main component. This alloy is improve... | 06/01/1993 |
| 5188799 | Wear-resistant copper-base alloy A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %, Ni: 10.0 to 30.0%; Si: 0.5 to 3%; Co: 2.0 to 15.0%; at least one metal selected from the group consisting of Mo, W, Nb and V: 2.0 to 15.0%; and the balance being Cu and unavoid... | 02/23/1993 |
| 5132083 | Laser padding material and a laser padding method using the same A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less... | 07/21/1992 |
| 5024815 | Copper alloy with phosphorus and iron A copper alloy comprising: (A) 0.15-1.0 wt % Fe, (B) 0.05-0.3 wt % P, and (C) (1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or (2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or (3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or (4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si, with the b... | 06/18/1991 |
| 5004520 | Method of manufacturing film carrier There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled cop... | 04/02/1991 |
| 4971758 | Copper-based alloy connector for electrical devices A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to... | 11/20/1990 |
| 4886641 | Electrical contact spring material made of copper base alloy of high strength and toughness with reduced anisotropy in characteristics A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., t... | 12/12/1989 |
| 4853184 | Contact material for vacuum interrupter The invention relates to contact material for vacuum interrupter, and in order to be splendid in the breakdown voltage ability and increase the interrupting ability, a contact material is constituted by containing copper and chromium, and moreover adding ... | 08/01/1989 |
| 4810468 | Copper-chromium-titanium-silicon-alloy The invention relates to a copper-chromium-titanium-silicon-alloy, which consists essentially of 0.10 to 0.50% chromiun; 0.01 to 0.25% titanium; silicon; the remainder being copper and the usual impurities, wherein the silicon content (a) is more than 0.1... | 03/07/1989 |
| 4791036 | Anode conductor for alkaline cells This invention pertains to an anode current collector for alkaline electrochemical cells having zinc anodes. An anode current collector made from silicon bronze alloy has improved welding characteristics and has a minimal effect on gassing.... | 12/13/1988 |
| 4751049 | Connector and alloy Connectors which are essentially, by weight, 85% to 93% copper, with silicon in the amount of 1.5% to 2.5% is disclosed. The balance of the material is zinc, desirably in the range of 5% to 12%. Trace elements of tin, lead and aluminum can be tolerated bu... | 06/14/1988 |
| 4732874 | Removing metal precipitates from semiconductor devices Rapid thermal annealing, involving rapid heating to a temperature of between 550 degrees C. and 750 degree C. for between 30 and 90 seconds and rapid cooling, is used to dissolve the precipitates of transition metals which tend to occur in a silicon wafer... | 03/22/1988 |
| 4678637 | Copper-chromium-titanium-silicon alloy and application thereof The invention relates to a copper-chromium-titanium-silicon alloy which consists of 0.1 to 0.5% chromium, 0.05 to 0.5% titanium and 0.01 to 0.1% silicon, the remainder comprising copper and usual impurities. Because of its excellent properties as regards ... | 07/07/1987 |
| 4642146 | Alpha copper base alloy adapted to be formed as a semi-solid metal slurry A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from ab... | 02/10/1987 |
| 4624833 | Liquid metal ion source and apparatus A liquid metal ion source for emitting P ions, wherein a Cu alloy which contains at most 25 at. % of P and if necessary, further contains Ag, C or Si, and/or B is melted and fed to an emitter tip so as to generate an ion beam under a high electric field.... | 11/25/1986 |
| 4612166 | Copper-silicon-tin alloys having improved cleanability The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from ab... | 09/16/1986 |
| 4594221 | Multipurpose copper alloys with moderate conductivity and high strength A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide i... | 06/10/1986 |
| 4587097 | Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impur... | 05/06/1986 |
| 4517157 | Copper based brazing alloy A brazing alloy having a composition consisting essentially of from about 1% to about 3% by weight boron, from about 8% to about 12% by weight silicon, and the balance copper is beneficial in brazing stainless steels and other ferrous metals.... | 05/14/1985 |
| 4465511 | Making niobium intermetallic compounds NbSn2 is made by passing NbCl5 volatilized in an argon stream at 550° C. to liquid tin. The product precipitates as a solid, while the tin chloride by product is carried away by the argon. Nb6 Sn5 is made from ... | 08/14/1984 |
| 4416853 | Cu-Ag base alloy brazing filler material A Cu-Ag alloy brazing filler material with low Ag content that exhibits excellent brazability and has a low vapor pressure is disclosed. The filler material comprises 5 to 35% by weight of Ag, 2.5 to 13% by weight of Si, with the balance being Cu and inci... | 11/22/1983 |
| 4366117 | Copper alloy for use as lead material for semiconductor devices A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of... | 12/28/1982 |
| 4244679 | Swash-plate-type compressor for air-conditioning vehicles Shoes for operatively connecting a swash-plate with the compression pistons of a swash-plate type compressor are made from a novel Cu-based alloy. Improved shoes are characterized by a combination of high heat conductivity and excellent wear resistance pr... | 01/13/1981 |
| 4135923 | Extraction of metals This invention relates to the extraction of metals. More particularly, the invention is concerned with the extraction of one or more precious metals from material containing such metals. By "precious metals", both here and throughout the remainder of this... | 01/23/1979 |
