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| Number | Title | Issue Date |
| 8035980 | Circuit structure and circuit substance for modifying characteristic impedance using different reference planes A circuit structure for modifying characteristic impedance by using different reference planes is provided. The structure comprises an analog signal line, a digital signal line, a corresponding reference plane for analog signals and a corresponding reference plane f... | 10/11/2011 |
| 8004854 | Electrical noise protection Embodiments of the present invention provide an electronic device. The electronic device includes a circuit board. A first circuit is disposed on a first side of the circuit board. The first circuit is connected to a first ground plane of the circuit board. A second... | 08/23/2011 |
| 7804694 | Reference layer openings A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein. ... | 09/28/2010 |
| 7495929 | Reference layer openings A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein. ... | 02/24/2009 |
| 7474538 | Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package A semiconductor device mounting board, a method of manufacturing the same, a method of inspecting the same, and a semiconductor package are provided. The semiconductor device mounting board is capable of implementing a high-density and fine structure corresponding t... | 01/06/2009 |
| 7450397 | Wiring board and circuit apparatus A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first an... | 11/11/2008 |
| 7430125 | Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium A second ground plane (18); has one end opposite to a connector (14), which end is connected to a first ground plane (17) by resistor connection element (41). Accordingly, it is possible to lower Q of resonance of the ground structure by ... | 09/30/2008 |
| 7423885 | Die module system A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector con... | 09/09/2008 |
| 7417869 | Methods and systems for filtering signals The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. ... | 08/26/2008 |
| 7402757 | Method, system, and apparatus for reducing transition capacitance A printed circuit board (PCB) is provided. The PCB includes a signal layer, a first reference plane defined adjacent to a first side of the signal layer, and a via passing through the signal layer and the first reference plane. The first side of the signal layer is ... | 07/22/2008 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 07/15/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7375983 | Circuit board for reducing crosstalk of signals A circuit board includes a first group of layers located close to a top side of the circuit board, and a second group of layers located close to an underside of the circuit board. Signals which are fed to input and output contact terminals on the top side of the cir... | 05/20/2008 |
| 7361843 | AC coupling of power plane sections using improved capacitance stitching material An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil layer of the printed circuit board to components on the printed circui... | 04/22/2008 |
| 7361997 | Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the edges of the bottom electrodes become different from place to place. The... | 04/22/2008 |
| 7355863 | High frequency multilayer integrated circuit A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circ... | 04/08/2008 |
| 7356588 | Circuits and methods for detecting the presence of a powered device in a powered network Circuits and methods for detecting the presence of a powered device in a powered network connection and removing power from the powered network connection when no powered device is present are disclosed. The circuits and methods involve applying a time-varying volta... | 04/08/2008 |
| 7355125 | Printed circuit board and chip module The present invention relates to computer hardware design and in particular to a printed circuit board comprising wiring dedicated to supply electric board components such as integrated circuits with at least three different reference planes. In order to provide a p... | 04/08/2008 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler i... | 04/01/2008 |
| 7350292 | Method for affecting impedance of an electrical apparatus A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an electrical circuit loop including at least one of at least one trace ... | 04/01/2008 |
| 7345889 | Method and system for reducing radiated energy emissions in computational devices A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a printed circuit board (PCB) and adjacent the PCB conductive traces act as ... | 03/18/2008 |
| 7342805 | Capacitor plate for substrate components A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second embodiment of the invention involves a method to fabricate a capacitor plate... | 03/11/2008 |
| 7342801 | Printed wiring board with enhanced structural integrity A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interl... | 03/11/2008 |
| 7340222 | Method for implementing a RF module on a motherboard A method for implementing a wireless radio frequency (RF) module on a motherboard is described. First, the whole wireless RF module is formed on a daughter board, and at least one through hole is formed at or near the edge of the daughter board. Finally, the daughte... | 03/04/2008 |
| 7339796 | Electrical circuit having a multilayer printed circuit board An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit board are in the form of contact areas which are connected to a respectiv... | 03/04/2008 |
| 7336502 | High-speed router with backplane using tuned-impedance thru-holes and vias A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route thr... | 02/26/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7335985 | Method and system for electrically coupling a chip to chip package A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter ... | 02/26/2008 |
| 7326858 | Printed circuit board with embedded capacitors and manufacturing method thereof Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of ... | 02/05/2008 |
| 7327135 | Testing apparatus and testing method using the same An exemplary testing apparatus (200) for testing electronic device (280) includes a workbench (210), a conveyance board (221) for supporting the electronic device to be tested and a testing device (270). The conveyance board is sli... | 02/05/2008 |
| 7327583 | Routing power and ground vias in a substrate A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of externa... | 02/05/2008 |
| 7319599 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 01/15/2008 |
| 7306466 | Electrical printed circuit board The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to groun... | 12/11/2007 |
| 7307220 | Circuit board for cable termination Various embodiments of an apparatus, circuit board, and method are disclosed for cable termination. In one embodiment, a surface pad is disposed on a surface of the circuit board. A ground conductor is in the circuit board, the ground conductor being parallel to and... | 12/11/2007 |
| 7304860 | Printed circuit board with thin film switches for a keyboard A printed circuit board with thin film switches for a keyboard including an upper board having multiple circuit lines, an insulating separation defining multiple through holes, a lower board having multiple circuit lines and multiple thin film switches mounted on th... | 12/04/2007 |
| 7304857 | Sensor node and circuit board arrangement An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receivi... | 12/04/2007 |
| 7304863 | Integrated circuit including external electronic components with low insertion loss An integrated circuit package can include electronic components used to enhance the performance of the integrated circuit that is part of the package. In order to reduce some adverse effects of including the electronic components, void regions are introduced into po... | 12/04/2007 |
| 7301780 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power inserti... | 11/27/2007 |
| 7301775 | Receiving device A tuner section is provided on one surface of a multilayered substrate, and a demodulating section on another surface of the multilayered substrate. The multilayered substrate further includes: an analog GND layer connected to the tuner section; a digital GND layer ... | 11/27/2007 |
| 7301097 | Printed-circuit board and electronic device A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width of more than 1 millimeter. Moreover, the shield pattern layer include... | 11/27/2007 |
