Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 7431881 | Wear-resistant alloys particularly suited to aluminum-engine head-valve seats A thermally conductive, wear-resistant alloy is particularly suited to cladding aluminum engine head valve seats. In the preferred embodiments, the alloys are metallurgically compatible with the cast Al—Si alloy used for the engine head. Three alternative embodime... | 10/07/2008 |
| 7413619 | Copper alloy Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quench... | 08/19/2008 |
| 7291231 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous net... | 11/06/2007 |
| 7238296 | Resistive composition, resistor using the same, and making method thereof When the entire amount of conductive metal mixed powder made of copper, manganese, and germanium is 100 parts by weight, the metal mixed powder is formed by mixing 4.0 to 13.0 parts manganese by weight, 0.2 to 1.4 parts germanium by weight, and 85.6 to 95.8 parts co... | 07/03/2007 |
| 6866818 | Method of using a spray formed copper-nickel-manganese alloy A method for the manufacture of tools and components for the offshore field and the mining industry, in particular, for drilling installations, using a spray formed Cu—Ni—Mn alloy of 10 to 25% Ni, 10 to 25% Mn, the remainder being copper and common impurities. D... | 03/15/2005 |
| 6811623 | Copper-nickel-manganese alloy, products made therefrom and method of manufacture of products therefrom A Cu-Ni-Mn alloy which consists of 15 to 25% Ni; 15 to 25% Mn; 0.001 to 1.0% of a chip-breaking additive (lead, carbon, etc.), the remainder being copper and common impurities. The alloy can preferably be used as a replacement material for Be-containing copper mater... | 11/02/2004 |
| 6764556 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel... | 07/20/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6605371 | Brazing alloy for stainless steel, structure braze-assembled with the brazing alloy, and brazing material for stainless steel A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in... | 08/12/2003 |
| 6531003 | Abrasion resistant copper alloy, copper alloy powder for build-up cladding, and engine cylinder head A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-... | 03/11/2003 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 6334915 | Copper alloy sheet for electronic parts A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 μm and a size of an intermeta... | 01/01/2002 |
| 6103188 | High-conductivity copper microalloys obtained by conventional continuous or semi-continuous casting We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from th... | 08/15/2000 |
| 6074604 | Brazing material for stainless steel Provided is a brazing filler metal for brazing stainless steel at low temperatures so as not to adversely affect the properties of the stainless steel, and without producing any brittleness in the brazed joint. The brazing filler metal essentially consist... | 06/13/2000 |
| 5938864 | Sliding material and surface treating method thereof A copper alloy material excellent in the resistance to corrosion caused by lubricating oils containing sulfur-based additives. The alloy comprises from over 5 to 50% Ni, 0.1-2% Ag and the balance consisting substantially of Cu, and optionally contains at ... | 08/17/1999 |
| 5911949 | Abrasion resistant copper alloy An abrasion resistant copper alloy suitable for the material of an overlaid layer formed at the valve seat of an engine cylinder head formed of aluminum alloy. The copper alloy consists essentially of nickel in an amount ranging from 10 to 30% by weight; ... | 06/15/1999 |
| 5858125 | Magnetoresistive materials A magnetoresistive material of the present invention has a structure in which many clusters are surrounded by a crystal phase of Cu and/or Ag, where each cluster has a grain size of 20 nm or less and composed of an amorphous phase containing at least one ... | 01/12/1999 |
| 5843243 | Wear-resistant copper-based alloy A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from th... | 12/01/1998 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
| 5441696 | Copper-nickel based alloy A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.... | 08/15/1995 |
| 5424030 | Copper alloy for fine pattern lead frame A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substanc... | 06/13/1995 |
| 5378294 | Copper alloys to be used as brazing filler metals The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphorus, tin and possibly small amounts of manganese. The alloys are produced by means of atomization methods. Their advantages are low liq... | 01/03/1995 |
