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| Number | Title | Issue Date |
| 8154880 | Method and apparatus for active line interface isolation A method and apparatus for active line interface isolation have been described. ... | 04/10/2012 |
| 8102668 | Semiconductor device package with internal device protection An integral impedence is formed on or within a lead frame pin of a semiconductor package and receives a connection from an electrode of a semiconductor die within the package to eliminate the need for adjustment and protective impedences external of the package. The... | 01/24/2012 |
| 8077475 | Electronic device An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 μm. A first thermally conductive layer is applied over the first electrically... | 12/13/2011 |
| 8018731 | Interconnect substrate and electronic circuit mounted structure Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10 | 09/13/2011 |
| 7872875 | Mounting board, height adjusting apparatus and mounting method An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the ... | 01/18/2011 |
| 7796400 | Modular integrated circuit chip carrier An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the... | 09/14/2010 |
| 7573723 | Method for attaching chips in a flip-chip arrangement Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done, except that prior to performing the final curing of the polyimide precu... | 08/11/2009 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic ... | 07/29/2008 |
| 7400513 | Conductive printed board, multicore cable and ultrasonic probe using the same The present invention relates to a conductive printed board which can be used as a common part and therefore offers high productivity, and an ultrasonic probe which uses this conductive printed board. In a conductive printed board having terminals which are provided... | 07/15/2008 |
| 7372129 | Two die semiconductor assembly and system including same A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the die paddle, a second semiconductor die secured by a backside thereof... | 05/13/2008 |
| 7359210 | Shock absorbing system for circuit boards A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may in... | 04/15/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7349224 | Semiconductor device and printed circuit board For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost l... | 03/25/2008 |
| 7332820 | Stacked die in die BGA package Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recess... | 02/19/2008 |
| 7332819 | Stacked die in die BGA package Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with ... | 02/19/2008 |
| 7330357 | Integrated circuit die/package interconnect A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality... | 02/12/2008 |
| 7314816 | Masking layer in substrate cavity A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical con... | 01/01/2008 |
| 7294928 | Components, methods and assemblies for stacked packages A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly e... | 11/13/2007 |
| 7289337 | Electronic card with braced structure The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibr... | 10/30/2007 |
| 7286369 | Pad and electronic device employing the same The present invention discloses a pad and an electronic device employing the same, wherein the pad has an accommodating groove, a ditch disposed around the periphery of the accommodating groove, and at least one guiding groove disposed between the ditch and the acco... | 10/23/2007 |
| 7282793 | Multiple die stack apparatus employing T-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 10/16/2007 |
| 7282794 | Multiple die stack apparatus employing t-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 10/16/2007 |
| 7279363 | Vertically stacked semiconductor device A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a next successive vertically stacked chip is described. The device is ... | 10/09/2007 |
| 7279783 | Partitioned integrated circuit package with central clock driver Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks. ... | 10/09/2007 |
| 7268437 | Semiconductor package with encapsulated passive component A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder Mask Defined pads) and a solder mask are formed on the surface of the su... | 09/11/2007 |
| 7259970 | Substrate, connecting structure and electronic equipment A substrate has an electrical wiring pattern formed thereon, one or a plurality of electrical parts provided thereon, a first contacting part and a second contacting part provided thereon and electrically connected to the electronic parts, and one or a plurality of ... | 08/21/2007 |
| 7245003 | Stacked package electronic device An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched bet... | 07/17/2007 |
| 7245024 | Electronic assembly with reduced leakage current An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon... | 07/17/2007 |
| 7245496 | Circuit board fixer structure A circuit board fixer structure, for fixing a circuit board having at least one through hole, includes a carrier for carrying the circuit board, a pillar, and a stud. The pillar is mounted on the carrier and is formed with a first opening and a second opening corres... | 07/17/2007 |
| 7235880 | IC package with power and signal lines on opposing sides A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect to an IC to be carried by the package, and a second set of low level ... | 06/26/2007 |
| 7233503 | Assembled structure and clamping device thereof An assembled structure. A first substrate having a base surface is connected to a second substrate by at least one metallic clamping device. The clamping device, vertically disposed on the second substrate, comprises two parts: a first half and a second half having ... | 06/19/2007 |
| 7227258 | Mounting structure in integrated circuit module Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determi... | 06/05/2007 |
| 7215045 | Roll-ring conductive wheel A roll-ring conductive wheel is used to conduct electricity between the inner and outer races of rotating or moving parts. The conductive wheel is a thin-walled metal cylinder with a plurality of spokes connecting the outer cylindrical wall to a central hub. The pre... | 05/08/2007 |
| 7211900 | Thin semiconductor package including stacked dies A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The cir... | 05/01/2007 |
| 7208826 | Semiconductor device and method of manufacturing the same Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporti... | 04/24/2007 |
| 7196407 | Semiconductor device having a multi-chip stacked structure and reduced thickness A semiconductor device comprising the multi-chip stack structure that involves improved degree of freedom in routing arrangement and has reduced thickness is provided. A semiconductor device, comprising: a substrate; a lower semiconductor chip provided on the substr... | 03/27/2007 |
| 7180181 | Mesh shaped dam mounted on a substrate A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each ... | 02/20/2007 |
| 7179685 | Fabrication method for stacked multi-chip package A stacked multi-chip package includes a substrate, a first chip and a second chip. The first chip is fixed to the substrate, and is provided with a collar portion which opposes an upper face of the substrate in a state such that a gap is formed between the upper fac... | 02/20/2007 |
| 7170740 | Foldable support structure A foldable support structure suitable for a notebook is provided. The notebook includes a keyboard, a circuit board, and a support frame, disposed above the circuit board for carrying the edge of the keyboard. The support structure is disposed inside an opening of t... | 01/30/2007 |
| 7170757 | Field changeable graphics system for a computing device One embodiment of a field changeable graphics system for a computing device includes a graphics card and an interface assembly. The interface assembly is adapted to interface the graphics card with the motherboard of a computing device, without directly mounting the... | 01/30/2007 |
