Bizarre Patents
A portable partition for use in an automobile having a seat with a seat bench and a seat backrest.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8094457 | Electronic apparatus An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the a... | 01/10/2012 |
| 7561434 | Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component th... | 07/14/2009 |
| 7436057 | Elastomer interposer with voids in a compressive loading system An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric ... | 10/14/2008 |
| 7430799 | Apparatus for deforming flexible cable sections extending between rigid printed circuit boards A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexibl... | 10/07/2008 |
| 7384683 | Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a ... | 06/10/2008 |
| 7382042 | COF flexible printed wiring board and method of producing the wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliabilit... | 06/03/2008 |
| 7349225 | Multifunctional composite sandwich element with embedded electronics A composite sandwich structure with embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central... | 03/25/2008 |
| 7323642 | Thin printed circuit board for manufacturing chip scale package Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered... | 01/29/2008 |
| 7292448 | Circuit substrate A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a ... | 11/06/2007 |
| 7282241 | Patterned, high surface area substrate with hydrophilic/hydrophobic contrast, and method of use Nanoporous structures are constructed that have hydrophilic regions separated by hydrophobic regions. The porous, hydrophilic regions have reaction sites suitable for use in a bioassay application and have a higher density of reaction sites than that of a non-porous... | 10/16/2007 |
| 7230954 | Cross link intra-vehicular data communication using a field coupled transmission line A vehicular communications network is disclosed. The network comprises a communications channel for propagating a signal therealong; a nodal communications system; and a signal coupling system coupled to the communications channel and to the nodal communications sys... | 06/12/2007 |
| 7230187 | Printed wire board and associated mobile terminal A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive ... | 06/12/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7211738 | Bonding pad structure for a display device and fabrication method thereof A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An ope... | 05/01/2007 |
| 7179695 | Method of forming wiring A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating laye... | 02/20/2007 |
| 7169327 | Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are... | 01/30/2007 |
| 7158383 | Techniques for fabricating a resistor on a flexible base material A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby result... | 01/02/2007 |
| 7124502 | Method of fabricating a high-layer-count backplane The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or gre... | 10/24/2006 |
| 7123204 | Energy source communication employing slot antenna The invention relates to a wireless communication device that is coupled to an energy source, such as a battery, capacitor, or solar cell. The wireless communication device is coupled to a slot in the energy source to form a slot antenna for wireless communication. ... | 10/17/2006 |
| 7088926 | Electro-optical connector module The invention pertains to an electro-optical connector module comprising a connection part, at least one optical transmitter circuit and/or optical receiver circuit and at least one electro-optical converter for respectively converting electrical signals into optica... | 08/08/2006 |
| 7071419 | Tear resistant flexible substrate A flexible circuit having improved tear resistance is provided. A flexible circuit, made of polyimide film, includes at least one extension which needs to be folded. To prevent tearing, an annular piece of metal, like an exposed copper pad for example, is placed at ... | 07/04/2006 |
| 7031166 | Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate A silicon nitride sintered body comprising Mg and at least one rare earth element selected from the group consisting of La, Y, Gd and Yb, the total oxide-converted content of the above elements being 0.6–7 weight %, with Mg converted to MgO and rare earth elements... | 04/18/2006 |
| 7011994 | Method of forming wiring and method of manufacturing image display system by using the same A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating laye... | 03/14/2006 |
| 7002809 | Liquid crystal display driver integrated circuit package Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps... | 02/21/2006 |
| 6975514 | Integrated VCSELs on traditional VLSI packaging A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density de... | 12/13/2005 |
| 6972964 | Module board having embedded chips and components and method of forming the same A module board has embedded chips and components. A substrate has at least one large cavity and at least one small cavity, in which the large cavity passes through the substrate and a passive component is set in the small cavity. A heat-dissipation sheet is set at t... | 12/06/2005 |
| 6932518 | Circuit board having traces with distinct transmission impedances The present invention is an optoelectronic device including a circuit board with a plurality of signal traces, a first ground plane, and a second ground plane. The impedance of a signal trace is determined by which of the first ground plane and the second ground pla... | 08/23/2005 |
| 6934160 | Printed circuit board arrangement A printed circuit board arrangement with a flexible layer arrangement of at least one electrically conductive layer with a large number of conductor tracks lying next to one another and surrounded by electrically isolating layers has at least one printed circuit boa... | 08/23/2005 |
| 6918179 | Method of deforming flexible cable sections extending between rigid printed circuit boards A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexibl... | 07/19/2005 |
| 6911605 | Flexible printed circuit In order to provide low-cost, long fatigue life flexible printed circuit, low profile electrolytic foil is used as copper foil for a circuit 3 of the flexible printed circuit 10. Crack which does not penetrate the copper foil should preferably be forme... | 06/28/2005 |
| 6890629 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 05/10/2005 |
| 6885549 | System and method for flexible circuits A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the... | 04/26/2005 |
| 6879492 | Hyperbga buildup laminate A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N ≧2) and N metal planes formed in the following sequence: dielectric layer ... | 04/12/2005 |
| 6866368 | Flexible circuit board A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, whe... | 03/15/2005 |
| 6865065 | Semiconductor processing chamber substrate holder method and structure A method and system for processing wafers is disclosed. According to one embodiment (100) a chuck system (102) may be situated opposite to an input source (104). A chuck system (102) may apply a force (e.g., mechanical and/or electromagne... | 03/08/2005 |
| 6863962 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid ... | 03/08/2005 |
| 6842344 | Multi-layer printed circuit board and signal routing therein A printed circuit board having a dielectric layer is disclosed. At least one signal trace is disposed adjacent a first surface of the dielectric layer in a first signal area. A reference plane is disposed adjacent a second surface of the dielectric layer in a first ... | 01/11/2005 |
| 6816387 | Expansion board apparatus and removing method In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board o... | 11/09/2004 |
| 6805940 | Method for making conductive circuits using powdered metals A method for making an electrically conductive pattern, including: (a) depositing on a substrate a metal powder composition consisting essentially of at least one metal powder, wherein the substrate is selected from the group consi... | 10/19/2004 |
| 6761963 | Integrated thin film capacitor/inductor/interconnect system and method A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. ... | 07/13/2004 |
