Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 8085547 | Electronic elements carrier An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined b... | 12/27/2011 |
| 7944707 | Package structure for connection with output/input module A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontal... | 05/17/2011 |
| 7570494 | Structure of flexible printed circuit board A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wir... | 08/04/2009 |
| 7453705 | Barrier, such as a hermetic barrier layer for O/PLED and other electronic devices on plastic A protective layer for an electronic device and devices with a protective layer. In one exemplary embodiment, the protective layer includes two different layers which can be etched by the same etchant as which are at least one of optically or RF transparent. ... | 11/18/2008 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7433202 | Electronic device and method of manufacturing thereof The electronic device comprises a body (40) of electrically insulating material that is provided with a through-hole or cavity. In the cavity or through-hole an electric component (20) is present. This component is attached to the body through an attac... | 10/07/2008 |
| 7430127 | Electronic circuit board An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O device and an O/E device are provided in the optical wiring layer or ... | 09/30/2008 |
| 7359693 | Enclosure and substrate structure for a tuner module A tuner module comprising a tuner and a tuner enclosure. The tuner includes a substrate containing filter coils and the tuner enclosure includes at least one partition plate placed between filter coils of the tuner to improve the isolation between the filter coils. ... | 04/15/2008 |
| 7355128 | Wired circuit board A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution... | 04/08/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7348069 | Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate A first ceramic substrate includes a substrate (2) and a glaze layer (3), wherein the glaze layer has a surface having an Ra of 0.02 μm or less and a Ry of 0.25 μm or less. A second ceramic substrate is formed by subjecting a glass layer (24) ... | 03/25/2008 |
| 7342181 | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a sec... | 03/11/2008 |
| 7339795 | Structure for fastening a circuit board on a case A structure for fastening a circuit board on a case includes a strut which has one end coupled on the case and other end coupled on the circuit board, and a coupling member which has two distal ends with surfaces not parallel with each other. One distal end is coupl... | 03/04/2008 |
| 7332231 | Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same A ceramic substrate for a thin film electronic component, a production method thereof, and a thin film electronic component using the ceramic substrate A first substrate (1) includes a dense glass-ceramic mixed layer (33) containing glass in its surfac... | 02/19/2008 |
| 7332799 | Packaged chip having features for improved signal transmission on the package A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together f... | 02/19/2008 |
| 7321167 | Flex tape architecture for integrated circuit signal ingress/egress In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodi... | 01/22/2008 |
| 7316755 | Method of producing multi-terminal type laminated ceramic electronic component In a method of producing a multi-terminal type laminated ceramic electronic component in which internal electrodes are embedded in a sintered ceramic member, and the internal electrodes have plural first lead-out electrodes led out to a first side surface and plural... | 01/08/2008 |
| 7317250 | High density memory card assembly A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate. First and second digital memory devices (e.g., TSOP packages or bare sem... | 01/08/2008 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7305760 | System and method for capacitive coupled via structures in information handling system circuit boards Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance,... | 12/11/2007 |
| 7304248 | Multi-layer printed circuit board and method for manufacturing the same A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film incl... | 12/04/2007 |
| 7282648 | Capacitor-embedded PCB having blind via hole and method of manufacturing the same The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric... | 10/16/2007 |
| 7262974 | Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs A circuit board has a first component interface configured to connect to a first circuit board component, a second component interface configured to connect to a second circuit board component, a differential signal pair electrically connecting the first component i... | 08/28/2007 |
| 7230187 | Printed wire board and associated mobile terminal A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive ... | 06/12/2007 |
| 7230332 | Chip package with embedded component A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection s... | 06/12/2007 |
| 7226654 | Laminated wiring board and its mounting structure A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers ... | 06/05/2007 |
| 7220287 | Method for tuning an embedded capacitor in a multilayer circuit board Exemplary techniques for tuning the effective capacitance provided by an embedded capacitor are disclosed. The techniques may be realized by modifying one or more conductive features of one or more vias connected to the embedded capacitor to adjust the capacitance c... | 05/22/2007 |
| 7221960 | Mobile telephone device comprising multiwire electrical connection devices Described is a high-frequency connecting device comprising a first connecting element and a second connecting element which in the connecting position are in electrical contact without engaging into each other, forming a coaxial connection. The first connecting elem... | 05/22/2007 |
| 7215531 | Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provide... | 05/08/2007 |
| 7199664 | Integrated switchless programmable attenuator and low noise amplifier An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programable attenuation and a programable gain low noise amplifier. Frequency conversion circu... | 04/03/2007 |
| 7196633 | Integrated radio tower light controller and alarm reporting device An integrated radio tower light controller and alarm reporting device is described that is made up of solid-state current sensing modules that monitor the AC current distributed to the various lights/beacons and report various alarm modes. In addition, a solid-state... | 03/27/2007 |
| 7190592 | Integrated library core for embedded passive components and method for forming electronic device thereon An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of openings penetrating therethrough and with electrically conductive layer... | 03/13/2007 |
| 7178233 | Process for producing a collapsed filled via hole A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this or... | 02/20/2007 |
| 7175724 | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries tha... | 02/13/2007 |
| 7172926 | Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed betwe... | 02/06/2007 |
| 7152317 | Circuit forming method A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material, and shaping the impressionable material to increase a gap between adjac... | 12/26/2006 |
| 7149090 | Structure of flexible printed circuit board A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wir... | 12/12/2006 |
| 7147736 | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic The present invention relates to a method to achieve the suppression of planar shrinkage in LTCC ceramic tape laminate structures without externally applied forces or sacrificial constraining tape. The method utilizes a non-sacrificial constraining tape that constra... | 12/12/2006 |
| 7144618 | Multilayer composite and method for preparing the same A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined numbe... | 12/05/2006 |
