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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8179689 | Printed circuit board, method of fabricating printed circuit board, and semiconductor device A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a po... | 05/15/2012 |
| 8139368 | Component-containing module A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit elemen... | 03/20/2012 |
| 8130508 | Electronic component embedded printed circuit board and manufacturing method thereof A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic... | 03/06/2012 |
| 8116091 | Printed circuit board A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure h... | 02/14/2012 |
| 8111520 | Semiconductor module A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that crac... | 02/07/2012 |
| 8107253 | Printed circuit board A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating lay... | 01/31/2012 |
| 8107254 | Integrating capacitors into vias of printed circuit boards A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor i... | 01/31/2012 |
| 8085548 | Circuit for suppressing electromagnetic interference, implementation structure and electronic apparatus implementing the same There is provided a circuit substrate to be mounted in an electronic apparatus, and the circuit substrate has a power supply and a GND. The GND of the circuit substrate is electrically connected to GNDs of other components of the electronic apparatus through connect... | 12/27/2011 |
| 8064214 | Press fit passive component A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of t... | 11/22/2011 |
| 8064216 | Edge connector An edge connector includes, a multilayer printed board having an inner layer and a connector edge, an electronic circuit disposed on the multilayer printed board, an electrical terminal on the multilayer printed board and spaced by a predetermined clearance from the... | 11/22/2011 |
| 8064215 | Semiconductor chip package and printed circuit board A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the oth... | 11/22/2011 |
| 8059423 | Enhanced localized distributive capacitance for circuit boards A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductiv... | 11/15/2011 |
| 8050045 | Electronic component and method of manufacturing the same The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost ... | 11/01/2011 |
| 8018730 | Power converter apparatus A power converter apparatus includes a substrate 22 on which switching elements Q, Q1 to Q6 are mounted, positive and negative terminal interconnection members 27, 28 mounted on the substrate, and a capacitor 17 having a positive t... | 09/13/2011 |
| 7995352 | Printed circuit board Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large th... | 08/09/2011 |
| 7983055 | Printed circuit board with embedded cavity capacitor A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a... | 07/19/2011 |
| 7978478 | Printed circuit board A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substr... | 07/12/2011 |
| 7911802 | Interposer, a method for manufacturing the same and an electronic circuit package An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and seco... | 03/22/2011 |
| 7898818 | Variably orientated capacitive elements for printed circuit boards and method of manufacturing same Variably oriented capacitive elements for printed circuit boards (PCBs) and method of manufacturing the same. In one form the disclosure, a PCB can include a first multiple-layered capacitor including a first orientation and placed along a surface operable to mount ... | 03/01/2011 |
| 7894202 | Multilayer capacitor A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P≧Ra and P≧W are established, wherein P represents the average projection height of first and second via c... | 02/22/2011 |
| 7881070 | Circuit board having power source A circuit board having a power source is provided, including: a carrier board having a first dielectric layer disposed on at least a surface thereof and a first circuit layer disposed on the first dielectric layer, wherein the first circuit layer has at least an ele... | 02/01/2011 |
| 7881069 | Printed circuit board A chip capacitor is provided in a core substrate of a printed circuit board. This makes it possible to shorten a distance between an IC chip and the chip capacitor and to reduce loop inductance. Since the core substrate is constituted by provided a first resin subst... | 02/01/2011 |
| 7864542 | Printed circuit board A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substr... | 01/04/2011 |
| 7855894 | Printed circuit board Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are ... | 12/21/2010 |
| 7843702 | Printed circuit board having embedded RF module power stage circuit Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a ... | 11/30/2010 |
| 7839651 | Multilayer ceramic electronic component In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The cer... | 11/23/2010 |
| 7817439 | System and apparatus for power distribution for a semiconductor device Systems, methods and apparatuses for low noise power distribution networks for use with semiconductor devices are disclosed. Embodiments of these systems and methods provide a power distribution network comprising a set of individual power distribution networks, eac... | 10/19/2010 |
| 7817440 | Multilayer printed wiring board A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected t... | 10/19/2010 |
| 7813140 | Methods and systems for filtering signals The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board. ... | 10/12/2010 |
| 7808798 | Versatile Si-based packaging with integrated passive components for mmWave applications An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wher... | 10/05/2010 |
| 7804692 | Method and system for placing multiple loads in a high-speed system A method and system for placing multiple loads in a high-speed system are disclosed. In one embodiment, the first load and the second load are placed on the first side and the second side of the printed circuit board, respectively. In addition, the first signal pin ... | 09/28/2010 |
| 7778038 | Power core devices and methods of making thereof The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least on... | 08/17/2010 |
| 7778039 | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Substrates having power and ground planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a power plane and a ground plane. The noise suppress... | 08/17/2010 |
| 7738257 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same A microelectronic device, a method of fabricating the device, and a system including the device. The device includes: a substrate including a polymer build-up layer, and a passive structure embedded in the substrate. The passive structure includes a top conductive l... | 06/15/2010 |
| 7719852 | Electronic component, mounting structure of electronic component A high-reliability electronic component without reduction in insulation resistance under high-temperature and high-humidity conditions has satisfactory solderability of external electrodes. The electronic component includes a main body and external electrodes dispos... | 05/18/2010 |
| 7697301 | Printed circuit board having embedded electronic components and manufacturing method thereof A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core... | 04/13/2010 |
| 7679926 | Capacitors with insulating layer having embedded dielectric rods A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The in... | 03/16/2010 |
| 7663892 | Printed circuit board having embedded RF module power stage circuit Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a ... | 02/16/2010 |
| 7626828 | Providing a resistive element between reference plane layers in a circuit board A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive path between the reference plane layers. Optimally, a decoupling capac... | 12/01/2009 |
| 7623353 | Securing an electrical sub-circuit assembly to a printed circuit board An electrical sub-circuit assembly is secured to a printed circuit board by providing a printed circuit board with a basin, the printed circuit board having electrical pathways leading to the top or side or on the bottom of said basin, and positioning an electrical ... | 11/24/2009 |
