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| Number | Title | Issue Date |
| 8179690 | Cut-edge positioning type soldering structure and method for preventing pin deviation A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two s... | 05/15/2012 |
| 8139370 | Electronic system having field effect transistors and interconnect bumps on a semiconductor substrate A method and system for a FET cell is presented. The FET cell includes multiple individual transistors and interconnect bumps that are configured to flip-chip connect to a substrate. The substrate may have the majority of a matching structure for the FET cell. Furth... | 03/20/2012 |
| 7894203 | Multilayer printed wiring board A multi-layer printed wiring board including a first substrate having an opening and having external terminals positioned to be connected to a package substrate, a second substrate laminated to the first substrate and having external terminals positioned to be conne... | 02/22/2011 |
| 7436063 | Packaging substrate and semiconductor device A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring pr... | 10/14/2008 |
| 7436682 | Wiring board, electronic component mounting structure, and electronic component mounting method A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are formed at smaller spacings. The method comprises: placing a semiconductor... | 10/14/2008 |
| 7371973 | Contact node The contact node comprises at least two metallized contacts coupled with conductive paths arranged on surfaces of connection layers made on the base of a dielectric material and mutually aligned and interconnected electrically and mechanically by conductive binding ... | 05/13/2008 |
| 7363706 | Method of manufacturing a multilayer printed wiring board This invention provides a multilayer printed wiring board having flat via holes. This is a multilayer printed wiring board formed by alternately laminating multiple metal foils and insulating layers, in which an interlayer connection via pad provided in a first insu... | 04/29/2008 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantiall... | 04/22/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
| 7355126 | Electronic parts packaging method and electronic parts package An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutua... | 04/08/2008 |
| 7355274 | Semiconductor package, manufacturing method thereof and IC chip A package may include a lower unit package and an upper unit package. Each of the unit packages may include a circuit substrate having a lower surface and an upper surface. Wire bonding pads may be provided of the lower surface of the circuit substrate, and chip bon... | 04/08/2008 |
| 7355128 | Wired circuit board A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution... | 04/08/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7342308 | Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon... | 03/11/2008 |
| 7338299 | Surface mounted electronic component An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first solde... | 03/04/2008 |
| 7335531 | Semiconductor device package and method of production and semiconductor device of same A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board o... | 02/26/2008 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic ele... | 02/26/2008 |
| 7326859 | Printed circuit boards having pads for solder balls and methods for the implementation thereof A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after... | 02/05/2008 |
| 7294928 | Components, methods and assemblies for stacked packages A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly e... | 11/13/2007 |
| 7294904 | Integrated circuit package with improved return loss A packaged integrated circuit includes an integrated circuit and a package substrate. A trace in the package substrate includes a first portion and a second, high-inductance, portion. The high-inductance portion of the trace is proximate to a port of the integrated ... | 11/13/2007 |
| 7291916 | Signal transmission structure and circuit substrate thereof A signal transmission structure suitable for a multi-layer circuit substrate comprising a core layer and at least a dielectric layer is provided. The signal transmission structure according to the present invention comprises a first via landing pad and a reference p... | 11/06/2007 |
| 7265994 | Underfill film for printed wiring assemblies A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surf... | 09/04/2007 |
| 7221058 | Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provid... | 05/22/2007 |
| 7217584 | Bonded thin-film structures for optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 05/15/2007 |
| 7208348 | Methods of fabricating a via-in-pad with off-center geometry The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as ... | 04/24/2007 |
| 7177489 | Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 02/13/2007 |
| 7171742 | Method and system for assembling a printed circuit board using a land grid array A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fastener... | 02/06/2007 |
| 7170155 | MEMS RF switch module including a vertical via An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electricall... | 01/30/2007 |
| 7167375 | Populated printed wiring board and method of manufacture A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic sold... | 01/23/2007 |
| 7161371 | Module part A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more com... | 01/09/2007 |
| 7157646 | Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g... | 01/02/2007 |
| 7157926 | Universal padset concept for high-frequency probing A universal, substrate Padset for de-embedding pad and signal line parasitics has an input pad group including a first input signal pad and a first ground pad; an output pad group including a first output signal pad and a second ground pad; a first input-signal-rout... | 01/02/2007 |
| 7157647 | Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open se... | 01/02/2007 |
| 7149388 | Low loss contact structures for silicon based optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 12/12/2006 |
| 7135377 | Semiconductor package substrate with embedded resistors and method for fabricating same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 11/14/2006 |
| 7135397 | Method and system for packaging ball grid arrays According to one embodiment of the invention, a method of packaging ball grid arrays includes providing a substrate having a plurality of holes formed therein. Each hole is associated with a respective one of a plurality of contact pads formed on a first surface of ... | 11/14/2006 |
| 7132608 | Electronic device having side electrode, method of manufacturing the same, and apparatus using the same A film having a recess provided in a surface of the film is provided. The recess included a first portion and a second portion connected with the first portion. The second portion is deeper than the first portion. The recess in the film is filled with a conductive p... | 11/07/2006 |
| 7129578 | Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body A lead frame comprises a lead frame body having cut-away portions cut away from the side surfaces of the lead frame body, a die pad for securing a semiconductor chip, bonding electrodes surrounding the die pad, external electrodes for allowing the lead frame to be m... | 10/31/2006 |
| 7126829 | Adapter board for stacking Ball-Grid-Array (BGA) chips Electronic devices packaged with arrayed solder balls, leads, or pads, such as Ball Grid Array (BGA) devices, are stacked together. Each stack has a bottom adapter card with metal contacts on a top surface in an array to match the array of solder balls of a lower BG... | 10/24/2006 |
| 7122874 | Electronic package having a sealing structure on predetermined area, and the method thereof An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing ... | 10/17/2006 |
