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| Number | Title | Issue Date |
| 8174844 | Wired circuit board and connection structure between wired circuit boards A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electric... | 05/08/2012 |
| 8169792 | Multilayer printed wiring board A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed on the build-up layer; lands that are disposed on an upper surface of... | 05/01/2012 |
| 8130513 | Radio-frequency package A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor ... | 03/06/2012 |
| 8050050 | Wiring board, semiconductor device, and method of manufacturing the same A semiconductor device comprising a flat wiring board, a first LSI disposed on one surface of the wiring board, a sealing resin for covering the one surface and a side face of the first semiconductor element, and a second LSI disposed on another surface of the wirin... | 11/01/2011 |
| 8035984 | Substrate structures and methods for electronic circuits Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit ... | 10/11/2011 |
| 7929316 | Composite electronic component A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and includin... | 04/19/2011 |
| 7889514 | Wiring board, semiconductor device, and method of manufacturing the same A semiconductor device comprising a flat wiring board, a first LSI disposed on one surface of the wiring board, a sealing resin for covering the one surface and a side face of the first semiconductor element, and a second LSI disposed on another surface of the wirin... | 02/15/2011 |
| 7885083 | Input transient protection for electronic devices A circuit board assembly which includes an electrically insulating layer, a conductive printed wiring layer formed on the surface of the electrically insulating layer and includes a plurality of conductive paths, a conductive trace on the electrically insulating lay... | 02/08/2011 |
| 7881071 | Multilayer printed wiring board A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed on the build-up layer; lands that are disposed on an upper surface of... | 02/01/2011 |
| 7872876 | Multi-layered printed circuit board A printed circuit board (PCB) has a multi-layered substrate including a plurality of signal lines and a ground voltage plate disposed below the signal lines and by which a common ground voltage is applied to the signal lines, a heat sink disposed on the multi-layere... | 01/18/2011 |
| 7843703 | Multilayer printed circuit board According to one embodiment, a multilayer printed circuit board having a plurality of wiring layers and an electronic component mounted thereon, includes a spiral wire including a path in a substantial spiral shape configured with a printed wire section of a substan... | 11/30/2010 |
| 7821796 | Reference plane voids with strip segment for improving transmission line integrity over vias Reference plane voids with a strip segment for improving transmission line integrity over vias permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or be... | 10/26/2010 |
| 7800917 | Printed wiring board A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cu... | 09/21/2010 |
| 7751202 | Multi-layered printed circuit board having integrated circuit embedded therein Disclosed is a multi-layered printed circuit board including a plurality of insulation layers; a plurality of conductive patterns stacked on the multi-layered printed circuit board while alternating with the insulation layers; an integrated circuit positioned inside... | 07/06/2010 |
| 7733665 | Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same A multi-layer substrate connecting to an external electric device includes: a plurality of resin films; and a plurality of conductive patterns. The resin films are stacked together with the conductive patterns. The conductive pattern includes an inner conductive pat... | 06/08/2010 |
| 7701726 | Method of manufacturing a wiring substrate and semiconductor device A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface... | 04/20/2010 |
| 7684207 | Composite electronic component A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and includin... | 03/23/2010 |
| 7649749 | Wiring substrate, semiconductor device, and method of manufacturing the same A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via formed in the base insulating film, and a second interconnection provided on a bottom surface side... | 01/19/2010 |
| 7489521 | Multilayer printed wiring board A multilayer printed wiring board (10) includes: a build-up layer (30) that is formed on a core substrate (20) and has a conductor pattern (32) disposed on an upper surface; a low elastic modulus layer (40) that is formed on the bu... | 02/10/2009 |
| 7435910 | Multilayer printed circuit board A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to th... | 10/14/2008 |
| 7428155 | Printed wiring board including power supply layer and ground layer A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interp... | 09/23/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7405473 | Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk o... | 07/29/2008 |
| 7402760 | Multi-layer printed wiring board and manufacturing method thereof A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is ... | 07/22/2008 |
| 7391622 | Composite structural member having an integrated electrical circuit A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an ... | 06/24/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7382629 | Circuit substrate and method of manufacturing plated through slot thereon A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of... | 06/03/2008 |
| 7378597 | Multilayer printed circuit board A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to th... | 05/27/2008 |
| 7378601 | Signal transmission structure and circuit substrate thereof A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall ... | 05/27/2008 |
| 7375286 | Printed circuit board and manufacturing method thereof A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the ... | 05/20/2008 |
| 7375290 | Printed circuit board via with radio frequency absorber A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through... | 05/20/2008 |
| 7375288 | Apparatuses and methods for improving ball-grid-array solder joint reliability In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and incl... | 05/20/2008 |
| 7367819 | Board mounted terminal construction A terminal has a plurality of split solder portions inserted into through-holes in a printed circuit board. A first split solder portion has a cross-sectional shape such that four corners thereof contact an inner circumferential surface of the through hole for posit... | 05/06/2008 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 04/29/2008 |
| 7361843 | AC coupling of power plane sections using improved capacitance stitching material An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil layer of the printed circuit board to components on the printed circui... | 04/22/2008 |
| 7355863 | High frequency multilayer integrated circuit A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circ... | 04/08/2008 |
| 7350292 | Method for affecting impedance of an electrical apparatus A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an electrical circuit loop including at least one of at least one trace ... | 04/01/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7348493 | Metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres... | 03/25/2008 |
