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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 8174840 | Multi-functional composite substrate structure A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be f... | 05/08/2012 |
| 8149585 | Interposer and electronic device using the same Means for Solution: This interposer (10) comprises the silicon substrate (12), a plurality of through-hole conductors (20) formed on the above-described silicon substrate, and a capacitor (15) formed with the upper electrodes (14) ... | 04/03/2012 |
| 8144480 | Multi-layer embedded capacitance and resistance substrate core A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of ... | 03/27/2012 |
| 8068347 | Printed circuit board having embedded RF module power stage circuit Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a ... | 11/29/2011 |
| 7936568 | Capacitor built-in substrate and method of manufacturing the same and electronic component device A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by... | 05/03/2011 |
| 7903427 | Semiconductor device structure and semiconductor device incorporating same A semiconductor device structure includes a semiconductor substrate, a resistor layer, and a capacitor layer. The resistor layer is configured to overlie the semiconductor substrate. The resistor layer has a resistor disposed therewithin. The capacitor layer is conf... | 03/08/2011 |
| 7876570 | Module with embedded electronic components In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed ... | 01/25/2011 |
| 7813141 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More spec... | 10/12/2010 |
| 7791897 | Multi-layer embedded capacitance and resistance substrate core A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of ... | 09/07/2010 |
| 7764509 | Method and apparatus for interfacing components An apparatus operable to interface an electronic component with a signal input. The apparatus may generally include a low-ohm resistor and a voltage translator coupled with the low-ohm resistor. The low-ohm resistor is operable to couple with the input to receive an... | 07/27/2010 |
| 7675756 | Thin film-capacitor-embedded printed circuit board and method of manufacturing the same Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode... | 03/09/2010 |
| 7667977 | Mounting board, mounted body, and electronic equipment using the same The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film ... | 02/23/2010 |
| 7630208 | Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pa... | 12/08/2009 |
| 7573721 | Embedded passive device structure and manufacturing method thereof Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the sam... | 08/11/2009 |
| 7561438 | Electronic device incorporating a multilayered capacitor formed on a printed circuit board An electronic device. The device comprises a printed circuit board, a multilayered capacitor formed on the printed circuit board, and a conductive strip disposed on a top surface of the printed circuit board. The conductive strip interconnects to the multilayered ca... | 07/14/2009 |
| 7515435 | Multi-functional composite substrate structure A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be f... | 04/07/2009 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7436678 | Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the n... | 10/14/2008 |
| 7436681 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 10/14/2008 |
| 7429510 | Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements... | 09/30/2008 |
| 7430128 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More spec... | 09/30/2008 |
| 7423514 | Constant-power constant-temperature resistive network A thermally stabilized device is described. Single or multiple input ports are accommodated and single and multiple power ports are described. The variation of resistance of a resistor subject to varying power dissipations is minimized by injecting complementary pow... | 09/09/2008 |
| 7417869 | Methods and systems for filtering signals The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. ... | 08/26/2008 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 07/15/2008 |
| 7394663 | Electronic component built-in module and method of manufacturing the same An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair ... | 07/01/2008 |
| 7391342 | Low-cost keypad encoding circuit A keypad encoding circuit contains a voltage dividing network and an integrated circuit. The voltage dividing network includes a string of resistors that generates an encoding signal voltage. The integrated circuit converts the encoding signal voltage into a digital... | 06/24/2008 |
| 7382627 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the n... | 06/03/2008 |
| 7375977 | Multilayered electronic component A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to ... | 05/20/2008 |
| 7372170 | Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding packag... | 05/13/2008 |
| 7368825 | Power semiconductor device The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a back surface; a capacitor disposed on the front surface side of the se... | 05/06/2008 |
| 7348183 | Self-contained microelectrochemical bioassay platforms and methods Methods and devices for improved chemical and biomass detection assays combined well defined microstructures having independently addressable electrodes with various surface immobilization electrochemical assays. Combining known chemical detection immobilization ass... | 03/25/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7345889 | Method and system for reducing radiated energy emissions in computational devices A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a printed circuit board (PCB) and adjacent the PCB conductive traces act as ... | 03/18/2008 |
| 7342804 | Ball grid array resistor capacitor network An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is fo... | 03/11/2008 |
| 7342802 | Multilayer wiring board for an electronic device To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers.... | 03/11/2008 |
| 7335531 | Semiconductor device package and method of production and semiconductor device of same A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board o... | 02/26/2008 |
| 7336501 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 02/26/2008 |
| 7327582 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 02/05/2008 |
| 7321496 | Flexible substrate, multilayer flexible substrate and process for producing the same A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the... | 01/22/2008 |
| 7319599 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 01/15/2008 |
