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| Number | Title | Issue Date |
| 7413619 | Copper alloy Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quench... | 08/19/2008 |
| 7291231 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous net... | 11/06/2007 |
| 7225856 | Precipitation-hardenable alloy core rod, plunger tip having a uniform side wall thickness, and method of forming same A core rod is utilized in the process of forming a core in a metal casting. The core rod has a length and opposite ends The core rod is generally round in cross-section along at least a portion of the length of the core rod proximate at least one of the ends configu... | 06/05/2007 |
| 7214644 | Cross-coupling reactions A method for producing a copper/palladium colloid catalyst useful for Suzuki couplings. ... | 05/08/2007 |
| 7182823 | Copper alloy containing cobalt, nickel and silicon A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities.... | 02/27/2007 |
| 7180176 | Radiation plate and power semiconductor module IC package Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to h... | 02/20/2007 |
| 7172662 | Copper alloy material for parts of electronic and electric machinery and tools A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of ... | 02/06/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7090732 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 08/15/2006 |
| 7045906 | Resin-encapsulated package, lead member for the same and method of fabricating the lead member A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package... | 05/16/2006 |
| 6764556 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel... | 07/20/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6605371 | Brazing alloy for stainless steel, structure braze-assembled with the brazing alloy, and brazing material for stainless steel A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in... | 08/12/2003 |
| 6475635 | Sliding material made of copper alloy, method of producing same, and sliding bearing A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy ph... | 11/05/2002 |
| 6428635 | Substrates for superconductors An alloy capable of forming a (100) [001] cube-texture by thermo-mechanical techniques has 5 to 45 atomic percent nickel with the balance being copper. The alloy is useful as a conductive substrate for superconducting composites where the substrate is coa... | 08/06/2002 |
| 6413649 | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 an... | 07/02/2002 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 6334915 | Copper alloy sheet for electronic parts A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 μm and a size of an intermeta... | 01/01/2002 |
| 6103188 | High-conductivity copper microalloys obtained by conventional continuous or semi-continuous casting We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from th... | 08/15/2000 |
| 6083328 | Casting rolls made of hardenable copper alloy A hardenable copper alloy, suitable as a material for manufacturing casting rolls and casting wheels that are subjected to changing temperature stresses, is disclosed. The hardenable copper alloy comprises 1.0 to 2.6% nickel, 0.1 to 0.45% beryllium, and t... | 07/04/2000 |
| 6001196 | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the... | 12/14/1999 |
| 5955176 | Integrated suspension using a high strength conductive material A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a suppo... | 09/21/1999 |
| 5938864 | Sliding material and surface treating method thereof A copper alloy material excellent in the resistance to corrosion caused by lubricating oils containing sulfur-based additives. The alloy comprises from over 5 to 50% Ni, 0.1-2% Ag and the balance consisting substantially of Cu, and optionally contains at ... | 08/17/1999 |
| 5935719 | Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes A leadframe and method of fabrication of the leadframe. A leadframe is formed from one of copper or copper-based material and a coating of palladium is formed over the leadframe. Optionally, a layer of from about 10 to about 95 percent copper by weight an... | 08/10/1999 |
| 5858125 | Magnetoresistive materials A magnetoresistive material of the present invention has a structure in which many clusters are surrounded by a crystal phase of Cu and/or Ag, where each cluster has a grain size of 20 nm or less and composed of an amorphous phase containing at least one ... | 01/12/1999 |
| 5846483 | Selenized dairy Se-Ni-Sn-Zn-Cu metal Selenium bearing copper-nickel, corrosion resistant and gall resistant castable alloy, particularly for food processing machine parts, with the following weight percentage range: Ni=10-40 Zn=2-6 Sn=2-7 Se=1-4 Bi=0-3 Fe=0-3 P=0-0.2 Cu=Balance... | 12/08/1998 |
| 5675883 | Method of manufacturing a copper-nickel-silicon alloy casing The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The metho... | 10/14/1997 |
| 5658401 | Copper-zinc alloy A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2%... | 08/19/1997 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
| 5507885 | Copper-based alloy A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous soluti... | 04/16/1996 |
| 5441696 | Copper-nickel based alloy A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.... | 08/15/1995 |
| 5437745 | High copper alloy composition for a thermocouple extension cable An alloy composition used in the manufacture of extension cables, comprises by weight 25.00% to 35.00% of nickel, 0.10% to 1.00% of manganese, 0.10% to 1.75% of cobalt, less than 0.25% of iron, and the balance being of copper. A thermoelement, of a thermo... | 08/01/1995 |
| 5387293 | Copper base alloys and terminals using the same A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm2, a spring limit of at least 40 kgf/mm2, a stress relaxation of not more than 10% and a conduct... | 02/07/1995 |
| 5370840 | Copper alloy having high strength and high electrical conductivity There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high st... | 12/06/1994 |
| 5346668 | Copper based alloy for wear resistant sliding layer and sliding member A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with ... | 09/13/1994 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particula... | 08/09/1994 |
| 5334346 | Copper alloys for electrical and electronic parts This invention relates to a high performance copper alloy and its manufacturing methods for electrical and electronic parts which have good electrical conductivity, superior mechanical properties, and high thermal stability of tin-lead plating. The copper... | 08/02/1994 |
| 5288457 | Copper-nickel-tin alloy for slide bearings A slide bearing comprising a copper-nickel-tin alloy consisting essentially of ______________________________________ 4-8% by wt nickel, 4-8% by wt tin, 0.005-1.0 by wt zinc, 0.005-0.5 by wt iron, 0.00... | 02/22/1994 |
| 5286444 | Copper bearing alloy Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue... | 02/15/1994 |
| 5259898 | Alloy for spectacle wire frames and electronic component parts An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristic... | 11/09/1993 |
