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| Number | Title | Issue Date |
| 8174841 | Adaptive interconnect structure An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin m... | 05/08/2012 |
| 8072770 | Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically conn... | 12/06/2011 |
| 8064218 | Multilayer wiring board and electrical connecting apparatus using the same The present invention makes repair easy and reduces effects on the electrical connection conditions of an electronic component to an internal wiring after repair and on the mechanical strength of the repair part in a case of breakage or separation of an electrode fo... | 11/22/2011 |
| 8064219 | Ceramic substrate part and electronic part comprising it A ceramic substrate part comprising on its upper surface pluralities of external electrodes comprising wire-bonding electrodes, each of which comprises a primer layer based on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy containing... | 11/22/2011 |
| 8009437 | Wireless communication modules The present disclosure generally pertains to wireless communication modules that can be used for enabling wireless communication in various applications. A wireless communication module in accordance with one embodiment may be interfaced with other devices, such as ... | 08/30/2011 |
| 7978479 | WLAN SiP module The present invention provides a SiP module for wireless local area network comprising a base. A control unit is formed on a first surface of the base and a RF front end components is formed on a second surface of the base and coupled to the control unit through the... | 07/12/2011 |
| 7972031 | Addressable or static light emitting or electronic apparatus The present invention provides an addressable or static electronic apparatus, such as a light emitting display. An exemplary apparatus comprises a substrate having a plurality of cavities; a plurality of first conductors coupled to the substrate and at least partial... | 07/05/2011 |
| 7929314 | Method and apparatus of changing PCB pad structure to increase solder volume and strength The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming ... | 04/19/2011 |
| 7813142 | Portable electronic device with conducting pole A portable electronic device (20) includes a circuit board (21) and at least one conducting pole (22). The conducting pole is mounted on the circuit board and includes a breakable portion (2224), the breakable portion is configured to be ... | 10/12/2010 |
| 7804693 | Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same There are provided a printed circuit board having a structure for relieving a stress concentration on an outer most lead of leads, due to a difference in thermal expansion coefficients between the semiconductor device and the printed circuit board when the semicondu... | 09/28/2010 |
| 7755911 | Printed wiring board A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring boar... | 07/13/2010 |
| 7684205 | System and method of using a compliant lead interposer The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of ... | 03/23/2010 |
| 7667978 | Electronic package encapsulating electronic components therein An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic compon... | 02/23/2010 |
| 7646611 | Printed circuit board and manufacturing method thereof A plurality of wiring patterns are formed so as to extend in parallel with each other. A plurality of test terminals are formed in a substantially rectangular shape such that respective widths thereof increase toward respective one sides from respective ends of the ... | 01/12/2010 |
| 7489519 | Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend substantially parallel to the integrated circuit, interleaved with sec... | 02/10/2009 |
| 7439622 | Semiconductor device The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting external electrode terminals of the transistors, and first electrode t... | 10/21/2008 |
| 7433202 | Electronic device and method of manufacturing thereof The electronic device comprises a body (40) of electrically insulating material that is provided with a through-hole or cavity. In the cavity or through-hole an electric component (20) is present. This component is attached to the body through an attac... | 10/07/2008 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over... | 09/30/2008 |
| 7426118 | Printed wiring board To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a | 09/16/2008 |
| 7417197 | Direct contact power transfer pad and method of making same A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a... | 08/26/2008 |
| 7414858 | Method of manufacturing an electronic device A semiconductor device (100) comprising a semiconductor substrate (20) and a functional element (31), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element (31) is—at least partially—pres... | 08/19/2008 |
| 7408423 | Semiconductor device and adjusting method for semiconductor device An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and power source noises inside the semiconductor device can be cut. The o... | 08/05/2008 |
| 7405467 | Power module package structure A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips... | 07/29/2008 |
| 7368665 | Circuit board and a power module employing the same A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which... | 05/06/2008 |
| 7364948 | Method for fabricating semiconductor package A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bo... | 04/29/2008 |
| 7362098 | Magnetic field sensor Two coil forming elements (12, 14) formed of conductor layers and a contact means (19), which is formed in an interlayer dielectric film (13) interposed between the conductor layers and brings the upper and lower coil forming elements into conta... | 04/22/2008 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. When the substrate and dice are encased during the molding proc... | 04/08/2008 |
| 7355862 | Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer... | 04/08/2008 |
| 7350281 | Method of protecting a capacitor An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture resistance and low gas and moisture permeability to protect the elect... | 04/01/2008 |
| 7348497 | Mounting structure for electronic components A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step por... | 03/25/2008 |
| 7342215 | Digital camera module package fabrication method A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322... | 03/11/2008 |
| 7342182 | Printed board A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of ... | 03/11/2008 |
| 7339797 | Chip mount, methods of making same and methods for mounting chips thereon The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in ele... | 03/04/2008 |
| 7320604 | Electronic circuit module and method for fabrication thereof Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in ... | 01/22/2008 |
| 7316065 | Method for fabricating a plurality of elastic probes in a row A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shapin... | 01/08/2008 |
| 7312404 | Conductive contamination reliability solution for assembling substrates A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads ... | 12/25/2007 |
| 7301779 | Electronic chip and electronic chip assembly A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip. ... | 11/27/2007 |
| 7301106 | Image forming apparatus and electronic apparatus In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic ... | 11/27/2007 |
| 7291788 | Circuit substrate A circuit substrate includes a base and a plurality of conductive traces. The conductive traces are disposed on the base and on the same layer. The conductive traces include at least one first conductive trace. Wherein, the base has a cut region. The end of the firs... | 11/06/2007 |
| 7291791 | Resin substrate A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over ... | 11/06/2007 |
