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| Number | Title | Issue Date |
| 8081486 | Electronic module An electronic module has at least one first and one second connecting terminal and power semiconductors which are connected by way of connecting conductors, diodes which are each connected in parallel with the power semiconductors and at least one capacitor, likewis... | 12/20/2011 |
| 7952888 | Wiring module An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating ... | 05/31/2011 |
| 7889513 | Semiconductor device A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for co... | 02/15/2011 |
| 7773388 | Printed wiring board with component mounting pin and electronic device using the same The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semi... | 08/10/2010 |
| 7652895 | Electrically insulating body, and electronic device The invention relates to an electric insulating body (2) provided with a conductor pattern (1) and an electronic device (10) comprising such a body (2) and at least one electronic element (30). According to the invention, the body ... | 01/26/2010 |
| 7542304 | Memory expansion and integrated circuit stacking system and method The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules... | 06/02/2009 |
| 7429786 | Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the first package with the fi... | 09/30/2008 |
| 7400514 | Non-rigid conductor link measurement sensor and method for the production thereof The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed ... | 07/15/2008 |
| 7375432 | Via attached to a bond pad utilizing a tapered interconnect An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed substantially beneath the pad, and one via coupled to one of the five subst... | 05/20/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7348494 | Signal layer interconnects Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by... | 03/25/2008 |
| 7342182 | Printed board A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of ... | 03/11/2008 |
| 7339797 | Chip mount, methods of making same and methods for mounting chips thereon The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in ele... | 03/04/2008 |
| 7323770 | Hybrid integrated circuit device, and method for fabricating the same, and electronic device A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid... | 01/29/2008 |
| 7324348 | Telecommunications chassis and card A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor di... | 01/29/2008 |
| 7309252 | Low profile surface mount connector A low profile connector assembly comprises at least one contact having a surface mount portion and a wire engagement portion extending from the surface mount portion, and a housing insertable over the at least one contact and retained to the at least one contact. Th... | 12/18/2007 |
| 7304376 | Microelectronic assemblies with springs A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding... | 12/04/2007 |
| 7301106 | Image forming apparatus and electronic apparatus In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic ... | 11/27/2007 |
| 7282936 | Die design with integrated assembly aid An upper die portion (36) of a die head for aligning probe pins (14) in first array of first micro-holes (18) formed in lower die portion (12) of the die head, which generally includes a spacer portion (38), a support frame (40 | 10/16/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7248480 | Semiconductor element, manufacturing method thereof, and high frequency integrated circuit using the semiconductor element A semiconductor element comprises a capacitance variable section and an inductor section. In the capacitance variable section, a variable capacitance diode equipped with first and second control electrodes is provided on an insulative substrate. The inductor section... | 07/24/2007 |
| 7243421 | Electrical connection of components A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material forming or being processed to form an electrical connection between the c... | 07/17/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7215555 | Bus bar structure plate and producing method of circuit structure body by using of the same An integrated bus bar structure plate in which a plurality of bus bars are arranged on substantially the one plain face to form an electric power circuit, wherein after the bus bar structure plate having a whole shape in which a plurality of types of electric power ... | 05/08/2007 |
| 7189079 | Electro-formed ring interconnection system Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and ... | 03/13/2007 |
| 7182672 | Method of probe tip shaping and cleaning Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-be... | 02/27/2007 |
| 7173340 | Daisy chaining of serial I/O interface on stacking devices A bottom die and a top die stacked on the bottom die are configured to provide a daisy chain function. Both die include an input/output function control bonding pad (20G), a first bonding pad (20C) controllable to function as either an input or an outp... | 02/06/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
| 7154046 | Flexible dielectric electronic substrate and method for making same A molecularly flexible dielectric electronic substrate for receiving an electronic device has a modulus of elasticity less tan about 500,000 psi. The molecularly flexible dielectric substrate comprises one or more sheets or layers of a molecularly flexible dielectri... | 12/26/2006 |
| 7147484 | Electronic apparatus and board assembly The present invention provides an electronic apparatus and a board assembly which are easy to assemble by increasing their visibility even when a connector is disposed in a position where it is originally difficult to see. The apparatus includes: a board assembly in... | 12/12/2006 |
| 7142000 | Mounting spring elements on semiconductor devices, and wafer-level testing methodology Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the ... | 11/28/2006 |
| 7132736 | Devices having compliant wafer-level packages with pillars and methods of fabrication Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a substrate having a plurality of die pads disposed thereon and a plur... | 11/07/2006 |
| 7129571 | Semiconductor chip package having decoupling capacitor and manufacturing method thereof A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second surface and coupled to the circuit lines, and ball lands provided on th... | 10/31/2006 |
| 7128583 | Grounding element A grounding element attached to a tab having a hole. A spring portion is connected to one side of a bottom of the grounding element and extends in a first direction, and a latching portion is connected to another side of the bottom. When the grounding element is att... | 10/31/2006 |
| 7119362 | Method of manufacturing semiconductor apparatus In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by... | 10/10/2006 |
| 7114985 | Low crosstalk modulator communication connector A modular communications connector includes a housing defining a plug receiving opening, a conductor carrying sled including a printed circuit board designed in conjunction with the conductors to improve crosstalk performance. The connector includes a wire containme... | 10/03/2006 |
| 7115495 | Methods of making projected contact structures for engaging bumped semiconductor devices A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die ... | 10/03/2006 |
