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| Number | Title | Issue Date |
| 7354489 | Lead-free copper alloy and a method of manufacture A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2... | 04/08/2008 |
| 7291232 | Process for high strength, high conductivity copper alloy of Cu-Ni-Si group A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 w... | 11/06/2007 |
| 7182823 | Copper alloy containing cobalt, nickel and silicon A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities.... | 02/27/2007 |
| 7172662 | Copper alloy material for parts of electronic and electric machinery and tools A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of ... | 02/06/2007 |
| 7090732 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 08/15/2006 |
| 7056396 | Copper/zinc alloys having low levels of lead and good machinability The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 per... | 06/06/2006 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6632300 | Copper alloy having improved stress relaxation resistance A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoida... | 10/14/2003 |
| 6558617 | Copper alloy for use in electric and electronic parts A copper alloy of high strength and high electroconductivity which is excellent in characteristics such as strength, electroconductivity and bending formability required as copper alloys for use in electric and electronic parts such as lead frames, termin... | 05/06/2003 |
| 6432556 | Copper alloy with a golden visual appearance There is provided a copper-base alloy useful for coinage that has a golden visual appearance. The material has a transverse electrical conductivity substantially similar to that of copper alloy C713 and when clad to a copper alloy C110 core, a transverse ... | 08/13/2002 |
| 6413330 | Lead-free free-cutting copper alloys A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.... | 07/02/2002 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 6210636 | Cu-Ni-Zn-Pd alloys A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, ... | 04/03/2001 |
| 6103188 | High-conductivity copper microalloys obtained by conventional continuous or semi-continuous casting We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from th... | 08/15/2000 |
| 5942056 | Plumbing fixtures and fittings employing copper-bismuth casting alloys A plumbing fixture or fitting fabricated from a bismuth and mischmetal containing copper alloy.... | 08/24/1999 |
| 5885376 | Corrosion-resistant high-strength copper based alloy having excellent blankability A copper based alloy consists essentially, by weight %, of 15 to 35% Zn, 7 to 14% Ni, 0.1 to 2% or less Mn, 0.01 to 0.5% Fe, 0.0005 to 0.1% P, at least one or two elements selected from the group consisting of 0.001 to 0.9% Si, 0.0003 to 0.02% Pb, and 0.0... | 03/23/1999 |
| 5846483 | Selenized dairy Se-Ni-Sn-Zn-Cu metal Selenium bearing copper-nickel, corrosion resistant and gall resistant castable alloy, particularly for food processing machine parts, with the following weight percentage range: Ni=10-40 Zn=2-6 Sn=2-7 Se=1-4 Bi=0-3 Fe=0-3 P=0-0.2 Cu=Balance... | 12/08/1998 |
| 5833920 | Copper alloy for electronic parts, lead-frame, semiconductor device and connector The present invention provides a copper alloy for electronic part which is excellent in adhesion of silver(Ag) and reliability of solderability and adhesion of plating without impairing excellent strength and electrical conductivity of a copper-nickel-sil... | 11/10/1998 |
| 5658401 | Copper-zinc alloy A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2%... | 08/19/1997 |
| 5507885 | Copper-based alloy A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous soluti... | 04/16/1996 |
| 5441696 | Copper-nickel based alloy A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.... | 08/15/1995 |
| 5424030 | Copper alloy for fine pattern lead frame A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substanc... | 06/13/1995 |
| 5288683 | Wear-resistant copper alloys and synchronizer rings for automobiles comprising the same A wear-resistant copper alloy which consists essentially of 56 to 65 wt. % of Cu, 28 to 32 wt. % of Zn, 3.5 to 5.5 wt. % of Al, 0.5 to 2.0 wt. % of Fe, 1.0 to 3.0 wt. % of Ni, 0.1 to 1.0 wt. % of Nb, and 0.4 to 1.5 wt. % of Ti, provided that Ti+Nb is equa... | 02/22/1994 |
| 5286444 | Copper bearing alloy Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue... | 02/15/1994 |
| 5259898 | Alloy for spectacle wire frames and electronic component parts An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristic... | 11/09/1993 |
| 5246509 | Copper base alloy superior in resistances to seizure, wear and corrosion suitable for use as material of sliding member A copper base alloy suitable for use as a material of a sliding member, superior in seizure resistance, wear resistance and corrosion resistance. The alloy comprises 1.0 to 3.5 wt % Mn, 0.3 to 1.5 wt % Si, 11.5 to 25 wt % Zn, 5 to 18 wt % Pb and the balan... | 09/21/1993 |
| 5242657 | Lead-free corrosion resistant copper-nickel alloy Lead-free copper-nickel corrosion resistant, low friction, castable alloy, particularly for food processing machine parts, with the following weight percent range Ni=15-45 Zn=2-6 Tin=2-7 Bi=1-6 Fe=0-3 Mn=0-3 Cu=balance and food processing machine parts made th... | 09/07/1993 |
| 5064611 | Process for producing copper alloy An improved method for producing a copper alloy, wherein a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, and a remainder of Cu and unavoidable impurities (or a molten metal cons... | 11/12/1991 |
| 5045411 | Alloy compositions A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved col... | 09/03/1991 |
| 5024814 | Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ... | 06/18/1991 |
| 5019335 | Gold colored metal alloy The present invention provides an improved casting alloy for use in costume jewelry and jewelry samples. In accordance with the present invention, a gold colored metal alloy is disclosed which is tarnish resistant and consists of the following ingredients... | 05/28/1991 |
| 5004581 | Dispersion strengthened copper-base alloy for overlay A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, Ni: 5 to 30%; B: 0.5 to 3%; Si: 1 to 5%; Fe: 4 to 30%; Sn: 3 to 15% and/or An: 3 to 30%; and the remainder being Cu and u... | 04/02/1991 |
| 4990820 | Corrosion resistant sockets for electric lamps Sockets for receiving metal lamp bases of electric lamps which contain metal parts fabricated from certain relatively high copper and low zinc content copper alloys are resistant to corrosion and to corrosion cracking in corrosive environments.... | 02/05/1991 |
| 4971758 | Copper-based alloy connector for electrical devices A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to... | 11/20/1990 |
| 4950451 | Copper alloy for an electronic device and method of preparing the same A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg. A wire ... | 08/21/1990 |
| 4914345 | Corrosion resistant base for electric lamps Metal lamp bases for electric lamps fabricated from certain relatively high copper and low zinc content copper alloys and lamps employing same are resistant to cracking in corrosive environments.... | 04/03/1990 |
| 4886641 | Electrical contact spring material made of copper base alloy of high strength and toughness with reduced anisotropy in characteristics A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., t... | 12/12/1989 |
| 4687633 | Lead material for ceramic package IC A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the c... | 08/18/1987 |
| 4674566 | Corrosion resistant modified Cu-Zn alloy for heat exchanger tubes The present invention relates to a heat exchanger assembly having a plurality of heat exchange fluid passageways formed from a modified copper-zinc alloy. The copper-zinc alloy contains from about 21% to about 39% zinc, from about 1% to about 5% nickel, f... | 06/23/1987 |
| 4659378 | Solderable adhesive layer Electrical contacts to or mechanical connections between components and provided by using a thin layer of an alloy consisting of metals and metalloids. Such a layer shows excellent adhesion to glass or semiconductor substrates.... | 04/21/1987 |
