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| Number | Title | Issue Date |
| 8139369 | Printed wiring board solder pad arrangement A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes ... | 03/20/2012 |
| 8130509 | Package carrier A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected wit... | 03/06/2012 |
| 8125790 | OC2 oriented connections 2 The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies ... | 02/28/2012 |
| 8125789 | Wiring substrate and electronic device A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a... | 02/28/2012 |
| 8116092 | Circuit board and method of manufacturing same A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and... | 02/14/2012 |
| 8116093 | Printed circuit board and semiconductor module having the same A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first... | 02/14/2012 |
| 8116094 | Printed circuit board and mounting structure for surface mounted device The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package ... | 02/14/2012 |
| 8102667 | Method and apparatus for spatially optimizing surface mount pads on a ball grid array package Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or e... | 01/24/2012 |
| 8102666 | Integrated circuit package system An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the ope... | 01/24/2012 |
| 8098496 | Wiring board for semiconductor device A wiring board for a semiconductor device has a substrate, a solder resist provided on the substrate, a land, and a wiring line. The solder resist is not in contact with the land, and an end portion of the wiring line is arranged such that, when a solder ball is not... | 01/17/2012 |
| 8094460 | Orientation-tolerant land pattern and method of manufacturing the same A land pattern, a method of manufacturing a printed circuit board (PCB) and a PCB incorporating a land pattern. In one embodiment, the land pattern includes: (1) a quadrilateral component outline area having diagonally opposed first and second corners and diagonally... | 01/10/2012 |
| 8089775 | Multileveled printed circuit board unit including substrate interposed between stacked bumps Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The int... | 01/03/2012 |
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff struct... | 12/27/2011 |
| 8068333 | Printed circuit board assembly A PCB assembly includes a PCB. The PCB includes a detecting pad, a detecting voltage terminal and the controller. The detecting pad includes an accessing layer and a grounding layer. The grounding layer is connected to the ground. The accessing layer is electrically... | 11/29/2011 |
| 8059424 | Electronic board incorporating a heating resistor An electronic board including an area forming a BGA type electronic component backing, and an electric heating resistor which supplies an amount of heat for soldering the component onto the plate is disclosed. The board includes a plurality of conductive layers alte... | 11/15/2011 |
| 8050048 | Lead frame with solder flow control A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibi... | 11/01/2011 |
| 8045334 | Component adapted for being mounted on a substrate and a method of mounting a surface mounted device A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (... | 10/25/2011 |
| 8031477 | System and method for coupling a lens to a printed circuit An optical assembly is disclosed which may include a lens having first and second electrodes; and a flexible printed circuit (FPC) configured for placement in proximity to the lens, wherein the FPC may include a bottom insulating layer; a top insulating layer; and a... | 10/04/2011 |
| 7995353 | Circuit board and electronic device using the same A circuit board includes four positioning pads placed on a surface of the circuit board, four positioning holes corresponding to the positioning pads, respectively, and a solder mask placed on the surface around the periphery of the positioning pads. An arc-shaped r... | 08/09/2011 |
| 7990734 | Semiconductor memory module with reverse mounted chip resistor A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits c... | 08/02/2011 |
| 7974102 | Integrated circuit carrier assembly Provided is a carrier assembly for an integrated circuit. The assembly includes a printed circuit board (PCB), and a carrier fast with the PCB. The carrier has a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection ... | 07/05/2011 |
| 7957155 | System for attaching a substantially three-dimensional structure to a substantially two-dimensional structure A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a t... | 06/07/2011 |
| 7916496 | Printed circuit board and electronic apparatus having printed circuit board According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting... | 03/29/2011 |
| 7916495 | Universal solder pad A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second... | 03/29/2011 |
| 7911803 | Current distribution structure and method An electrical structure and method of forming. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive p... | 03/22/2011 |
| 7889511 | Electronic carrier board applicable to surface mount technology An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings ... | 02/15/2011 |
| 7876571 | Wiring board and method of manufacturing wiring board A board comprises a cavity for placing an electronic component on a base, a pair of pads for mounting said electronic component, each of said pads is formed on said base, a pair of through holes piercing through said board from said base, each of said through holes ... | 01/25/2011 |
| 7872874 | Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed... | 01/18/2011 |
| 7855895 | Universal PCB and smart card using the same A smart card is provided including a body with a cavity, an IC chip inserted into the cavity, and a universal PCB on which the IC chip can be mounted and electrically contacted regardless of its size, type and bonding structure. The universal PCB comprises groups of... | 12/21/2010 |
| 7839652 | Semiconductor device and printed circuit board For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost l... | 11/23/2010 |
| 7835158 | Connection verification technique Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit ... | 11/16/2010 |
| 7817441 | Circuit board Provided is a circuit board including: a circuit board body with at least one surface having a plurality of electrically connecting pads; an insulating protection layer formed on the circuit board body and formed with an opening corresponding in position to one of t... | 10/19/2010 |
| 7778040 | Printed circuit board assembly A printed circuit board assembly includes: a substrate; a main signal line formed on the substrate to transmit a signal; an SMD mounted on the substrate; a pad interposed between the SMD and the substrate; and a sub signal line provided on the substrate to electrica... | 08/17/2010 |
| 7746660 | Reduced mounting inductance and increased self-resonant frequency range Reduced mounting inductance and/or an increased self-resonant frequency range of operation for capacitor circuits of a circuit board is described. The circuit board has a mounting pad for coupling a capacitor to at least three vias arranged in a pattern and coupled ... | 06/29/2010 |
| 7738258 | Semiconductor mounting board A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30... | 06/15/2010 |
| 7719853 | Electrically connecting terminal structure of circuit board and manufacturing method thereof An electrically connecting terminal structure of a circuit board and a manufacturing method thereof are disclosed. The method includes: providing a circuit board defined with first and second predetermined areas; forming the first electrically connecting pad in the ... | 05/18/2010 |
| 7710739 | Semiconductor device and display device If misalignment in a line width direction of an electrode (pad) of a connection terminal is caused in attachment of a substrate and an FPC, a connection area of the FPC terminal and the connection terminal becomes smaller and contact resistance is increased. In part... | 05/04/2010 |
| 7679927 | Electronic device assembly with transfer card An electronic device assembly includes an electronic device, a transfer card configured for connecting the electronic device to another electronic device, and a fixing board for mounting the transfer card to the electronic device. The electronic device includes a fr... | 03/16/2010 |
| 7679928 | System-in-package module and mobile terminal having the same Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while ... | 03/16/2010 |
| 7660129 | Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 1 includes a plurality of pads... | 02/09/2010 |
