Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 8174843 | Printed circuit board A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power ... | 05/08/2012 |
| 8164920 | Printed wiring board A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently pro... | 04/24/2012 |
| 8144482 | Circuit board device, wiring board interconnection method, and circuit board module device A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged... | 03/27/2012 |
| 8125794 | Multilayer printed wiring board and electronic device using the same The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the ... | 02/28/2012 |
| 8120927 | Printed circuit board A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes... | 02/21/2012 |
| 8072774 | Substrate including wiring for transmitting signal, apparatus and system including the substrate An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire for transmitting one of the signals, the first wire being formed on a f... | 12/06/2011 |
| 8072775 | Printed circuit board A printed circuit board includes a signal layer and a voltage source layer. The signal layer includes a connecting area. The voltage source layer includes an isolation area corresponding to the connecting area. The isolation area is used for preventing interference ... | 12/06/2011 |
| 8027171 | Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck Provided is a power feeding structure of an electrostatic chuck including a lower insulation layer, an electrode layer and a surface insulation dielectric layer formed on an upper surface side of a metal substrate in order from the metal substrate, in which the lowe... | 09/27/2011 |
| 8009439 | Metal foil interconnection of electrical devices An electrical assembly (300, 400) includes a power IC such as a MOSFET (112, 412) attached to a substrate module (114, 214). The MOSFET includes a top surface comprising first and second conductive device surfaces (A, B), associated with first a... | 08/30/2011 |
| 7773390 | Power distribution system for integrated circuits A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does n... | 08/10/2010 |
| 7742315 | Circuit on a printed circuit board The present invention relates to computer hardware design, and in particular to a printed circuit board (card) comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In particular a... | 06/22/2010 |
| RE41242 | Package substrate According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in diameter), so the metallic portion occupied by the soldering pads on the sur... | 04/20/2010 |
| 7684206 | Electronic circuit module including chip mounted to multi-layer wiring plate in flip chip manner The invention provides an electronic circuit module capable of reliably mounting a chip to a multi-layer wiring plate in a flip chip manner. In an electronic circuit module according to an embodiment of the invention, a chip including bumps with a height of d... | 03/23/2010 |
| 7663894 | Multilayer printed wiring board Provided is a multilayer printed wiring board in which power supply patterns are shortened to decrease an impedance and electromagnetic radiation noise. The multilayer printed wiring board includes: a power supply layer (1) having at least two power supply pa... | 02/16/2010 |
| 7652896 | Component for impedance matching A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric... | 01/26/2010 |
| RE41051 | Package substrate According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 μm in diameter), so the metallic portion occupied by the soldering pads on the sur... | 12/22/2009 |
| 7573725 | Optimizing power delivery and signal routing in printed circuit board design A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a printed circuit board having two or more cores coupled together usin... | 08/11/2009 |
| 7564695 | Circuit connection structure and printed circuit board While gradually increasing the widths of signal lines (104a, 104b, 105a, 105b) of first and second groups of differential signal lines (104, 105) to suppress attenuation in the lines, the opening widths ... | 07/21/2009 |
| 7532485 | Multilayer module and method of manufacturing the same A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the ... | 05/12/2009 |
| 7529103 | Multi-layered printed circuit board embedded with filter A multi-layered printed circuit board embedded with a filter, the multi-layered printed circuit board using a composite multi-layered printed circuit board formed of at least a high dielectric material stacked with at least a low dielectric material. A plurality of ... | 05/05/2009 |
| 7518884 | Tailoring impedances of conductive traces in a circuit board An apparatus and method that permits signal traces of different widths and the same impedance to be placed on the same layer of a printed circuit board (PCB). Alternatively, signal traces of different impedances but the same width may be placed on the same layer of ... | 04/14/2009 |
| 7515436 | Communication unit In a communication unit 100, a ground layer section 101 which is a sheet-like conductive material and a power-source layer section 102 which is a sheet-like conductive material are laid out in such a way that their one sides face each other, a v... | 04/07/2009 |
| 7495930 | Circuit board structure for high density processing of analog and digital signals A circuit board which has a high speed digital circuit in close proximity to a sensitive analog structure has a grounded, conductive band interposed between them and a ground plane with two separate, grounded portions, with a first of the portions underlying the dig... | 02/24/2009 |
| 7443693 | Electromagnetic interference shielding for a printed circuit board The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The n... | 10/28/2008 |
| 7440291 | Method of reducing noise induced from reference plane currents A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path ... | 10/21/2008 |
| 7428155 | Printed wiring board including power supply layer and ground layer A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interp... | 09/23/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7417197 | Direct contact power transfer pad and method of making same A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a... | 08/26/2008 |
| 7417872 | Circuit board with trace configuration for high-speed digital differential signaling Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set... | 08/26/2008 |
| 7411283 | Interconnect design for reducing radiated emissions An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a hig... | 08/12/2008 |
| 7408423 | Semiconductor device and adjusting method for semiconductor device An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and power source noises inside the semiconductor device can be cut. The o... | 08/05/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7405919 | Electronic circuit having transmission line type noise filter A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal output terminal and two ground terminals corresponding respectively t... | 07/29/2008 |
| 7405473 | Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk o... | 07/29/2008 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic ... | 07/29/2008 |
| 7394027 | Multi-layer printed circuit board comprising a through connection for high frequency applications A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through... | 07/01/2008 |
| 7391620 | System for improving power distribution current measurement on printed circuit boards A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected a... | 06/24/2008 |
| 7391622 | Composite structural member having an integrated electrical circuit A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an ... | 06/24/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7382629 | Circuit substrate and method of manufacturing plated through slot thereon A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of... | 06/03/2008 |
