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| Number | Title | Issue Date |
| 8184448 | Bare chip embedded PCB A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at ... | 05/22/2012 |
| 8120925 | Circuit device A circuit device includes a dielectric substrate including a first face and a second face opposite side of the first face; a coplanar line including a first line, a second line and ground electrodes, the first line and the second line being decupled mutually, the gr... | 02/21/2012 |
| 8085549 | Circuit device The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The fi... | 12/27/2011 |
| 8064217 | Component embedded printed circuit board A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first in... | 11/22/2011 |
| 8050047 | Integrated circuit package system with flexible substrate and recessed package An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnect... | 11/01/2011 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsu... | 10/04/2011 |
| 7957154 | Multilayer printed circuit board A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnet... | 06/07/2011 |
| 7929313 | Method of manufacturing multilayer printed circuit board In a method of manufacturing a multilayer printed circuit board, a first insulating resin base material is formed. A resin surface of a second insulating resin base material formed by attaching copper foil on a surface of a resin-insulating layer is unified with the... | 04/19/2011 |
| 7864543 | Printed circuit board A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substr... | 01/04/2011 |
| 7835157 | System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated ... | 11/16/2010 |
| 7808799 | Wiring board A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on... | 10/05/2010 |
| 7791896 | Providing an embedded capacitor in a circuit board A circuit board includes power reference layers and a capacitor provided between the power reference layers such that a shorter dimension of the capacitor defines a space between the power reference layers. The capacitor has plural conductive plates and plural diele... | 09/07/2010 |
| 7755910 | Capacitor built-in interposer and method of manufacturing the same and electronic component device A capacitor built-in interposer of the present invention, includes a base resin layer, a capacitor first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively whe... | 07/13/2010 |
| 7606047 | Module with embedded electronic components In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed ... | 10/20/2009 |
| 7583512 | Printed circuit board including embedded passive component Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of term... | 09/01/2009 |
| 7508680 | Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate An adjustable-inductance (AI) filter, a tape distribution substrate including the filter, and a display panel assembly including the tape distribution substrate are provided. The adjustable-inductance (AI) filter includes a filter distribution line including first a... | 03/24/2009 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7440289 | Memory module A memory module includes a memory chip MC1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC3 disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC11 dis... | 10/21/2008 |
| 7436681 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 10/14/2008 |
| 7430128 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More spec... | 09/30/2008 |
| 7369028 | Coil component A coil component includes a first coil block and a second coil block that are sandwiched between magnetic substrates so as to form a chip body, and external electrodes that are attached to the chip body. The first coil block includes a coil body and an insulating bo... | 05/06/2008 |
| 7366629 | High frequency module board device The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose m... | 04/29/2008 |
| 7342803 | Printed circuit board and method of manufacturing printed circuit board A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substr... | 03/11/2008 |
| 7342768 | Active balancing modular circuits Provided are active balancing modules that control voltage imbalances between capacitors stacked in a series arrangement and methods for their manufacture. These modules are simple and inexpensive to manufacture, and versatile. They may be used alone or they may be ... | 03/11/2008 |
| 7342804 | Ball grid array resistor capacitor network An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is fo... | 03/11/2008 |
| 7339798 | Electronic assemblies and systems comprising interposer with embedded capacitors To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer... | 03/04/2008 |
| 7336501 | Wiring board with built-in capacitor The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structur... | 02/26/2008 |
| 7331797 | Electrical connector and a manufacturing method thereof A manufacturing method for an electrical connector is provided. The electrical connector includes a main portion and a plurality of supporting members that are connected with the main portion. The supporting members are applied with a plurality of metal layers there... | 02/19/2008 |
| 7329458 | Wiring member and method of manufacturing the same Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well as to a second major surface of the porous substrate, and a conductive... | 02/12/2008 |
| 7327582 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 02/05/2008 |
| 7323762 | Semiconductor package substrate with embedded resistors and method for fabricating the same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 01/29/2008 |
| 7317622 | Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt compri... | 01/08/2008 |
| 7315455 | Surface-mounted electronic component module and method for manufacturing the same More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns f... | 01/01/2008 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7307852 | Printed circuit board and method for manufacturing printed circuit board Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are ... | 12/11/2007 |
| 7301779 | Electronic chip and electronic chip assembly A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip. ... | 11/27/2007 |
| 7294933 | Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin ... | 11/13/2007 |
| 7295027 | Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet A semiconductor device socket, in which a semiconductor device is installed, includes a support member on which a substrate is placed, an anisotropic conductive sheet that acts as an intermediary in electric connection between the substrate and the semiconductor dev... | 11/13/2007 |
| 7286366 | Multilayer circuit board with embedded components and method of manufacture A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and... | 10/23/2007 |
| 7286367 | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the r... | 10/23/2007 |
