Famous Patents
3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8411457 | Semiconductor package substrate A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which defin... | 04/02/2013 |
| 8315065 | Self-locking features in a multi-chip module A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each o... | 11/20/2012 |
| 7957156 | Busbar circuit board assembly An electrical connection assembly includes a substrate having first and second sides and a substrate aperture formed therein. The substrate is made of an electrically non-conductive material. A busbar is attached to the first side of the substrate. The busbar has a ... | 06/07/2011 |
| 7616451 | Semiconductor package substrate and method, in particular for MEMS devices A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which defin... | 11/10/2009 |
| 7377032 | Process for producing a printed wiring board for mounting electronic components A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion... | 05/27/2008 |
| 7371973 | Contact node The contact node comprises at least two metallized contacts coupled with conductive paths arranged on surfaces of connection layers made on the base of a dielectric material and mutually aligned and interconnected electrically and mechanically by conductive binding ... | 05/13/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7359693 | Enclosure and substrate structure for a tuner module A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter coils of the tuner to improve the isolation between the filter coils. ... | 04/15/2008 |
| 7356921 | Method for forming a conductive layer pattern A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets o... | 04/15/2008 |
| 7342804 | Ball grid array resistor capacitor network An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is fo... | 03/11/2008 |
| 7341894 | Semiconductor, electrooptic apparatus and electronic apparatus In a semiconductor device made by forming functional elements on a first substrate, transferring the element chip onto a second substrate, and connecting first pads on the element chip to second pads on the second substrate, the area or the width of the first is inc... | 03/11/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7315078 | Chip-stacked semiconductor package and method for fabricating the same A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a plurality of heat sinks are provided, wherein a plurality of through... | 01/01/2008 |
| 7300824 | Method of packaging and interconnection of integrated circuits A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly ... | 11/27/2007 |
| 7301779 | Electronic chip and electronic chip assembly A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip. ... | 11/27/2007 |
| 7282804 | Structure of high performance combo chip and processing method A new method and package for the mounting of semiconductor devices. A silicon substrate serves as the device supporting medium, active semiconductor devices have been created in or on the surface of the silicon substrate. A solder plate is created over the surface o... | 10/16/2007 |
| 7282375 | Wafer level package design that facilitates trimming and testing A wafer level method of packaging, trimming and testing integrated circuits is described. A wafer having trim pads is bumped before the wafer is trimmed. After the bumping, the dice on the wafer are trimmed and tested using standard trim probing and test probing tec... | 10/16/2007 |
| 7279796 | Microelectronic die having a thermoelectric module A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias i... | 10/09/2007 |
| 7274103 | Semiconductor device and manufacturing method thereof In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a m... | 09/25/2007 |
| 7271491 | Carrier for wafer-scale package and wafer-scale package including the carrier A carrier for use in a chip-scale package, including a semiconductor substrate, such as a semiconductor wafer, with a plurality of apertures formed therethrough. The present invention also includes a chip-scale package including the carrier. When the carrier is empl... | 09/18/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7268303 | Circuit board, mounting structure of ball grid array, electro-optic device and electronic device In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting... | 09/11/2007 |
| 7266879 | Method for magnetically establishing an electrical connection with a contact of a semiconductor device component A method for establishing electrical contact includes nonrigidly applying force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attr... | 09/11/2007 |
| 7268438 | Semiconductor element including a wet prevention film A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7262495 | 3D interconnect with protruding contacts This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding co... | 08/28/2007 |
| 7259683 | Rack A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a display section and an input section. The LED lighting circuit has a... | 08/21/2007 |
| 7256856 | Electro-optical device, method for manufacturing electro-optical device, light guide, liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment A liquid crystal device 100 comprises a liquid crystal panel 110 and a holding member 120. A liquid crystal driving IC 115 and chip part 116 are mounted on a substrate extension portion 111T of the liquid crystal panel 11... | 08/14/2007 |
| 7239524 | Resistive element apparatus and method A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point connected to a capacitor terminal, a second contact point connected ... | 07/03/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7230330 | Semiconductor die packages with recessed interconnecting structures Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is i... | 06/12/2007 |
| 7226563 | Ion-detecting sensors comprising plasticizer-free copolymers Plasticizer-free ion-detecting sensors for detecting a target ion in a sample are provided. The sensor comprises a plasticizer-free copolymer comprised of polymerized units of methacrylate monomers and a polymerizable ion exchanger, wherein the methacrylated monomer... | 06/05/2007 |
| 7224061 | Package structure A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interc... | 05/29/2007 |
| 7220115 | 3-D product printing system incorporating an electrical connection printhead A system that prints three dimensional products, the system including at least one printhead that prints electrical connections to at least one object incorporated in the products. ... | 05/22/2007 |
| 7211510 | Stacking circuit elements A method of stacking dice in an electronic circuit includes controlling a size of a hole made in a connection pad on each die of said dice to selectively provide an electrical connection to a particular die in the stack. Additionally, a method of stacking dice in an... | 05/01/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
| 7202410 | Photovoltaic module having light receptive, glass laminate structure and photovoltaic module having light receptive, multi-layer structure Between a light receiving glass and a backside glass a plurality of solar battery cells form a matrix of solar battery cells and a translucent, intermediate layer of film is also interposed to configure a photovoltaic module having a light receptive, glass laminate ... | 04/10/2007 |
| 7191515 | Method for manufacturing an interconnected circuit board assembly An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit... | 03/20/2007 |
