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"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
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| Number | Title | Issue Date |
| 8189344 | Integrated circuit package system for stackable devices An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the i... | 05/29/2012 |
| 8130512 | Integrated circuit package system and method of package stacking A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the ... | 03/06/2012 |
| 8040684 | Package for electronic component and method for manufacturing the same A package for providing electromagnetic shielding for microwave circuits. The package includes a top board having an upper surface, a lower surface opposite to the upper surface and a side surface joining the upper surface and the lower surface, and a bottom board h... | 10/18/2011 |
| 8023282 | Hybrid structure of multi-layer substrates and manufacture method thereof A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first meta... | 09/20/2011 |
| 8014166 | Stacking integrated circuits containing serializer and deserializer blocks using through silicon via Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer sta... | 09/06/2011 |
| 7876573 | Stacked mounting structure A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed o... | 01/25/2011 |
| 7869223 | Circuit board device for information apparatus, multilayered module board and navigation system A multilayered module board with mounted high-frequency electronic components such as a CPU and a graphic circuit is mounted on one face of a base board with mounted low-frequency electronic components. The multilayered module board is a squared multilayered board s... | 01/11/2011 |
| 7859857 | Grounding apparatus A grounding apparatus for connecting electrical equipment to ground comprises a plate comprising a top surface, a bottom surface and first and second end portions. Typically, the plate is connected to opposing support legs, such that an open space is provided under ... | 12/28/2010 |
| 7800916 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically couple... | 09/21/2010 |
| 7768795 | Electronic circuit device, electronic device using the same, and method for manufacturing the same Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including c... | 08/03/2010 |
| 7706148 | Stack structure of circuit boards embedded with semiconductor chips A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wh... | 04/27/2010 |
| 7692931 | Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment includes a support member having first package bond sites electrically co... | 04/06/2010 |
| 7667981 | Multifunctional composite sandwich element with embedded electronics A composite sandwich structure carrying an externally applied structural load and having embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core regi... | 02/23/2010 |
| 7602618 | Methods and apparatuses for transferring heat from stacked microfeature devices Apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the supp... | 10/13/2009 |
| 7511967 | Avionics enclosure An enclosure for compact computer boards is described that allows a user to easily configure, or reconfigure, a microserver stack using an interchangeable common bus as a data and power backbone. One application requiring robust and rigorous design constraints is us... | 03/31/2009 |
| 7443687 | Heat sink mounting device and mounting method, and server blade using the same A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even when a dual central processing unit (CPU) is constituted by extension... | 10/28/2008 |
| 7436676 | Portable electronic apparatus and BGA package protective device A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are... | 10/14/2008 |
| 7435619 | Method of fabricating a 3-D package stacking system The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package an... | 10/14/2008 |
| 7420817 | MEMS device seal using liquid crystal polymer An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed... | 09/02/2008 |
| 7420814 | Package stack and manufacturing method thereof A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may inclu... | 09/02/2008 |
| 7405919 | Electronic circuit having transmission line type noise filter A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal output terminal and two ground terminals corresponding respectively t... | 07/29/2008 |
| 7402760 | Multi-layer printed wiring board and manufacturing method thereof A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is ... | 07/22/2008 |
| 7394148 | Module having stacked chip scale semiconductor packages Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the substrate side of the top chip scale package, the second package being elect... | 07/01/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7375976 | Housing for communication apparatus capable of installing LED lamps having horizontal or vertical emitting direction therein, and communication apparatus comprising the same A communication apparatus includes a housing and an electronic device installed in the housing. The housing has a shell body having a top wall, a front wall and a mounting zone defined by a part of the top wall and a part of the front wall, and a cover coupled to th... | 05/20/2008 |
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach... | 05/13/2008 |
| 7368319 | Stacked integrated circuit package-in-package system A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation, stacking the first integrated package below the second i... | 05/06/2008 |
| 7368814 | Surface mount adapter apparatus and methods regarding same An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package)... | 05/06/2008 |
| 7369669 | Diotic presentation of second-order gradient directional hearing aid signals Systems, devices and methods are provided for diotically presenting second-order gradient directional hearing aid signals. The present subject matter provides an improved signal-to-noise ratio, and presents a desired directional signal to each ear. One aspect is a h... | 05/06/2008 |
| 7369415 | Multilayer electronic circuit device An electronic control device includes a multilayered flexible substrate and first to fourth spacers disposed in a casing. The multilayered flexible substrate, including first to third rigid substrate portions, is folded in a multilayered arrangement in such a manner... | 05/06/2008 |
| 7365990 | Circuit board arrangement including heat dissipater A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices o... | 04/29/2008 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity. ... | 04/29/2008 |
| 7358115 | Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding, and in which the upper package is inverted. Also, a method fo... | 04/15/2008 |
| 7355272 | Semiconductor device with stacked semiconductor chips of the same type A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same type as the first semiconductor chip and is mounted face up on the fir... | 04/08/2008 |
| 7354800 | Method of fabricating a stacked integrated circuit package system An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate a... | 04/08/2008 |
| 7355426 | Universal measuring adapter system The invention relates to a universal measuring adapter system for adapting or contacting semiconductor components in the most varied packages for electrically operating and measuring the same. The pins or contact pads of the package are electrically contacted on the... | 04/08/2008 |
| 7352602 | Configurable inputs and outputs for memory stacking system and method Embodiments of the present invention relate to configurable inputs and/or outputs for memory and memory stacking applications. More specifically, embodiments of the present invention include memory devices that include a die having a circuit configured for enablemen... | 04/01/2008 |
| 7351072 | Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes ... | 04/01/2008 |
| 7352589 | Modular computer system mechanical interconnection A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The ap... | 04/01/2008 |
| 7352593 | Anchoring member to facilitate fastening daughter boards to a mother board and a method for use An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a prede... | 04/01/2008 |
