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| Number | Title | Issue Date |
| 8441806 | Circuit board and semiconductor module A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrod... | 05/14/2013 |
| 8441805 | Circuit board mounting structure of compound circuit A structure for mounting a compound circuit on a circuit board is provided. The compound circuit includes a high voltage circuit and a low voltage circuit whose supply voltages are different from each other. The structure includes: a main circuit board on which cons... | 05/14/2013 |
| 8305768 | Secondary battery protecting module and lead mounting method In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be co... | 11/06/2012 |
| 8072771 | Upright circuit board assembly structure An improved upright circuit board assembly structure includes: an electronic component to be mounted on an external device so as for electrical functions of the electronic component to be used; and at least one circuit board including at least one first electrical c... | 12/06/2011 |
| 7864544 | Printed circuit board assembly A printed circuit board assembly includes a first printed circuit board having a plurality of electrical traces that is attached to a second printed circuit board having a plurality of electrical traces in a substantially perpendicular fashion. The first printed cir... | 01/04/2011 |
| 7742311 | Damage prevention interposer for electronic package and electronic interconnect structure An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed ... | 06/22/2010 |
| 7679929 | Wiring board and wiring board module A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and m... | 03/16/2010 |
| 7426118 | Printed wiring board To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a | 09/16/2008 |
| 7417197 | Direct contact power transfer pad and method of making same A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a... | 08/26/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7362589 | Circuit board adapted to couple to different types of add-in cards A circuit board comprising at least one slot provided on a surface of the circuit board. An add-in card can be mated to the slot. The slot comprises a first electrical connection adapted to couple to an add-in card of a first type and a second electrical connection ... | 04/22/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7355862 | Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer... | 04/08/2008 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding proc... | 04/08/2008 |
| 7351072 | Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes ... | 04/01/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7349224 | Semiconductor device and printed circuit board For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost l... | 03/25/2008 |
| 7342182 | Printed board A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of ... | 03/11/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7324344 | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit b... | 01/29/2008 |
| 7323779 | Semiconductor device A semiconductor device includes a semiconductor chip. A stepped member having stepped regions is provided on the semiconductor chip. The stepped member, together with a redistribution layer, is encapsulated by an encapsulating resin layer. The stepped member is exem... | 01/29/2008 |
| 7321493 | Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions c... | 01/22/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7312530 | Semiconductor device with multilayered metal pattern A semiconductor device comprises a first insulating film formed on a semiconductor substrate, a first metal pattern formed on the first insulating film, a second insulating film formed on the first metal pattern, a second metal pattern formed on the second insulatin... | 12/25/2007 |
| 7312402 | Method and apparatus for providing improved loop inductance of decoupling capacitors A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on opposite sides of the capacitor, these vias are moved around to the same sid... | 12/25/2007 |
| 7291909 | BGA type semiconductor device and electronic equipment using the same A BGA type semiconductor device which realizes its high speed operation and high integration density by shortening power supply or grounding wires to reduce its inductance. In the BGA type semiconductor device, the power supply or grounding wires are provided in the... | 11/06/2007 |
| 7292458 | Circuit board assembly having a set of edge clips for connecting multiple boards together A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The motherboard and the daughter board electrically connect to each other thr... | 11/06/2007 |
| 7292046 | Simulated module load A circuit and method of operation for simulating a capacitive load for an integrated circuit or chip. The circuit adds a small capacitor to a test cell that tests the performance of a chip, such as a DRAM memory device, so that it may be tested realistically before ... | 11/06/2007 |
| 7287323 | Materials and structure for a high reliability BGA connection between LTCC and PB boards A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is form... | 10/30/2007 |
| 7283374 | Grow as you go equipment shelf An extendable enclosure for circuit cards provides the capability for a customer to purchase a low cost system up-front, but still allow for growth. The extendable enclosure for circuit cards comprises a first enclosure comprising a backplane, a plurality of circuit... | 10/16/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7264488 | Pickup cap for electrical connector An electrical assembly comprises an electrical connector, and an improved pickup cap that is provided with a surface area configuration that has the potential to impart a more even temperature distribution across the ball grid array during reflow. Some embodiments o... | 09/04/2007 |
| 7262496 | Wiring base with wiring extending inside and outside of a mounting region A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face... | 08/28/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7259335 | Solder-bearing wafer for use in soldering operations A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. Accordi... | 08/21/2007 |
| 7255601 | Cap for an electrical connector An electrical assembly that may include a weighted cap. The weighted cap may provide counterbalancing to a non-proportional ball-grid array connector integrated circuit package for connection with a substrate. The weighted cap provides compensation for variations in... | 08/14/2007 |
| 7251801 | Method of designing circuit board A method of design of a circuit board enabling high density conductor lines to be drawn efficiently. A rats nest is formed by connecting pads to which terminals of an electronic device are connected and external connection terminals by lines. A region with the highe... | 07/31/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7245024 | Electronic assembly with reduced leakage current An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon... | 07/17/2007 |
