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| Number | Title | Issue Date |
| 8169791 | Electronic module and method for producing such a module Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive sub... | 05/01/2012 |
| 8159831 | Printed circuit board for accomplishing narrow scribe lane and semiconductor package including the printed circuit board A PCB (printed circuit board) for manufacturing a semiconductor package. The PCB includes a plurality of semiconductor package unit frames; a scribe lane dividing the plurality of semiconductor package unit frames; and a printed circuit pattern for plating directly ... | 04/17/2012 |
| 8125792 | Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved. ... | 02/28/2012 |
| 8089777 | Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on a... | 01/03/2012 |
| 8059425 | Integrated circuit module with temperature compensation crystal oscillator An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one ch... | 11/15/2011 |
| 8050049 | Semiconductor device The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the sem... | 11/01/2011 |
| 7948768 | Tape circuit substrate with reduced size of base film A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring exten... | 05/24/2011 |
| 7746663 | Electronic substrate and electronic device An electronic substrate is disclosed that includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. The substrate may further include: a penetrativ... | 06/29/2010 |
| 7660130 | Semiconductor device A semiconductor device includes: a wiring substrate including multiple connection pads provided on a top surface thereof and multiple lands that are provided on a bottom surface thereof and electrically connected to the corresponding connection pads; a semiconductor... | 02/09/2010 |
| 7656679 | Multi-layer substrate and manufacture method thereof Disclosed are a multi-layer substrate and a manufacture method thereof. The multi-layer substrate of the present invention comprises a surface dielectric layer and at least one bond pad layer. The surface dielectric layer is located at a surface of the multi-layer s... | 02/02/2010 |
| 7606049 | Module thermal management system and method A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs... | 10/20/2009 |
| 7606050 | Compact module system and method A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a... | 10/20/2009 |
| 7599193 | Tape circuit substrate with reduced size of base film A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring exten... | 10/06/2009 |
| 7480151 | Wiring board and method of manufacturing the same A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a second terminal area disposed on the other side of the wiring part. A r... | 01/20/2009 |
| 7435619 | Method of fabricating a 3-D package stacking system The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package an... | 10/14/2008 |
| 7420809 | Heat spreader in integrated circuit package An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises ... | 09/02/2008 |
| 7420817 | MEMS device seal using liquid crystal polymer An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed... | 09/02/2008 |
| 7405946 | Ball grid array assignment A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts ... | 07/29/2008 |
| 7391110 | Apparatus for providing capacitive decoupling between on-die power and ground conductors One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a sem... | 06/24/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7372130 | Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a... | 05/13/2008 |
| 7370134 | System and method for memory hub-based expansion bus A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also having access to the memory module. The memory hub controller is coupl... | 05/06/2008 |
| 7366864 | Memory hub architecture having programmable lane widths A processor-based system includes a processor coupled to a system controller through a processor bus. The system controller is used to couple at least one input device, at least one output device, and at least one data storage device to the processor. Also coupled t... | 04/29/2008 |
| 7365424 | Microelectronic component assemblies with recessed wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a subs... | 04/29/2008 |
| 7365991 | Dual LED board layout for lighting systems Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line ... | 04/29/2008 |
| 7361519 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device, comprises the steps of: forming a first insulating film on a first substrate; forming a second insulating film on the first insulating film; forming an amorphous silicon film on the second insulating film; holding a ... | 04/22/2008 |
| 7362588 | Flying capacitor type battery voltage detector In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS s... | 04/22/2008 |
| 7359211 | Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same An article includes a mounting substrate, a passive component site on the mounting substrate, and an active component site on the mounting substrate. The article also includes a fluid flow barrier disposed local to the passive component site and spaced apart from th... | 04/15/2008 |
| 7359641 | Modular optical transceiver An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical ... | 04/15/2008 |
| 7359213 | Circuit board A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the fir... | 04/15/2008 |
| 7355126 | Electronic parts packaging method and electronic parts package An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutua... | 04/08/2008 |
| 7349030 | Segment buffer loading in a deinterlacer A display processor integrated circuit includes a display processor portion and an on-chip programmable logic portion. The programmable logic portion can be configured to implement custom video and/or image enhancement functions. The display processor portion perfor... | 03/25/2008 |
| 7348856 | Semiconductor device Power amplifier circuits which constitute an RF power module used for a digital device capable of handling high frequency signals in two frequency bands are disposed over the same IC chip. The power amplifier circuits are disposed around the IC chip, and a secondary... | 03/25/2008 |
| 7348215 | Methods for assembly and packaging of flip chip configured dice with interposer A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconduc... | 03/25/2008 |
| 7345245 | Robust high density substrate design for thermal cycling reliability A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal traces. A high stress area associated with the corner of the dies is defi... | 03/18/2008 |
| 7339204 | Backside contact for touchchip A contact is formed within an active region of a substrate at the edge of a die, preferably within the first metallization level in the active region of the substrate. An opening having sloped sidewalls is then etched into the back side of the substrate, exposing a ... | 03/04/2008 |
| 7339276 | Underfilling process in a molded matrix array package using flow front modifying solder resist Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By... | 03/04/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7333682 | Photoelectric composite interconnection assembly and electronics device using same A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical tr... | 02/19/2008 |
