Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8174842 | Light-emitting diode module A light-emitting diode (LED) module includes a plurality of LED units and a converter having a first side. The LED units respectively include a circuit board having a second side perpendicular to the first side and a third side parallel to the first side, a pluralit... | 05/08/2012 |
| 8169790 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, sta... | 05/01/2012 |
| 8111524 | Electronic passive device A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face an... | 02/07/2012 |
| 8102669 | Chip package structure with shielding cover A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and t... | 01/24/2012 |
| 8085551 | Electronic component and manufacturing the same The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere i... | 12/27/2011 |
| 8077477 | Electronic component and circuit board An electronic component, including: a first terminal group including a plurality of functional terminals provided along a first side of the electronic component; a second terminal group including a plurality of functional terminals provided along a second side of th... | 12/13/2011 |
| 8072772 | Single-chip and multi-chip module for proximity communication An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proxim... | 12/06/2011 |
| 8072773 | Ultra-wideband assembly system and method An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end ... | 12/06/2011 |
| 8040681 | Circuit arrangement A circuit arrangement is provided that includes at least one semiconductor component, at least one filter arrangement, which has at least two discretely made coil elements, which are disposed adjacent to one another with parallel aligned magnetic field axes, and a c... | 10/18/2011 |
| 8035982 | Power converter apparatus A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, capacitors, and a cover is disclosed. Pairs of groups of switching elements are mounted on the substrate. The cover is arranged over the substrate to enc... | 10/11/2011 |
| 8035981 | Semiconductor device and manufacturing method of the same A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacito... | 10/11/2011 |
| 8031480 | Structure for mounting feedthrough capacitors In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial reg... | 10/04/2011 |
| 7894205 | Variable device circuit and method for manufacturing the same There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface... | 02/22/2011 |
| 7796401 | Chip element A chip element according to this invention can reduce the influence of parasitic capacitance and parasitic inductance when used in a GHz band. A substrate is formed of a low permittivity material having a permittivity low enough to reduce parasitic capacitance in a ... | 09/14/2010 |
| 7773389 | Electronic component mounted structure and optical transceiver using the same An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two ... | 08/10/2010 |
| 7746662 | Touch panel A touch panel includes a light-transmissible upper board, a lower board, an upper resistor layer on a lower surface of the upper board, a lower resistor layer provided on an upper surface of the lower board and facing the upper resistor layer with a predetermined sp... | 06/29/2010 |
| 7719854 | Integrated electromagnetic interference filters and feedthroughs An assembly integrating commercially available capacitors into filtered feedthroughs. A feedthrough assembly comprises a plurality of Input/Output (I/O) conductors, wherein the I/O conductors pass through a hermetic seal such that a first end of the I/O conductors r... | 05/18/2010 |
| 7667980 | Printed circuit boards for countering signal distortion Printed circuit boards for countering signal distortion are disclosed that include: a conductive pathway on a printed circuit board between a transmitter and a receiver, the conductive pathway comprised of traces and vias connected together for conductive transfer o... | 02/23/2010 |
| 7663893 | Sensor node and circuit board arrangement An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receivi... | 02/16/2010 |
| 7649748 | Multilayer printed wiring board A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected t... | 01/19/2010 |
| 7613009 | Electrical transition for an RF component An RF electronic component for mounting on a substrate includes a housing; and at least one electronic device having an input and/or output incorporated in the housing. At least one input/output terminal connects to a connection pad on the substrate; and an electric... | 11/03/2009 |
| 7586755 | Electronic circuit component Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a vari... | 09/08/2009 |
| 7580269 | Apparatus for supplying power to a semiconductor device using a capacitor DC shunt A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt compri... | 08/25/2009 |
| 7474539 | Inductor A component having an inductor to at least partially compensate for a capacitance in a circuit of the component, is described herein. ... | 01/06/2009 |
| 7463492 | Array capacitors with voids to enable a full-grid socket An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adja... | 12/09/2008 |
| 7457132 | Via stub termination structures and methods for making same Vias are used in multilayer printed circuit boards to route electrical interconnects between layers. Some via constructions embodiments result in the formation of a via-stub section. Via stub sections can distort signals passing through the interconnect and decrease... | 11/25/2008 |
| 7436679 | Radio-frequency module for communication A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto ... | 10/14/2008 |
| 7436681 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 10/14/2008 |
| 7432580 | Semiconductor device with a substrate having a spiral shaped coil A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed... | 10/07/2008 |
| 7420819 | Expanding high speed transport interface hardware method for motherboard An expanding high speed transport interface hardware method for motherboard is provided. In the method, a mezzanine card is provided and the mezzanine card has a chip socket. An expanding hardware with high speed transport interface is installed in the chip socket o... | 09/02/2008 |
| 7417869 | Methods and systems for filtering signals The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. ... | 08/26/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7414299 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/19/2008 |
| 7405448 | Semiconductor device having a resistance for equalizing the current distribution A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside th... | 07/29/2008 |
| 7405946 | Ball grid array assignment A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts ... | 07/29/2008 |
| 7391110 | Apparatus for providing capacitive decoupling between on-die power and ground conductors One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a sem... | 06/24/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7369726 | Optical communication between face-to-face semiconductor chips One embodiment of the present invention provides a system that communicates between a first semiconductor die and a second semiconductor die through optical signaling. During operation, the system converts an electrical signal into an optical signal using an electri... | 05/06/2008 |
| 7365991 | Dual LED board layout for lighting systems Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line ... | 04/29/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
