Bizarre Patents
An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8179692 | Board having connection terminal A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end ... | 05/15/2012 |
| 7310875 | Connector for high-speed communications A high speed electrical connector is provided that comprises a substantially planar dielectric, a substantially planar ground plane, and a signal conductor. The ground plane is disposed on one planar surface of the planar dielectric and the signal conductor is dispo... | 12/25/2007 |
| 7307354 | Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconne... | 12/11/2007 |
| 7292453 | Bi-fold mounted printed wiring board A mounted printed wiring board is disclosed that will allow sensors to be installed in optimal positions thereon with the same time and effort needed for one board, and allow the same to be inexpensively manufactured with a simple process. A single board unit includ... | 11/06/2007 |
| 7278859 | Extended package substrate An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is sm... | 10/09/2007 |
| 7273401 | Grouped element transmission channel link with pedestal aspects A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configura... | 09/25/2007 |
| 7247941 | Printed circuit board assembly with strain-alleviating structures A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the receiving zone. Each island portion includes a solder member for contacting ... | 07/24/2007 |
| 7188408 | Method of making a straddle mount connector A method of making an electrical connector includes the steps of: providing a connector body (2) having an insert (5) defining a recessed area (54a) at one side and a number of channels (54b) at an opposite side; assembling ... | 03/13/2007 |
| 7180750 | Structure for preventing stacking connectors on boards from coming apart and electronic device A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member.... | 02/20/2007 |
| 7157372 | Coaxial through chip connection A method performed on a wafer having multiple chips, each including a doped semiconductor and substrate, involves etching an annulus trench partially into the substrate, metalizing the annulus trench with a metal, etching a via trench within the periphery of the ann... | 01/02/2007 |
| 7154172 | Integrated circuit carrier An integrated circuit carrier is claimed comprising at least one receiving zone for an integrated circuit. A plurality of island-defining portions, having electrical terminals, is arranged about each of the receiving zones. Rigidity-reducing arrangements are dispose... | 12/26/2006 |
| 7134880 | Connector with self-adjusting vertical alignment feature A connector has a plurality of holes formed in an insulating layer. Contacts inside these holes have contact parts at the top and bottom. Each contact has a base part, a pair of contact parts which extend up and down from the base part, a lip which is connected to t... | 11/14/2006 |
| 7093764 | Integrated SIM holder with backcase and rotating door An apparatus for holding a SIM (subscriber identification module) card for an electronic device. The electronic device is implemented using integrated circuits on a PCB (printed circuit board) contained within a device housing. A SIM connector is mounted on the PCB ... | 08/22/2006 |
| 7077679 | Retention clip for conductive bridge joined to PC board This clip is used to secure a connection bridge onto the top edge of two graphics adaptor cards. It works by securing with a screw through the graphics adaptor card bracket that when tightened, applied downward pressure onto the bridge. The pressure is created by th... | 07/18/2006 |
| 7075793 | Device having a slot capable of receiving at least four types of memory cards An apparatus, such as a reader, adapter, or other device, is described that is capable of receiving at least four different types of memory cards using a single slot. The slot includes a central region having a width to receive a memory card of a first type, first o... | 07/11/2006 |
| 7069650 | Method for reducing the number of layers in a multilayer signal routing device A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plura... | 07/04/2006 |
| 7025623 | Adapter for memory card An adapter for a memory card having a frame metal fitting to which an end portion of the card is inserted, whereby the card is detachably fitted, and a resin-molded body core assembled in the frame metal fitting by insertion, wherein an entire thickness of the adapt... | 04/11/2006 |
| 7022913 | Electronic component, method of manufacturing the electronic component, and electronic apparatus An electronic component includes a substrate; a functional part that is formed beneath at least one of a front face and a bottom face of the substrate and that performs a predetermined function; a plurality of terminals that is formed on the front face or the bottom... | 04/04/2006 |
| 6998650 | Replaceable light emitting diode module A clip is used to clamp a LED in place in a LED module. The clip has pliable conducting cover and can be latched to the upper lead metal of the LED module. The clip can be lifted for replacing a defective or color LED. A plurality of replaceable LEDs can be mounted ... | 02/14/2006 |
