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| Number | Title | Issue Date |
| 8145046 | Heat treatment apparatus and method for heating substrate by light irradiation In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given ... | 03/27/2012 |
| 8107800 | Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent ... | 01/31/2012 |
| 8107801 | Heat treatment apparatus, computer program, and storage medium A heat treatment apparatus for performing prescribed heat treatment to a subject (W) to be treated is provided with a processing chamber in which air can be exhausted; a mounting table arranged in the processing chamber, for placing on an upper plane the subject to ... | 01/31/2012 |
| 8055125 | Substrate stage mechanism and substrate processing apparatus A substrate stage mechanism (10) configured to place a substrate (W) thereon inside a process container of a substrate processing apparatus (100) and having a substrate heating function for heating the substrate (W) includes a substrate table (11 | 11/08/2011 |
| 8050546 | Heat treatment apparatus heating substrate by irradiation with light A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from... | 11/01/2011 |
| 8041198 | Heat treatment apparatus and method for heating substrate by photo-irradiation In photo-irradiation heating with a total photo-irradiation time of one second or less, after initial photo-irradiation of a semiconductor wafer is performed while increasing an emission output to a target value, succeeding photo-irradiation of the semiconductor waf... | 10/18/2011 |
| 8041197 | Heating apparatus, heat treatment apparatus, computer program and storage medium A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow su... | 10/18/2011 |
| 7778533 | Semiconductor thermal process control During fabrication, a rotating semiconductor substrate is radiated in accordance with a thermal recipe. Temperature measurements of the semiconductor substrate are obtained along with the position of the semiconductor substrate at the time of each temperature measur... | 08/17/2010 |
| 7764872 | Cooling device, and apparatus and method for manufacturing image display panel using cooling device The present invention provides a cooling device used for a process for heating and cooling a substrate constituting an image display apparatus that uses electron emitting devices. The cooling device includes a cooling plate located opposite the substrate to absorb r... | 07/27/2010 |
| 7522823 | Thermal processing apparatus, thermal processing method, and substrate processing apparatus In a thermal processing unit, a substrate is held by a local transport hand to be transported between a transfer section and a heating unit, and subjected to a heat processing by the heating unit. Also, the local transport hand is cooled by a cooling plate in the tr... | 04/21/2009 |
| 7432475 | Vertical heat treatment device and method controlling the same A vertical heat processing apparatus includes a process chamber (5) defining a process field (A1) configured to accommodate a plurality of target substrates (W) supported at intervals in a vertical direction. The apparatus further includes a heating fu... | 10/07/2008 |
| 7429718 | Heating and cooling of substrate support A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the... | 09/30/2008 |
| 7429717 | Multizone heater for furnace The present invention relates to an apparatus and method for heating a semiconductor processing chamber. One embodiment of the present invention provides a furnace for heating a semiconductor processing chamber. The furnace comprises a heater surrounding side walls ... | 09/30/2008 |
| 7404670 | Analytical furnace with predictive temperature control An analytical furnace includes a predictive temperature control which is trained to model crucible temperature during analysis by employing a pair of temperature sensors, with one sensor being mounted in the furnace in fixed relationship and a second sensor which ca... | 07/29/2008 |
| 7402778 | Oven for controlled heating of compounds at varying temperatures An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assem... | 07/22/2008 |
| 7398014 | Enhanced rapid thermal processing apparatus and method A heating arrangement heats a first major surface of a workpiece with an illumination energy such that a first portion of the illumination energy is directly incident upon the first major surface of the workpiece and a second portion of the illumination energy is di... | 07/08/2008 |
| 7393797 | Method for thermal processing a semiconductor wafer A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamb... | 07/01/2008 |
| 7389903 | Device and method for soldering contacts on semiconductor chips A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, h... | 06/24/2008 |
| 7381928 | Thermal processing apparatus and thermal processing method A light source including a plurality of flash lamps emits flashes thereby flash-heating a semiconductor wafer held by a thermal diffuser and a hot plate. The current distance of irradiation between the thermal diffuser and the hot plate holding the semiconductor waf... | 06/03/2008 |
| 7378618 | Rapid conductive cooling using a secondary process plane A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to pro... | 05/27/2008 |
| 7371997 | Thermal processing apparatus and thermal processing method In a thermal processing apparatus, using a lamp for heating a substrate, an opening is formed for a camera unit, which is used to image portions of an auxiliary ring supporting the substrate, to obtain the position of the center of the auxiliary ring. The camera fur... | 05/13/2008 |
