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Lord Kelvin, British mathematician and physicist ; 1897
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| Number | Title | Issue Date |
| 8179682 | Multilayer circuit board and use of a multilayer circuit board A multilayer circuit board having a security cell having security-related electronic components disposed thereon. The security cell is covered by a circuit path arrangement having circuit path segments disposed close to one another, and by an insulation layer. Penet... | 05/15/2012 |
| 8154876 | Circuit board module and electronic apparatus A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the fra... | 04/10/2012 |
| 8116084 | Method for manufacturing power module substrate, power module substrate, and power module A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed ther... | 02/14/2012 |
| 8094456 | Polishing pad To provide a polishing pad which is insusceptible to clogging of groove with abrasive particles and grinding dusts during polishing, and leads to little decrease in polishing rate even after long-term continuous use. A polishing pad of the present invention has a po... | 01/10/2012 |
| 8072764 | Multi-part substrate assemblies for low profile portable electronic devices Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assemblin... | 12/06/2011 |
| 8045331 | Printed circuit board, method of fabricating the same, and electronic apparatus employing the same A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external... | 10/25/2011 |
| 8000093 | Display device, manufacturing method of the display device, and portable computer having the display device A display device includes a display panel, and a chassis supporting the display panel, and including a conductive material. The display device includes a circuit board including a signal wiring connected to the display panel to apply a driving signal to the display ... | 08/16/2011 |
| 7990730 | Imaging device An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed por... | 08/02/2011 |
| 7961476 | Stiffening plate for circuit board and switch assembly This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the b... | 06/14/2011 |
| 7961475 | Apparatus and method for facilitating immersion-cooling of an electronic subsystem Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sea... | 06/14/2011 |
| 7957150 | Support method and apparatus for printed circuit board An orthogonal array is formed by performing electromagnetic field analysis only once and determining a range by using the mount position and type of a capacitor and the number of capacitors as parameters to perform circuit analysis a small number of times. An estima... | 06/07/2011 |
| 7898814 | Protection circuit board for secondary battery and secondary battery using the same A protection circuit board for a secondary battery is constructed with an electrically insulating substrate, a printed circuit board pattern formed on the electrically insulating substrate, a protection circuit part electrically connected to the printed circuit boar... | 03/01/2011 |
| 7817434 | Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board A method and apparatus for improving the thermal conductivity of a circuit board (CB) assembly comprising an integrated circuit (IC) die mounted on a CB. A high thermal conductivity device is attached on a first end to a surface of the die. When the die is mounted o... | 10/19/2010 |
| 7800912 | Signal transfer system, signal output circuit board, signal receiving circuit board, signal output method, and signal receiving method There is provided a signal transfer system that has a driver for outputting a signal, a transmission line for transmitting the signal, an insertion-type attenuator, inserted into the transmission line in series, for largely attenuating the low-frequency signal more ... | 09/21/2010 |
| 7782603 | Tool-less electronic component retention Provided is an apparatus comprising a latch mechanism, wherein the latch mechanism comprises a touch point, push points, pull back handles, and a latch tongue adapted to move up and down, wherein the latch tongue is adapted to being inserted into a retention hole. | 08/24/2010 |
| 7710737 | Stiffening plate for circuit board and switch assembly This invention is directed to a support plate for reinforcing a portion of a circuit board. The support plate may be coupled to a portion of the circuit board that is subject to forces (e.g., portions of the circuit board having switches) to prevent flexing of the b... | 05/04/2010 |
| 7576991 | Electrical equipment for junction and method of manufacturing the same The present invention provides electrical equipment for junction improved in sealing performance and reduced in size and weight, and also provides a method of manufacturing the same. A face cover 6 and a back cover 7 are press-formed from an aluminum a... | 08/18/2009 |
| 7570491 | Printed circuit board with embedded capacitors therein, and process for manufacturing the same Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the pr... | 08/04/2009 |
| 7483274 | Galvanic isolation of a signal using capacitive coupling embedded within a circuit board A method and apparatus for providing galvanic isolation for signal communication between two electrical circuits via a capacitive coupler that is constructed from conductive and non-conductive layers of a printed circuit board. The invention can provide at low cost ... | 01/27/2009 |
| 7457130 | Packaging for plasma display module Packaging for a display module which is easy to install due to a simple structure, and protects the front, sides and back of the display module securely. The packaging includes a protective plate attached to the back of the panel module. The panel module includes a ... | 11/25/2008 |
| 7447039 | Motherboard configured to minimize or prevent damage to a chip thereon A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes dete... | 11/04/2008 |
| 7447038 | Module In a memory module, a plurality of memories are mounted on a module base plate, impedance between Vref and Vss near each memory is coupled to Vss by a decoupling capacitor and a Vref plane to achieve low impedance configuration in a wide frequency range, Vref planes... | 11/04/2008 |
| 7442091 | Back-to-back PCB double-sided USB connector A double-sided USB connector may include a first PCB that may provide a first set of electrical contacts on its first side and solder pads on its second side. The first PCB may further include a components side, solder pads, and signal traces. The double-sided USB c... | 10/28/2008 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7433200 | Wired circuit board A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relatio... | 10/07/2008 |
| 7433178 | Plasma display apparatus A plasma display apparatus comprising a panel displaying images, a circuit board that drives the panel, and a chassis base that supports the panel and the circuit board. A signal transfer member couples the panel and the circuit board, and a protection plate protect... | 10/07/2008 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over... | 09/30/2008 |
| 7430125 | Data processing terminal, parent board, child board, terminal designing apparatus and method, computer program, and information storage medium A second ground plane (18); has one end opposite to a connector (14), which end is connected to a first ground plane (17) by resistor connection element (41). Accordingly, it is possible to lower Q of resonance of the ground structure by ... | 09/30/2008 |
| 7427717 | Flexible printed wiring board and manufacturing method thereof A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in... | 09/23/2008 |
| 7423884 | Multilayer circuit board A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes a... | 09/09/2008 |
| 7420830 | Memory card module A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is installed at one end of the first circuit board and is electrically con... | 09/02/2008 |
| 7420816 | Apparatus and method for installing an electrical support structure An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the f... | 09/02/2008 |
| 7420817 | MEMS device seal using liquid crystal polymer An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed... | 09/02/2008 |
| 7417194 | ESD protection devices and methods of making same using standard manufacturing processes Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layer... | 08/26/2008 |
| 7408785 | Structure for mounting electronic component on wiring board A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered... | 08/05/2008 |
| 7405664 | Radio frequency IC tag and method for manufacturing the same A radio frequency IC tag and a manufacturing method for the same includes an IC chip on which information is stored, and an antenna for transmitting the information that is stored on the IC chip. In the antenna, a power-feeding part on which the IC chip is mounted e... | 07/29/2008 |
| 7397669 | Semiconductor device mounting socket A semiconductor device mounting socket is disclosed that is fixed to a motherboard and is used for mounting a surface mounted semiconductor device on the motherboard. The semiconductor device mounting socket includes a bracket that is fixed to the motherboard and a ... | 07/08/2008 |
| 7397672 | Flip chip mounting substrate The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads... | 07/08/2008 |
| 7390973 | Memory module and signal line arrangement method thereof The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both ... | 06/24/2008 |
| 7380057 | Storage device controlling apparatus and a circuit board for the same A storage device controlling apparatus connected to a storage device storing data and connected to an information processing apparatus via a network, the apparatus being accommodated in a chassis, the apparatus comprising a circuit board accommodated in the chassis,... | 05/27/2008 |