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| Number | Title | Issue Date |
| 8159824 | Printed circuit board A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board uni... | 04/17/2012 |
| 7839647 | Insulating film, printed circuit board substrate and printed circuit board including same An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films t... | 11/23/2010 |
| 7830667 | Flexible wiring substrate and method for producing the same Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wir... | 11/09/2010 |
| 7430799 | Apparatus for deforming flexible cable sections extending between rigid printed circuit boards A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexibl... | 10/07/2008 |
| 7423220 | Conductive paste for multilayer electronic components and multilayer electronic component using same A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent, wherein the organic solvent contains at least one solvent selected fr... | 09/09/2008 |
| 7414851 | Display apparatus and flexible substrate The present invention relates to a flexible substrate. More particularly, the present invention relates to a flexible substrate for a display apparatus. A display apparatus according to an embodiment of the present invention comprises a display panel in which an ele... | 08/19/2008 |
| 7397672 | Flip chip mounting substrate The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads... | 07/08/2008 |
| 7381902 | Wiring board and method of manufacturing the same A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon cove... | 06/03/2008 |
| 7378345 | Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at least one surface thereof is provided, wherein the circuit layer defi... | 05/27/2008 |
| 7371970 | Rigid-flex circuit board system A rigid-flex circuit board system that can be manufactured using less expensive and more reliable rigid circuit board methods and equipment, and can maintain rigidity and dimensional stability until the time when it is first desired to flex. ... | 05/13/2008 |
| 7361979 | Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major su... | 04/22/2008 |
| 7359204 | Multiple cover memory card A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon. The module is inserted into a complementary cavity formed within a c... | 04/15/2008 |
| 7348492 | Flexible wiring board and electrical device using the same A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is cov... | 03/25/2008 |
| 7335414 | Printed circuit board and camera module A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera module, a lens unit and a CCD are affixed to the printed circuit board th... | 02/26/2008 |
| 7326857 | Method and structure for creating printed circuit boards with stepped thickness A method and structure are provided for creating printed circuit boards with stepped thickness. A non-laminating breakaway material layer is selectively placed between layers of the printed circuit board. A perimeter portion of the printed circuit board near the bre... | 02/05/2008 |
| 7323642 | Thin printed circuit board for manufacturing chip scale package Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered... | 01/29/2008 |
| 7320902 | Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An interconnect for electrically connecting the electrode and the interconn... | 01/22/2008 |
| 7311240 | Electrical circuits with button plated contacts and assembly methods Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one butto... | 12/25/2007 |
| 7294919 | Device having a complaint element pressed between substrates A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a s... | 11/13/2007 |
| 7292448 | Circuit substrate A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a ... | 11/06/2007 |
| 7238891 | Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards A rigid-flexible circuit board with two rigid areas and one flexible area, with a rigid individual layer which is copper-clad on one side, with an adhesive medium and with a copper foil, the adhesive medium having recesses in the flexible area. The rigid-flexible ci... | 07/03/2007 |
| 7230187 | Printed wire board and associated mobile terminal A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive ... | 06/12/2007 |
| 7231112 | Solder seals within a switching system A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder. ... | 06/12/2007 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 05/29/2007 |
| 7208218 | Method of suppressing the oxidation characteristics of nickel A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like compr... | 04/24/2007 |
| 7209361 | Electronic device An electronic device includes a first module, which is protected against electromagnetic interference, and a second module. At least the first module has multilayer printed circuit boards with at least one inner layer with conductor tracks. The at least one inner la... | 04/24/2007 |
| 7208822 | Integrated circuit device, electronic module for chip cards using said device and method for making same This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer (32) including a semiconductor material within which integrat... | 04/24/2007 |
| 7205909 | Touch panel device and method of fabricating the same A touch panel device includes a wiring terminal, a flexible printed circuit film connected to the wiring terminal, an adhesion part corresponding to a location where the flexible printed circuit film is connected to the wiring terminal, and an adhesion-reinforcing p... | 04/17/2007 |
| 7189598 | Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the the... | 03/13/2007 |
| 7186921 | Circuit device and manufacturing method thereof A circuit device which enables formation of a minute pattern while securing a current capacity and has excellent heat release properties, and a manufacturing method thereof are provided. In a circuit device of the present invention, among multiple wiring layers, a f... | 03/06/2007 |
| 7180165 | Stackable electronic assembly On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked arch... | 02/20/2007 |
| 7172130 | Electronic device, rubber product, and methods for manufacturing the same The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered wit... | 02/06/2007 |
| 7173439 | Guide for tip to transmission path contact A guide for tip to transmission path contact includes a guide insulator with at least one passageway defined therein. The passageway has a tip passageway end and a transmission path passageway end. The guide insulator has an adhesive surface with adhesive associated... | 02/06/2007 |
| 7169327 | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are... | 01/30/2007 |
| 7158383 | Techniques for fabricating a resistor on a flexible base material A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby result... | 01/02/2007 |
| 7122124 | Method of fabricating film carrier A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form ... | 10/17/2006 |
| 7112873 | Flip chip metal bonding to plastic leadframe A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-m... | 09/26/2006 |
| 7106593 | Heat sink assembly for a potted housing The present invention includes a heat sink assembly within a potted housing and a method for transferring heat within a potted housing. The heat sink assembly includes a bracket, a heat-containing element, and a self-tapping screw operatively arranged to engage the ... | 09/12/2006 |
| 7091899 | Remote control transmitter Hook portion is formed on sheet an electric discharge preventing sheet put between battery and electrode. Hook portion which is deformable with a prescribed force comes into contact with holder 6 retaining electric discharge preventing sheet. Therewith, a rem... | 08/15/2006 |
| 7071419 | Tear resistant flexible substrate A flexible circuit having improved tear resistance is provided. A flexible circuit, made of polyimide film, includes at least one extension which needs to be folded. To prevent tearing, an annular piece of metal, like an exposed copper pad for example, is placed at ... | 07/04/2006 |
