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| Number | Title | Issue Date |
| 8189341 | Display apparatus and method for reducing electromagnetic interference thereof A display apparatus including a circuit board and a surface grounded portion which is disposed on an end portion of the circuit board and formed of a conductive layer. The display apparatus may include a signal receiver mounted on the circuit board, the signal recei... | 05/29/2012 |
| 8184446 | Inverter for liquid crystal display device and liquid crystal display module using the same An inverter for a liquid crystal display device and a liquid crystal display module using the inverter are provided. The inverter includes a circuit board defining a hole through itself, and a transformer inversely inserted into the hole of the circuit. The transfor... | 05/22/2012 |
| 8184447 | Multi-layer electronic part built-in board A versatile multi-layer electronic part built-in board compatible with different external circuits to be connected thereto is provided. Sensors are connected to a connector through connection lines that are connected to electronic parts. The electronic parts are dir... | 05/22/2012 |
| 8164915 | System for electronic components mounted on a circuit board A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conduct... | 04/24/2012 |
| 8164916 | Techniques for attenuating resonance induced impedance in integrated circuits Provided is an integrated circuit system and method for biasing the same that features bifurcating a power distribution network to provide a bias voltage to the integrated circuit system. One of the branches of the power distribution network attenuates an impedance ... | 04/24/2012 |
| 8159828 | Low profile flip chip power module and method of making A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit lamin... | 04/17/2012 |
| 8159829 | Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plu... | 04/17/2012 |
| 8149584 | Electronic component and electronic component module In a dielectric element, the angle θ made by either the top face or the bottom face and the side faces is either 0° | 04/03/2012 |
| 8134841 | Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the... | 03/13/2012 |
| 8116090 | Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices... | 02/14/2012 |
| 8102664 | Printed circuit board and method of manufacturing the same A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is forme... | 01/24/2012 |
| 8094459 | Microelectronic substrate including embedded components and spacer layer and method of forming same A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the space... | 01/10/2012 |
| 8094458 | Semiconductor package with embedded magnetic component and method of manufacture A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a lateral... | 01/10/2012 |
| 8072768 | Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the componen... | 12/06/2011 |
| 8072769 | Component-embedded module and manufacturing method thereof A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating r... | 12/06/2011 |
| 8064213 | Module with a built-in component, and electronic device with the same A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10 | 11/22/2011 |
| 8059422 | Thermally enhanced package structure A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrat... | 11/15/2011 |
| 8035978 | Printed circuit board, fabrication method and apparatus A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through hole... | 10/11/2011 |
| 8035979 | Printed wiring board with built-in semiconductor element, and process for producing the same A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface... | 10/11/2011 |
| 8031474 | Printed circuit board assembly and method of manufacturing the same A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The con... | 10/04/2011 |
| 8000107 | Carrier with embedded component and method for fabricating the same A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing ... | 08/16/2011 |
| 7969745 | Circuit board structure having electronic components integrated therein The present invention provides a circuit board having electronic components integrated therein, including a carrier board having an metallic oxide layer formed on each two surfaces of a metal layer, and having at least one through cavity; at least a semiconductor ch... | 06/28/2011 |
| 7948767 | Integrated circuit packaging structure and method of making the same The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first ... | 05/24/2011 |
| 7936567 | Wiring board with built-in component and method for manufacturing the same A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactur... | 05/03/2011 |
| 7933128 | Electronic device, electronic module, and methods for manufacturing the same An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second subst... | 04/26/2011 |
| 7911801 | Multilayer ceramic substrate and method for manufacturing the same A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer... | 03/22/2011 |
| 7894201 | Electronic component and method for manufacturing the same A method of manufacturing an electronic component includes the steps of a) forming a plurality of wiring boards that include first through holes penetrating through a semiconductor substrate and conductive material buried in the first through holes; b) providing con... | 02/22/2011 |
| 7894200 | Printed wiring board with built-in semiconductor element, and process for producing the same The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The print... | 02/22/2011 |
| 7889510 | Component-embedded board device and faulty wiring detecting method for the same A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an e... | 02/15/2011 |
| 7885081 | Component incorporating module A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components c... | 02/08/2011 |
| 7881068 | Composite layer for an electronic device Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete e... | 02/01/2011 |
| 7869222 | Embedded electronic component structure and fabrication method thereof An embedded electronic component structure and a method for forming the same are provided, wherein the embedded electronic component structure comprises a lower laminating layer, a first clamping layer, a dielectric layer, a second clamping layer, an electronic comp... | 01/11/2011 |
| 7852634 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit b... | 12/14/2010 |
| 7839649 | Circuit board structure having embedded semiconductor element and fabrication method thereof A circuit board structure with an embedded semiconductor element and a fabrication method thereof are disclosed according to the present invention. The circuit board structure comprises: a carrier board having a first surface, a second surface, and at least one thro... | 11/23/2010 |
| 7839650 | Circuit board structure having embedded capacitor and fabrication method thereof The present invention provides a circuit board structure having an embedded capacitor and a method for fabricating the same. The circuit board structure includes a core layer board with at least one surface having non-penetrating first and second grooves, a circuit ... | 11/23/2010 |
| 7821794 | Layered label structure with timer The present invention relates to a thin, layered, variable label structure with built-in electronic functionality. The display and/or other functional elements in the structure may be formed by printing processes. The label structure includes a thin, layered structu... | 10/26/2010 |
| 7821795 | Multilayer wiring board A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer s... | 10/26/2010 |
| 7817438 | Transceiver module and PCB structure thereof A transceiver module including an adaptor and a PCB is provided. The PCB, connected with the adaptor, has a first signal layer, a second signal layer and a singular ground layer wherein the singular ground layer is set between the first signal layer and the second s... | 10/19/2010 |
| 7808797 | Microelectronic substrate including embedded components and spacer layer and method of forming same A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the space... | 10/05/2010 |
| 7782629 | Embedding an electronic component between surfaces of a printed circuit board A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive con... | 08/24/2010 |
