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| Number | Title | Issue Date |
| 8149588 | Circular electronic apparatus The present invention provides a circular electronic apparatus. The circular electronic apparatus includes a circular crust and a plurality of isosceles trapezoid circuit boards. The isosceles trapezoid circuit boards are put together to form an equilateral polygon.... | 04/03/2012 |
| 8125793 | Electric circuitry arrangement An electric circuitry for a portable electronic device is presented. The electric circuitry includes a first printed circuit board comprising at least one electrical component attached to and extending from a surface of the first printed circuit board. The electric ... | 02/28/2012 |
| 8107255 | Circuit device and method of manufacturing the same Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit ... | 01/31/2012 |
| 8063594 | Motor drive apparatus A motor drive apparatus includes an assembly of first and second subassemblies. The first subassembly includes a first board and at least one connecting member, such as a bus bar, formed in the first board, and arranged to form a current supply path from a power sou... | 11/22/2011 |
| 8045336 | Storage device backplane and identification circuit A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first b... | 10/25/2011 |
| 8040685 | Stacked wiring board and method of manufacturing stacked wiring board A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the s... | 10/18/2011 |
| 8035983 | Wiring board and method of manufacturing wiring board A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the seco... | 10/11/2011 |
| 8004856 | Solder and lead-free electronic circuit and method of manufacturing same An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that c... | 08/23/2011 |
| 7986532 | Split thin film capacitor for multiple voltages An apparatus includes a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits. Such capacitor may be useful in space restricted applications, and in applications that require very... | 07/26/2011 |
| 7924574 | High-frequency circuit components High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency ci... | 04/12/2011 |
| 7907420 | Bare chip mounted structure and mounting method A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a ... | 03/15/2011 |
| 7839654 | Method for ultimate noise isolation in high-speed digital systems on packages and printed circuit boards (PCBS) Improved noise isolation for high-speed digital systems on packages and printed circuit boards is provided by the use of mixed alternating impedance electromagnetic bandgap (AI-EBG) structures and a power island configured to provide ultimate noise isolation. A powe... | 11/23/2010 |
| 7835160 | Electronic circuit connection structure and its manufacturing method First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, a... | 11/16/2010 |
| 7791898 | Security apparatus A method and device for data security including a printed circuit board and an integrated circuit each having a conductive trace layer shielded by a electrical shield layer. Tampering with either side of the device causes disturbance of a current flowing through a c... | 09/07/2010 |
| 7706149 | Micro-electro-mechanical-system package and method for manufacturing the same A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic ... | 04/27/2010 |
| 7656680 | Receiving apparatus and board installation member A receiving apparatus according to the present invention comprises: a first board including a mount surface whose outer edge is substantially quadrilateral; and a board installation member including a plate portion that has an installation surface whose outer edge i... | 02/02/2010 |
| 7586756 | Split thin film capacitor for multiple voltages An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require v... | 09/08/2009 |
| 7583513 | Apparatus for providing an integrated printed circuit board registration coupon A device includes a plane metallization layer, and a plane plated through hole attached to the plane metallization layer and terminating at the at a major exterior surface with a plurality of component mounting pads. The plated through hole is attached to the plane ... | 09/01/2009 |
| 7539025 | Method of reducing electromagnetic interference and circuit connection device using the same A device and a method of reducing electromagnetic interference resulting from a harmonic wave produced by a signal transmitted through a harness. The method includes winding a conductive wire at least once around the harness, and grounding at least one end of the co... | 05/26/2009 |
| 7525816 | Wiring board and wiring board connecting apparatus The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the f... | 04/28/2009 |
| 7508681 | Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plur... | 03/24/2009 |
| 7492605 | Power plane to reduce voltage difference between connector power pins A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin receptacle and the first connector power pin receptacle is substantiall... | 02/17/2009 |
| 7463493 | Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB A module for transferring a PCB including a first transfer body that is translatable along a first moving path to transfer a first PCB and a second transfer body that is translatable along a second moving path to transfer a second PCB with the second transfer body b... | 12/09/2008 |
| 7450398 | Printed circuit board An improved printed circuit board (PCB) includes first and second substrates, which are disposed being distanced or spaced mutually and in which at least one or more semiconductor chips are mounted, and a signal transmission part for providing a signal transmission ... | 11/11/2008 |
| 7438560 | Printed wiring board and electronic equipment A printed wiring board, comprising a signal plane having a baseband block for processing a baseband signal and a high-frequency block for processing a high-frequency signal which is obtained by converting the baseband signal, and a ground plane opposing to the signa... | 10/21/2008 |
| 7440291 | Method of reducing noise induced from reference plane currents A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path ... | 10/21/2008 |
| 7427718 | Ground plane having opening and conductive bridge traversing the opening Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings defined in the ground plane, such as, for example, conjoined via openi... | 09/23/2008 |
| 7428155 | Printed wiring board including power supply layer and ground layer A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interp... | 09/23/2008 |
| 7423222 | Circuit board and method of manufacturing the same A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component... | 09/09/2008 |
| 7420126 | Circuit board and circuit apparatus using the same A circuit board and a circuit apparatus using the same are provided, which have an improved heat radiation capability near through holes piercing through its metal substrate so as to address a requirement as to heat radiation capability. The circuit apparatus has th... | 09/02/2008 |
| 7420131 | Wiring substrate A wiring substrate, in which a wiring stacked portion including a conductor layer and a resin layer is stacked on a principal face of a core substrate including a substantially cylindrical through hole conductor in a through hole extending therethrough and a filling... | 09/02/2008 |
| 7420130 | Wiring board and method for fabricating the same The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, ... | 09/02/2008 |
| 7417872 | Circuit board with trace configuration for high-speed digital differential signaling Trace configurations for carrying high-speed digital differential signals provide for reduced conduction loss and improved signal integrity. In one embodiment, a circuit board has a first set of conductive traces disposed on non-conductive material, and a second set... | 08/26/2008 |
| 7417871 | Memory module The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surfac... | 08/26/2008 |
| 7417861 | Vehicular power converter To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The vehicular power converter includes a power circuit section provided with a sw... | 08/26/2008 |
| 7411283 | Interconnect design for reducing radiated emissions An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a hig... | 08/12/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7408786 | Electrical connector and system for a component in an electronic device The invention provides a printed circuit board (PCB) for use in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting... | 08/05/2008 |
| 7405948 | Circuit board device and method of interconnecting wiring boards A circuit board device comprises a first wiring board (79) having plural first electrode terminals (73, 75, 77) for connection row-arranged on a surface layer, a second wiring board (87) having plural second electrode terminals (81, 83, 85 | 07/29/2008 |
| 7405919 | Electronic circuit having transmission line type noise filter A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal output terminal and two ground terminals corresponding respectively t... | 07/29/2008 |
