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"Transmission of documents via telephone wires is possible in principle, but the apparatus required is so expensive that it will never become a practical proposition."
Dennis Gabor, British physicist
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| Number | Title | Issue Date |
| 8081487 | Signal transmission circuit, IC package, and mounting board Provided is a signal transmission circuit capable of realizing the same effects as those in a conventional manner that employs a complicated circuit by using no complicated circuit, that is, by a simple circuit. The signal transmission circuit includes: a transmissi... | 12/20/2011 |
| 7916497 | Printed circuit board and differential signaling structure Provided is a system adopting a differential signaling system including a low frequency signaling line arranged to be adjacent to a pair of differential signaling lines in parallel to each other, for transmitting a signal having a frequency which is smaller than a f... | 03/29/2011 |
| 7894204 | Matrix board assembly An assembly of connected circuit boards includes at least one each of a matrix board, an input board and an output board. There are two types of input board, one for hydrophone cable input and one for single-ended (SE) cable input. The matrix board provides for swit... | 02/22/2011 |
| 7830669 | Contact bank A contact bank, which can be terminated, or is terminated, at least one terminal module serving for signal communication and being adapted to allow telecommunications lines to be connected therewith, or at least one supplementary module, of a telecommunications dist... | 11/09/2010 |
| 7545652 | Printed circuit board and differential signaling structure Provided is a system adopting a differential signaling system including a low frequency signaling line arranged to be adjacent to a pair of differential signaling lines in parallel to each other, for transmitting a signal having a frequency which is smaller than a f... | 06/09/2009 |
| 7379307 | Wiring board and method for manufacturing the same, and semiconductor device A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings inc... | 05/27/2008 |
| 7375978 | Method and apparatus for trace shielding and routing on a substrate Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace r... | 05/20/2008 |
| 7332816 | Method of fabricating crossing wiring pattern on a printed circuit board A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added,... | 02/19/2008 |
| 7292454 | System and method for optimizing printed circuit boards to minimize effects of non-uniform dielectric A system and method for minimizing the effects of non-uniform dielectric properties includes forming traces on printed circuit boards (PCB) where the fibers within the printed circuit boards are non-rectangular with respect to the rectangular edges of the circuit bo... | 11/06/2007 |
| 7286372 | Transceiver module with PCB having embedded traces for EMI control A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectr... | 10/23/2007 |
| 7283374 | Grow as you go equipment shelf An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth. The extendable enclosure for circuit cards comprises a first enclosure comprising a backplane, a plurality of circuit... | 10/16/2007 |
| 7273379 | Hybrid circuit board and display device having the same A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second ... | 09/25/2007 |
| 7272668 | System having backplane performance capability selection logic A system having a plurality of printed circuit broads each one having an electrical component thereon. A backplane carries a signal indicative of a performance characteristic of the electrical components on the plurality of printed circuit boards plugged into such b... | 09/18/2007 |
| 7265299 | Method for reducing voltage drop across metal lines of electroluminescence display devices A conducting device for a display device is disclosed. It comprises one or more non-conducting base lines formed in predetermined locations on a substrate layer, and one or more conducting line structures formed over the non-conducting base lines on the substrate la... | 09/04/2007 |
| 7259683 | Rack A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a display section and an input section. The LED lighting circuit has a... | 08/21/2007 |
| 7257884 | Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a subs... | 08/21/2007 |
| 7240425 | Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to ... | 07/10/2007 |
| 7241646 | Semiconductor device having voltage output function trim circuitry and method for same In accordance with the teachings of the present invention, a semiconductor device having voltage output function trim circuitry and a method for the same are provided. In a particular embodiment, the method includes electrically coupling to a main circuit of a semic... | 07/10/2007 |
| 7234232 | Methods for designing and tuning one or more packaged integrated circuits A method for producing and tuning a packaged integrated circuit a) incorporates into a packaged integrated circuit design, at least one tunable circuit feature; b) fabricates a packaged integrated circuit in accordance with said packaged integrated circuit design; c... | 06/26/2007 |