| 5370840 | Copper alloy having high strength and high electrical conductivity There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high st... | 12/06/1994 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particula... | 08/09/1994 |
| 5334346 | Copper alloys for electrical and electronic parts This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper... | 08/02/1994 |
| 5259898 | Alloy for spectacle wire frames and electronic component parts An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristic... | 11/09/1993 |
| 5256214 | Copper alloys and method of manufacture thereof A method for the manufacture of a copper based alloy and the alloy produced thereby having improved mechanical properties. An alloy containing a dispersoid ingredient and a precipitating ingredient are spray cast so that during spray casting the dispersoi... | 10/26/1993 |
| 5215711 | Age-hardening type special Cu alloy An age-hardening type special Cu alloy prepared by compounding 0.1 to 5% by weight of Ni, 0.01 to 7% by weight of Si, 0.01 to 10% by weight of Fe, 0.01 to 7% by weight of Ti and 0.001 to 1% by weight of B in Cu as the main component. This alloy is improve... | 06/01/1993 |
| 5188799 | Wear-resistant copper-base alloy A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %, Ni: 10.0 to 30.0%; Si: 0.5 to 3%; Co: 2.0 to 15.0%; at least one metal selected from the group consisting of Mo, W, Nb and V: 2.0 to 15.0%; and the balance being Cu and unavoid... | 02/23/1993 |
| 5132083 | Laser padding material and a laser padding method using the same A laser padding material in accordance with the present invention comprises copper as its main component and at least one, as other contained elements, selected from the group consisting of 1-5 weight % of nickel (Ni), 0.2-5 weight % of silicon (Si), less... | 07/21/1992 |
| 5074933 | Copper-nickel-tin-silicon alloys having improved processability The invention provides a process for the manufacture of copper alloys having improved processability. The alloys are melted and atomized into droplets which are spray cast into a coherent deposit. The spray cast alloys are characterized by a finer dispers... | 12/24/1991 |
| 5024815 | Copper alloy with phosphorus and iron A copper alloy comprising: (A) 0.15-1.0 wt % Fe, (B) 0.05-0.3 wt % P, and (C) (1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or (2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or (3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or (4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si, with the b... | 06/18/1991 |
| 5004581 | Dispersion strengthened copper-base alloy for overlay A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, Ni: 5 to 30%; B: 0.5 to 3%; Si: 1 to 5%; Fe: 4 to 30%; Sn: 3 to 15% and/or An: 3 to 30%; and the remainder being Cu and u... | 04/02/1991 |
| 4886641 | Electrical contact spring material made of copper base alloy of high strength and toughness with reduced anisotropy in characteristics A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., t... | 12/12/1989 |
| 4873674 | Corrosion resistant bronze alloys and glass making mold made therefrom A bronze alloy composition for glass making molds that has excellent corrosion resistance and resistance to pitting, the composition comprising copper, aluminum, nickel, iron, manganese, and a critical amount of silicon to provide the resistance to pittin... | 10/10/1989 |
| 4822693 | Copper-iron-nickel composite material for electrical and electronic applications The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention ... | 04/18/1989 |
| 4818307 | Dispersion strengthened copper-base alloy Herein disclosed is a dispersion strengthened copper-base alloy having an excellent wear resistance, which alloy contains 5 to 30% (in weight) of nickel, 1 to 5% of silicon, 0.5 to 3% of boron and 4 to 30% of iron, the remainder being copper and unavoidab... | 04/04/1989 |
| 4780275 | Corrosion-resistant copper alloy and article containing the same A corrosion-resistant copper-based alloy contains 0.1-5 percent by weight of nickel; 0.01-1.5 percent by weight total of titanium and niobium; 0.2-5 percent by weight total of iron and chromium; 0.01-0.25 percent by weight total of germanium and gallium; ... | 10/25/1988 |
| 4743314 | Highly corrosive-resistant amorphous alloy of Ni-Cu-Ti with Ta and/or Nb. A highly corrosion-resistant amorphous Ni-Cu-Ti-Ta, Ni-Cu-Ti-Nb and Ni-Cu-Ti-Ta-Nb alloys in which the sum of Ti and Ta and/or Nb is 30-62.5 atomic %.... | 05/10/1988 |
| 4732602 | Bronze alloy for glass container molds This invention relates to a copper base alloy with improved toughness and weldability for use in making molds for glass containers. The alloy of the present invention contains copper, nickel and aluminum and may have intentional additions of iron for grai... | 03/22/1988 |