Bizarre Patents
A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8179691 | Wired circuit board A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to... | 05/15/2012 |
| 8164918 | Steering fabric that facilitates reducing power use for proximity communication One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This ... | 04/24/2012 |
| 8111521 | Package-based filtering and matching solutions A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capaci... | 02/07/2012 |
| 8089776 | Side switch for a contact exposed on an edge of a circuit board and method A switch configured to contact an exposed contact on an edge of a multilayer circuit board when selectively activated. The switch is particularly useful for electronic equipment such as mobile phones, PDA's, etc. where space for key contacts on the circuit board is ... | 01/03/2012 |
| 8054643 | Semiconductor module, wiring board, and wiring method A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the... | 11/08/2011 |
| 8040680 | Information processing apparatus and nonvolatile semiconductor storage device An information processing apparatus including: a main unit; a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow; and a nonvolatile semiconductor storage device that is provided within the main unit to be used as an e... | 10/18/2011 |
| 7974103 | LCD signal transfer members A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to inc... | 07/05/2011 |
| 7974104 | Printed wiring board and connection configuration of the same A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connect... | 07/05/2011 |
| 7936569 | Circuit device and method of manufacturing the same In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a s... | 05/03/2011 |
| 7911804 | Circuit board and method of manufacturing same The present invention provides a circuit board and a method for manufacturing the circuit board, the circuit board and method allowing a further shorter connection distance between electrodes of a semiconductor device, and also allowing a sufficient thickness of a s... | 03/22/2011 |
| 7903428 | Intra-connection layout of array An intra-connection layout of array is disclosed. An alterable area is disposed between the devices of a device array. The alterable area includes an insulation layer, a plurality of first conductive wires and a plurality of second conductive wires. The first conduc... | 03/08/2011 |
| 7876572 | Wiring board and semiconductor apparatus A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such that all wiring-lines included in the dummy wiring each have a free end w... | 01/25/2011 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads. ... | 06/29/2010 |
| 7742312 | Electronic device and method of fabrication of a same An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB)... | 06/22/2010 |
| 7738259 | Shared via decoupling for area arrays components A solution for mounting decoupling capacitors on a printed wiring board (PWB) used for mounting a high performance ball grid array (BGA) device is described. The via array that connects the BGA device is modified, the modification being that at least a portion of on... | 06/15/2010 |
| 7667979 | Protective circuit board for battery pack A protective circuit board for a battery pack for controlling charge and discharge states of the battery pack includes an insulation layer and a first signal pattern disposed inside the insulation layer. The circuit can further include a second signal pattern dispos... | 02/23/2010 |
| 7633766 | Preferential via exit structures with triad configuration for printed circuit boards A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed withi... | 12/15/2009 |
| 7630210 | Lead(Pb)-free electronic component attachment A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portio... | 12/08/2009 |
| 7623355 | Extended universal serial bus connectivity A system, method and apparatus is provided for extended universal serial bus connectivity. In one embodiment, the invention is an apparatus. The apparatus includes a printed circuit board having a plurality or traces. The plurality of traces includes a first set of ... | 11/24/2009 |
| 7551455 | Package structure A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is dispos... | 06/23/2009 |
| 7502231 | Thin printed circuit board for manufacturing chip scale package Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered... | 03/10/2009 |
| 7489520 | Printed circuit board and liquid crystal display device having the same An LCD capable of preventing and electrostatic discharge is provided. The LCD includes a liquid crystal panel for displaying an image, a PCB on which electronic devices are mounted to generate signals for driving the liquid crystal panel, and a protective pattern fo... | 02/10/2009 |
| 7463491 | Wiring board and a semiconductor device using the same A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite la... | 12/09/2008 |
| 7450396 | Skew compensation by changing ground parasitic for traces According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or... | 11/11/2008 |
| 7443692 | Power converter architecture employing at least one capacitor across a DC bus A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled ad... | 10/28/2008 |
| 7433200 | Wired circuit board A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relatio... | 10/07/2008 |
| 7426118 | Printed wiring board To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a | 09/16/2008 |
| 7417197 | Direct contact power transfer pad and method of making same A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a... | 08/26/2008 |
| 7414317 | BGA package with concave shaped bonding pads In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a per... | 08/19/2008 |
| 7402892 | Printed circuit board for connecting of multi-wire cabling to surge protectors A printed circuit board assembly for coupling a plurality of surge protectors to multi-line communication cables includes a multi-layer printed circuit board, to which has been mounted at least two cable connectors, having multiple female sockets for receiving stand... | 07/22/2008 |
| 7385792 | Electronic control apparatus An electronic control apparatus includes an exclusive power source line for a charge pump circuit which is discriminated from a common power source line. The exclusive power source line is connected to the common power source wiring via a via-hole va having an imped... | 06/10/2008 |
| 7382005 | Circuit component with bump formed over chip A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pil... | 06/03/2008 |
| 7379751 | Multi-band transceiver and radio communication device using the transceiver A multi-band transceiver has a function of sharing transmitted and received signals of multiple frequency bands by the same antenna. The multi-band transceiver mounts multiple filters that correspond to the multiple frequency bands and multiple amplifiers for amplif... | 05/27/2008 |
| 7378601 | Signal transmission structure and circuit substrate thereof A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall ... | 05/27/2008 |
| 7379307 | Wiring board and method for manufacturing the same, and semiconductor device A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings inc... | 05/27/2008 |
| 7375287 | Assembly for accommodating the power electronics and control electronics of an electric motor An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board mounted with power electronic components which has a substrate that no... | 05/20/2008 |
| 7375978 | Method and apparatus for trace shielding and routing on a substrate Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace r... | 05/20/2008 |
| 7372143 | Printed circuit board including via contributing to superior characteristic impedance A via is formed in a printed circuit board to penetrate through an insulating layer. A guard pattern, made of an electrically-conductive material, extends on the front surface of the insulating layer along a circle concentric with the via. An electrically-conductive... | 05/13/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7361988 | Apparatuses and methods to route line to line Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a trace line connected to those input/output pads. A first group of vias... | 04/22/2008 |