| 7209368 | Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a commo... | 04/24/2007 |
| 7205483 | Flexible substrate having interlaminar junctions, and process for producing the same A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern ... | 04/17/2007 |
| 7200063 | Circuitry for a programmable element As part of anti-fuse circuitry for a memory device, a preferred exemplary embodiment of the current invention provides a direct connection between an anti-fuse and a contact pad used to provide voltage to that anti-fuse. The contact pad also serves as a voltage sour... | 04/03/2007 |
| 7181837 | Plating buss and a method of use thereof The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window ther... | 02/27/2007 |
| 7176383 | Printed circuit board with low cross-talk noise A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially pa... | 02/13/2007 |
| 7170749 | Electrical apparatus and connector holder for electrical apparatus An electric apparatus has a motherboard, a control board and daughter board in a case. A front wall of the case is configured to have an opening. The motherboard is placed far behind an opening formed by removing the front wall. The control board, daughter board and... | 01/30/2007 |
| 7167408 | Circuitry for a programmable element As part of anti-fuse circuitry for a memory device, a preferred exemplary embodiment of the current invention provides a direct connection between an anti-fuse and a contact pad used to provide voltage to that anti-fuse. The contact pad also serves as a voltage sour... | 01/23/2007 |
| 7103274 | Cross-connect apparatus An apparatus having n-number of working cross-connects for cross-connecting an n-bit input signals arriving from a plurality of input paths on a per-bit basis; n-number of first logic circuits for calculating the exclusive-ORs of each said n-bit and applying outputs... | 09/05/2006 |
| 7079400 | High-frequency circuit A high-frequency circuit comprises a substrate having an electronic component on an obverse side thereof, a first ground pattern formed on almost an entire reverse side of the substrate, a microstrip line formed on the obverse side of the substrate, and a bias line ... | 07/18/2006 |
| 7076408 | Method for ensuring consistent protocol in the location of circuits and connectors having multiple circuit-receiving cavities A method of reducing the record of a multi-cavity terminal connector comprising the steps of assigning cavity numbers and locations to a properly oriented, full-scale CAD graphic of the connector, creating an integer from a concatenation of the cavity numbers and co... | 07/11/2006 |
| 7068521 | Semiconductor device In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connecte... | 06/27/2006 |
| 7064431 | Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts. ... | 06/20/2006 |
| 7061771 | Mechanism to cross high-speed differential pairs According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB transmits high-speed serial data. The differential traces carry the high-spe... | 06/13/2006 |
| 7038917 | Low loss, high density array interconnection An interconnect architecture in which a substrate such as a printed circuit board includes multiple conductive layers separated by one or more interposed insulating layers, the conductive layers being adapted to receive a high density array of interconnect elements ... | 05/02/2006 |
| 7028898 | Layout structure of electrode lead wires for organic led display A layout structure of electrode lead wires for organic light-emitting diode (OLED) display is provided for saving materials, simplifying fabrication process, and reducing power consumption so as to lower down the required driving voltage. The display comprises a plu... | 04/18/2006 |
| 7026646 | Isolation circuit An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is provided to transfer the other signal from the second pad to the third p... | 04/11/2006 |
| 7026223 | Hermetic electric component package An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/ou... | 04/11/2006 |
| 7012811 | Method of tuning a multi-path circuit An improved method for reducing timing skew for signals, for example clock signals, that propagate along a circuit board, for example, a memory module, is disclosed. At least one signal trace of a plurality of traces provided on the printed circuit board (PCB) is ro... | 03/14/2006 |
| 7007375 | Method for fabricating a semiconductor component A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a subs... | 03/07/2006 |
| 7008236 | Set of printed circuit boards comprising replacement board A set of printed circuit boards consists of a main board with at least one fragment intended for replacement and at least one replacement board, wherein said main board has openings in the dielectric layer placed along the edge line of the fragment intended for repl... | 03/07/2006 |
| 6967348 | Signal sharing circuit with microelectric die isolation features A signal sharing circuit includes a first pad adapted to receive a signal and a first sharing device associated with a first microelectronic die. The first sharing device is adapted to selectively share the signal with at least a second microelectronic die on one si... | 11/22/2005 |