| 7371998 | Thermal wafer processor A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holdi... | 05/13/2008 |
| 7368303 | Method for temperature control in a rapid thermal processing system A method is disclosed for a multi-zone interference correction processing for a rapid thermal processing (RTP) system. This processing allows for improved calibration/tuning of RTP systems by accounting for zone coupling. The disclosed method includes establishing b... | 05/06/2008 |
| 7368018 | Chemical vapor deposition apparatus A chemical vapor deposition apparatus is provided. The chemical vapor deposition apparatus includes a susceptor support base and a susceptor, and configured to rotate the susceptor with a rotary shaft, a gap as wide as about 1 mm or more is provided along the bounda... | 05/06/2008 |
| 7358462 | Apparatus and method for reducing stray light in substrate processing chambers A method and apparatus for heating semiconductor wafers in thermal processing chambers is disclosed. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the ... | 04/15/2008 |
| 7357811 | Integrated procedure light for infant care apparatus An infant warming apparatus for supporting an infant upon an infant platform. The apparatus has a procedure light that is recessed into the normal horizontal overhead housing of the apparatus and thus integrated into the infant apparatus. The procedure light is conv... | 04/15/2008 |
| 7351936 | Method and apparatus for preventing baking chamber exhaust line clog A method and apparatus involve providing a supply of nitrogen gas, heating the supply of nitrogen gas to a temperature, and ejecting the heated nitrogen gas through the exhaust line of the baking chamber on a periodic basis. The temperature is between a temperature ... | 04/01/2008 |
| 7347900 | Chemical vapor deposition apparatus and method A chemical vapor deposition (CVD) apparatus includes a process chamber where a deposition process is performed on a wafer. A gas supply assembly is mounted in the process chamber for supplying a process gas to the process chamber, and a vacuum pump is mounted in the... | 03/25/2008 |
| 7346273 | Substrate processing equipment It is an object of the invention to provide a substrate processing equipment that can predict a temperature of a substrate and easily control temperature of the substrate. Formed in a reactor (processing chamber) 3 are four temperature adjustment zones, of wh... | 03/18/2008 |
| 7335267 | Heat treating apparatus having rotatable heating unit An apparatus includes a stationary supporting base for mounting a semiconductor wafer thereon, and a rotatable heating unit having a plurality of heating lamps located above the wafer. The stationary supporting base is fixed and the rotatable heating unit rotates ho... | 02/26/2008 |
| 7335858 | Toaster using infrared heating for reduced toasting time A toaster uses radiant heat at infrared wavelengths optimized for producing rapid and uniform toasting of a food product. The infrared wavelengths of the radiated heat are selected for optimum speed and quality (browning and moisture content) of the food product. Th... | 02/26/2008 |
| 7332691 | Cooling plate, bake unit, and substrate treating apparatus A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the c... | 02/19/2008 |
| 7324745 | Seat trim heater The device is a seat trim heater. It employs electric infrared lamps to heat the seat trim before the trim is placed over the frame and cushion material of the seat. The device consists of a basic frame on which the trim is placed. The frame is made from a series of... | 01/29/2008 |
| 7321722 | Method for thermal processing a semiconductor wafer A method for thermal processing a semiconductor wafer is disclosed. A rapid thermal processing (RTP) chamber encompasses a heating means, a rotation means, and a cooling system for cooling walls of said RTP chamber. A semiconductor wafer is loaded into the RTP chamb... | 01/22/2008 |
| 7316893 | Modular containment cell arrangements Modular containment cell arrangements, including modular containment cells to contain an item and at least one processing material associated with processing of the item. ... | 01/08/2008 |
| 7317172 | Bake system Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled ... | 01/08/2008 |
| 7311779 | Heating apparatus to heat wafers using water and plate with turbolators Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate sup... | 12/25/2007 |
| 7311520 | Heat treatment apparatus The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a reaction tube consisting of a single tube contained in the heating-furnace body; a gas-discharging-unit connecting portion formed at an upper porti... | 12/25/2007 |
| 7312422 | Semiconductor batch heating assembly A heat treatment apparatus for use in batch heating/wafer processing is provided, which comprises a process chamber for receiving a wafer boat, at least a heating element comprising a substrate body configured to form an electrical heating circuit for at least one h... | 12/25/2007 |
| 7282096 | Arrangement comprising a support body and a substrate holder which is driven in rotation and gas-supported thereon The invention relates to an arrangement comprising a support body with a substrate holder, mounted thereon on a gas bearing with rotating drive. The gas bearing and the rotating drive are formed by gas flowing in through nozzles arranged in the separating gaps betwe... | 10/16/2007 |
