Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 8189328 | Methods and apparatus of dual inline memory modules for flash memory In one embodiment of the invention, a flash memory dual inline memory module (FMDIMM) is disclosed. The FMDIMM includes a printed circuit board (PCB) with an edge connector; a first plurality of multi-chip packaged flash memory/support application specific integrate... | 05/29/2012 |
| 8184444 | Electrode pad for mounting electronic component and structure for mounting electronic component Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode p... | 05/22/2012 |
| 8184445 | Modular electric system The present invention relates to a modular electric system with a base module (2, 11) comprising a substrate (3, 12), a power supply (40), power/data transmission means (4, 16) and holding means; at least one load module (7, 20, 30... | 05/22/2012 |
| 8179685 | Printed circuit board and display apparatus having the same A printed circuit board on which a connector is mounted includes an insulating layer through which holes are formed and a supporting layer. An upper surface of the supporting layer is attached to the connector. The supporting layer is disposed on an upper surface of... | 05/15/2012 |
| 8179687 | Signal transmission device with single output configuration and related motherboard A signal transmission device is installed on a motherboard and is electrically connected to a signal control unit and a display output interface. The signal transmission device includes a signal receiving port, a signal output port, and a printed circuit connecting ... | 05/15/2012 |
| 8179686 | Mounted structural body and method of manufacturing the same Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electro... | 05/15/2012 |
| 8179688 | Semiconductor device An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are dispos... | 05/15/2012 |
| 8174839 | Mounting structure of semiconductor package and plasma display device having the same A mounting structure of a semiconductor package includes a semiconductor package, a chassis having a coupling boss protruding at a position corresponding to the coupling hole, a coupling member penetrating the coupling hole and coupled to the coupling boss, and an i... | 05/08/2012 |
| 8169789 | Graphics processing unit stiffening frame Apparatus and methods for mounting of a processor coupled to a circuit board include use of a frame disposed around the processor. The frame decreases flexibility of the circuit board around the processor. Further, the frame may act as a mechanical stop limiting til... | 05/01/2012 |
| 8159825 | Method for fabrication of electrical contacts to superconducting circuits A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of ... | 04/17/2012 |
| 8159826 | Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments An inorganic solder mask (48) for use as a surface treatment in masking a connection conductor (32) of a semiconductor chip package (10) against solder wetting when mounting the chip package (10) to a printed wiring board (50) or o... | 04/17/2012 |
| 8159827 | Circuit board and method of mounting electronic component on printed board When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in... | 04/17/2012 |
| 8154879 | Motherboard A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in ... | 04/10/2012 |
| 8144478 | Circuit module and method A circuit module having a distance compensation element and a method for manufacturing the circuit module. A thinned semiconductor chip is mounted to a top surface of a support substrate. The thinned semiconductor chip has an upper surface that is spaced apart from ... | 03/27/2012 |
| 8144479 | Wireless communication module A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame sp... | 03/27/2012 |
| 8130506 | Sensor module A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. ... | 03/06/2012 |
| 8130507 | Component built-in wiring board A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hol... | 03/06/2012 |
| 8116088 | Semiconductor package and method of forming the same, and printed circuit board Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; an... | 02/14/2012 |
| 8116089 | Method and apparatus for securing a magnetic component to a printed circuit board for soldering A magnetic device surface mounting assembly includes a specially designed printed circuit board and magnetic device. The circuit board has first and second sets of channels, the first channels having a first end of a first size, a second end of a second size, and fi... | 02/14/2012 |
| 8111519 | Hybrid structure of multi-layer substrates and manufacture method thereof A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first meta... | 02/07/2012 |
| 8107252 | Mounting structure of electronic component and method of manufacturing electronic component A mounting structure includes: an electronic component including: a functional element having a predetermined function; a first resin protrusion section having a surface covered by a covering film including a conductive section electrically connected to the function... | 01/31/2012 |
| 8102663 | Proximity communication package for processor, cache and memory A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor ... | 01/24/2012 |
| 8098495 | Electromagnetic interference filter A differential mode and common mode combination choke (DCCC) includes: a theta-shaped magnetic core including an essentially round magnetic ring and a magnetic plate engaged with magnetic ring across the area surrounded by the magnetic ring; and two common mode coil... | 01/17/2012 |
| 8089774 | Printed circuit board and semiconductor memory module using the same A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a s... | 01/03/2012 |
| 8085546 | Multilayer printed wiring board for semiconductor devices and method for manufacturing the board A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless lay... | 12/27/2011 |
| 8085545 | Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one electromagnetic wave inducing member may be provided to an electronic device to i... | 12/27/2011 |
| 8081484 | Method and apparatus for supporting a computer chip on a printed circuit board assembly A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit th... | 12/20/2011 |
| 8081485 | Component assembly A component assembly includes an electric component with a body and a carrier substrate on which the component is fixed by means of a conductive adhesive layer. External electrical contacts that have a planar surface are arranged on the lower side of the body. The c... | 12/20/2011 |
| 8077474 | Variable equalizer apparatus A variable equalizer apparatus for forward and/or reverse equalizers in an amplifier. The system can include a structure to allow continuous contact of the signal flow as an equalizer is removed; jumpers with fixed resistors and associated capacitors and inductors t... | 12/13/2011 |
| 8068346 | Circuit board with high density power semiconductors A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote ... | 11/29/2011 |
| 8064212 | Hybrid integrated circuit device In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF ... | 11/22/2011 |
| 8064211 | Passive component and electronic component module An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at pa... | 11/22/2011 |
| 8059421 | Memory card and method of manufacturing the same Example embodiments relate to a memory card including a generally box-shaped printed circuit board, a control chip in the generally box-shaped printed circuit board, a memory chip in the generally box-shaped printed circuit board, and a plurality of contact pads on ... | 11/15/2011 |
| 8059420 | Surface mountable device A surface mountable device includes a ceramic substrate including a first principal surface, a second principal surface, and a side surface connecting the first principal surface to the second principal surface, a terminal electrode disposed on the first principal s... | 11/15/2011 |
| 8050042 | Clock routing in multiple channel modules and bus systems and method for routing the same The terminating module and method include integrated circuits and a termination circuit which receive clock signals from the integrated circuit. The integrated circuit includes at least one memory integrated circuit mounted on a printed circuit board. An electrical ... | 11/01/2011 |
| 8050043 | Printed circuit board facilitating expansion of number of memory modules and memory system including the same Disclosed herein is a printed circuit board facilitating expansion of number of memory modules and memory system including the same. The printed circuit board of the present invention includes a plurality of slots and a plurality of controller terminals. Each of slo... | 11/01/2011 |
| 8050044 | Power plane and a manufacturing method thereof A power plane includes a first circuit region and a second circuit region. The length of the first circuit region or second circuit region is related to the noise frequency to be filtered out. The width of the first circuit region can be wider or narrower than the w... | 11/01/2011 |
| 8045333 | Intrinsically safe compliant circuit element spacing A compliant circuit element spacing system comprises a circuit board, a dummy spacer component, and a compliant circuit element. One or more active components are mounted to the circuit board. The dummy spacer component is also mounted to the circuit board, such tha... | 10/25/2011 |
| 8035977 | Apparatus for reducing power consumption by using capacitive coupling to perform majority detection One embodiment of the present invention provides a system that reduces power consumption by using capacitive coupling to perform a majority detection operation. The system starts by driving a plurality of signals onto a plurality of driven wires. The signals are the... | 10/11/2011 |
| 8031473 | Control device and method for producing a control device A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base pla... | 10/04/2011 |
