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| Number | Title | Issue Date |
| 7532484 | Electronic component assembly An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric ma... | 05/12/2009 |
| 7425756 | Semiconductor device and electronic device This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 09/16/2008 |
| 7400002 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/15/2008 |
| 7394146 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/01/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7371107 | Electrical connector An electrical connector is connected with a circuit board. The electrical connector includes an insulating body and a plurality of pins received in the insulating body. The insulating body is transparent. There is an identification layer on the bottom of the insulat... | 05/13/2008 |
| 7373031 | Apparatus for an electro-optical device connection An optical fiber connector for releasably coupling an optical fiber to an electro-optical module is disclosed. The optical fiber connector includes a housing, a strain relief, a fiber retention clip, and a pair of latching arms. The housing includes a housing bore d... | 05/13/2008 |
| 7368375 | Electronic component with compliant elevations having electrical contact areas and method for producing it An electronic component includes compliant elevations having electrical contact areas for contact-connecting the component to an electronic circuit. The compliant elevations are arranged on a surface of the component and the electrical contact areas are arranged on ... | 05/06/2008 |
| 7365280 | Switch and manufacturing method thereof A switch provided with a fixed contact and a movable contact coming into contact with each other and separating from each other. The surface of at least one of the fixed contact and the movable contact is provided with a plurality of recesses whose edges are overlap... | 04/29/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7342267 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 03/11/2008 |
| 7332757 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 02/19/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7320616 | Insulation displacement connector assembly and system adapted for surface mounting on printed circuit board and method of using same There is provided an insulation displacement connector (IDC) assembly having a main body defining at least one wire channel. The main body has at least one substantially flat surface to which a vacuum nozzle can be affixed in order to pickup the IDC assembly. The ID... | 01/22/2008 |
| 7307339 | Semiconductor device having curved leads offset from the center of bonding pads A semiconductor device including: a substrate on which a plurality of leads are formed; and a semiconductor chip mounted on the substrate in such a manner that a surface of the semiconductor chip having a plurality of electrodes faces the substrate. Each of the lead... | 12/11/2007 |
| 7303427 | Electrical connector with air-circulation features A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating ... | 12/04/2007 |
| 7282789 | Back-to-back semiconductor device assemblies A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semicond... | 10/16/2007 |
| 7279356 | Depopulation of a ball grid array to allow via placement The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of op... | 10/09/2007 |
| 7273398 | Electrical device carrier contact assembly An electrical device carrier contact assembly for installation on a circuit board is disclosed. The contact assembly includes a first electrical contact having a first mounting portion and a first receptacle contact portion; a second electrical contact having a seco... | 09/25/2007 |
| 7268424 | Semiconductor device, electronic card and pad rearrangement substrate A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring ... | 09/11/2007 |
| 7264500 | Portable electronic apparatus with battery engaging terminal A portable electronic apparatus comprises a frame having a recessed portion for receiving a battery. The recessed portion has a bottom portion that has an upper surface on which the battery seats. A circuit board is disposed beneath the frame and has two locking hol... | 09/04/2007 |
| 7253509 | Semiconductor device, electronic card and pad rearrangement substrate A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring ... | 08/07/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7245023 | Semiconductor chip assembly with solder-attached ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint cont... | 07/17/2007 |
| 7242084 | Apparatuses and associated methods for improved solder joint reliability Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or m... | 07/10/2007 |
| 7215019 | Semiconductor chip assembly with pillar press-fit into ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 05/08/2007 |
| 7214881 | High temperature electrical connection An electrical connection is made by connecting a metal element to a second element to which the electrical connection is desired to be made by means of a conductive material disposed onto one or both of the metal element and the second element so as to contact and d... | 05/08/2007 |
| 7211901 | Self-coplanarity bumping shape for flip chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 05/01/2007 |
| 7208410 | Methods relating to forming interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric m... | 04/24/2007 |
| 7208335 | Castellated chip-scale packages and methods for fabricating the same A method for fabricating a chip-scale package includes securing a device substrate that carries at least two adjacent semiconductor devices to a sacrificial substrate. The sacrificial substrate may include conductive elements on a surface thereof, which are located ... | 04/24/2007 |
| 7205178 | Land grid array packaged device and method of forming same A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on ... | 04/17/2007 |
| 7182635 | Stacked microphone jack assembly A stacked microphone jack assembly includes two identical microphone jacks each having a housing, which has a front plughole for receiving a microphone plug and two rows of vertical through holes, and conducting terminals each having a head extending to the inside o... | 02/27/2007 |
| 7167377 | Circuit-constituting unit and method of producing the same A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circui... | 01/23/2007 |
| 7167369 | Methods and apparatus for installing a heat sink using surface mount technology A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder i... | 01/23/2007 |
| 7157791 | Semiconductor chip assembly with press-fit ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, and a ground plane. The pillar is press-fit into an opening in the ground plane, and the ground plane is electri... | 01/02/2007 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices A method of vertically stacking wafers is provided to form three-dimensional (3D) wafer stack. Such method comprising: selectively depositing a plurality of metallic lines on opposing surfaces of adjacent wafers; bonding the adjacent wafers, via the metallic lines, ... | 01/02/2007 |
| 7150387 | Process and apparatus for flow soldering An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material ... | 12/19/2006 |
| 7148082 | Method of making a semiconductor chip assembly with a press-fit ground plane A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, then electrically connecting a conductive trace that includes a pillar and a routing line to the pad, and then press-fitting the pillar into an o... | 12/12/2006 |
| 7143236 | Persistent volatile memory fault tracking using entries in the non-volatile memory of a fault storage unit One embodiment disclosed relates to a method for persistently tracking volatile memory faults. A memory error is detected in relation to at least one dynamic random access memory (DRAM) unit on a particular memory module. An entry pertaining to the memory error is w... | 11/28/2006 |
| 7138653 | Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers Stabilizers to be disposed on a surface of a semiconductor device or test substrate and methods of fabricating and disposing the stabilizers on semiconductor devices and test substrates. Semiconductor devices and test substrates including the stabilizers are also di... | 11/21/2006 |