| 6974335 | Interchangeable multi-form factor module socket The present invention relates to interchangeable module sockets and socket assemblies for accommodating modules of different form factors. ... | 12/13/2005 |
| 6975518 | Printed circuit board housing clamp An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), whic... | 12/13/2005 |
| 6928504 | PC card motion detector A motion detector is provided that enables power to a computer module to be disconnected prior to removal of the module from the connector. Actuation of a sensor causes a shutter assembly to move vertically. The shutter assembly is in communication with a switch. Mo... | 08/09/2005 |
| 6917525 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 07/12/2005 |
| 6790684 | Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing A semiconductor device wafer-on-support wafer package comprising a plurality of segmentable chip-scale packages and method of constructing, burning-in, and testing same are disclosed. The wafer-on-wafer package can be burned-in and tested at the wafer level prior to... | 09/14/2004 |
| 6785148 | Easy mount socket A socket for mounting a processor and/or a board has a substrate with a built in socket. The socket has conductive, elastically deformable terminals. The socket may be mounted to a processor and a board without using conventional surface mount technology, instead pr... | 08/31/2004 |
| 6771514 | Keyed bumper device for electronic card and/or backplane protection An apparatus for protecting an electronic card is described. The apparatus has a protective contact. The protective contact has a contact face that, when the apparatus is in a locked protruding state, makes contact with a first incorrect card slot backplane feature.... | 08/03/2004 |
| 6741480 | Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodimen... | 05/25/2004 |
| 6738259 | Apparatus supporting multiple memory card formats An apparatus is described that is capable of receiving a number of different types of flash memory cards using a single slot. The apparatus includes a housing that defines a slot to receive different types of removable memory cards. The slot includes a central regio... | 05/18/2004 |
| 6713684 | Hole grid array package and socket technology A chip interface assembly and method of assembling a chip interface provide enhanced performance. The chip interface assembly includes a semiconductor package and a socket. The semiconductor package has a female contact architecture, where the female contact archite... | 03/30/2004 |
| 6674652 | Integrated shield wrap An integrated shield wrap suitable for use in an electronic device including electronic circuitry. The integrated shield wrap includes an insulator section composed of an electrically insulative material, as well as a shield section joined to the insulato... | 01/06/2004 |
| 6625039 | EMI spring configuration An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective E... | 09/23/2003 |
| 6618268 | Apparatus for delivering power to high performance electronic assemblies A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit boar... | 09/09/2003 |
| 6574120 | Portable relay base A portable relay base is composed of an upper cover and a lower cover being oppositely joined to each other. The portable relay base at a lateral side thereof at least provides an outlet unit composed of two contact poles and/or one ground pole and at a p... | 06/03/2003 |
| 6556455 | Ultra-low impedance power interconnection system for electronic packages A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance ... | 04/29/2003 |
| 6549418 | Land grid array integrated circuit device module An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated ... | 04/15/2003 |
| 6545879 | Method and apparatus for mounting a lidless semiconductor device A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted thereon is disposed in a socket. The socket includes a plurality... | 04/08/2003 |
| 6535395 | Processor power delivery system A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems... | 03/18/2003 |
| 6496358 | Breaker apparatus and breaker unit The present invention relates to a breaker apparatus and breaker unit. The breaker apparatus comprises a breaker unit including a power supply/cut-off breaker part, a power connecting part, a first unit connecting part, a ground connecting part and a seco... | 12/17/2002 |
| 6456504 | Surface mounted grounding clip for shielded enclosures A contact system is disclosed that includes a metal contact clip capable of being surface-mounted to a printed circuit board that facilitates the electrical coupling of the opposing conductive covers in a circuit card assembly having conductive enclosures... | 09/24/2002 |
| 6404646 | PC board support adapted to support a PC board above a frame in a computer A PC board support is disclosed to include a hollow support shell adapted to support a PC board above a frame, a spring mounted inside the support shell, the support shell having a top opening, a top neck, and a retainer head at the top of the top neck, a... | 06/11/2002 |
