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| Number | Title | Issue Date |
| 8125791 | Portable electronic device A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also incl... | 02/28/2012 |
| 7442094 | Telecommunications module A telecommunications module includes a housing, a plurality of contacts, which are exposed to allow the connection of wires herewith, and a connecting device for connecting at least some of the contacts with other contacts of the telecommunications module, wherein t... | 10/28/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7339795 | Structure for fastening a circuit board on a case A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupl... | 03/04/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7330357 | Integrated circuit die/package interconnect A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality... | 02/12/2008 |
| 7326068 | Elastomeric connector and retention member for holding the same A connector assembly includes a first elastomeric connector having a plurality of alternating elastomeric conductors and elastomer insulators. The first elastomeric connector has first and second contact interfaces spaced apart from one another and extending general... | 02/05/2008 |
| 7324347 | Memory card A memory card includes: a main body of the memory card in which a notched section is formed; a semiconductor memory; and a write/nonwrite setting element for setting the write/nonwrite state of data in the semiconductor memory, the write/nonwrite setting element bei... | 01/29/2008 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7301779 | Electronic chip and electronic chip assembly A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip. ... | 11/27/2007 |
| 7293997 | Transceiver mounting adapters A transceiver adapter is provided that includes a substrate, including electrical contacts on a first side thereof for electrically contacting a transceiver, and electrical contacts on a second side thereof for electrically contacting a printed wire assembly. A tran... | 11/13/2007 |
| 7291026 | Memory card connector A memory card connector includes an insulative housing having a terminal-mounting section which mounts a plurality of conductive terminals having contact portions for engaging appropriate contacts on a memory card. The housing at least in part defines a card-receivi... | 11/06/2007 |
| 7280360 | Socket adapted for compressive loading A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isol... | 10/09/2007 |
| 7280365 | Multi-processor module with redundant power One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the proce... | 10/09/2007 |
| 7264482 | Anisotropic conductive sheet An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix memb... | 09/04/2007 |
| 7247932 | Chip package with capacitor A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window ... | 07/24/2007 |
| 7247508 | Semiconductor device with intermediate connector A semiconductor element and a circuit substrate each having electrodes disposed at narrow pitch are electrically connected with high reliability by conductive paste. A semiconductor device with a semiconductor section and a circuit substrate electrically connected a... | 07/24/2007 |
| 7245138 | POGO pin and test socket including the same A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semi... | 07/17/2007 |
| 7240432 | Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. T... | 07/10/2007 |
| 7214566 | Semiconductor device package and method A method of making semiconductor device packages includes the steps of attaching a wafer to a dielectric layer, testing semiconductor devices in the wafer, and then dicing the layered assembly. The dielectric layer may be, for example, a flexible tape. The semicondu... | 05/08/2007 |
| 7207107 | Method and device for through-hole plating of substrates and printed circuit boards A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a c... | 04/24/2007 |
| 7198734 | IC socket The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, d... | 04/03/2007 |
| 7192806 | Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, i... | 03/20/2007 |
| 7193300 | Plastic leadframe and compliant fastener Packaging assembly method and systems include the use of a plastic substrate and one or more compliant fasteners, which can be connected to the plastic substrate, such that the compliant fastener provides an electrical connection to one or more electrical components... | 03/20/2007 |
| 7188413 | Method of making a microelectronic package A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the dielectric in alignment with the apertures. Top and bottom conductive feature... | 03/13/2007 |
| 7186123 | High density connector and method of manufacture Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact exte... | 03/06/2007 |
| 7185426 | Method of manufacturing a semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 03/06/2007 |
| 7180752 | Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications A method and structures are provided for implementing enhanced reliability for printed circuit board high power dissipation applications. An external return current member provides a return current path outside of the printed circuit board, thereby minimizing power ... | 02/20/2007 |
| 7168964 | High density connector and method of manufacture Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact exte... | 01/30/2007 |
| 7170165 | Circuit board assembly with a brace surrounding a ball-grid array device An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is... | 01/30/2007 |
| 7168797 | Ink container An ink container includes an ink container body and a memory attached to the ink container body for storing predetermined information. The memory is bonded to a part of the surface of the ink container body at its surface opposed to the surface of the ink container ... | 01/30/2007 |
| 7170187 | Low stress conductive polymer bump Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dend... | 01/30/2007 |
| 7167379 | Micro-spring interconnect systems for low impedance high power applications An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring ... | 01/23/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
| 7145354 | Resilient probes for electrical testing An apparatus for electrical testing having probes (201) constructed of metal elements (201a) of about equal size bonded together in substantially linear sequence. Further an insulating holder (202) having first and second surfaces and a p... | 12/05/2006 |
| 7145238 | Semiconductor package and substrate having multi-level vias A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 12/05/2006 |
| 7137836 | Card connector with detect switch A memory card connector adapted for connecting a memory card to a PCB comprises an insulative housing (10) defining a receiving portion for receiving a memory card therein, a plurality of terminals (20) received in the housing, a switch contact (40 | 11/21/2006 |
| 7136288 | Memory device A memory device is provided with a memory chip and a controller, which can be connected to a computer via a USB connector. The memory device is implemented in the form of a flat memory card, wherein the USB connector is movable between a position of rest, in which t... | 11/14/2006 |
| 7130195 | Electronic apparatus An electronic apparatus includes a heat-generating device mounted on a surface of a printed circuit board and is surrounded with wall members of a housing. The wall members are connected to a ground electrode on the other surface of the printed circuit board, the gr... | 10/31/2006 |
