Bizarre Patents
An extension member is attachable to a trailer hitch and extends away from the vehicle and is connected to a seating frame supporting a toilet seat.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7301755 | Architecture for power modules such as power inverters Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additional... | 11/27/2007 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7237331 | Electronic part manufacturing method and electronic part Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting ... | 07/03/2007 |
| 7230187 | Printed wire board and associated mobile terminal A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive ... | 06/12/2007 |
| 7176040 | Inkjet-fabricated integrated circuits A method for forming an integrated circuit including at least two interconnected electronic switching devices, the method comprising forming at least part of the electronic switching devices by ink-jet printing. ... | 02/13/2007 |
| 7026547 | Semiconductor device and a method for fabricating a semiconductor device A semiconductor device (10) includes a semiconductor component integrated in a semiconductor substrate and a conductive pad (110) arranged on top of the semiconductor device (10). The conductive pad is electrically connected with the semiconduct... | 04/11/2006 |
| 6958527 | Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land. | 10/25/2005 |
| 6924973 | Light emitting diode assembly for an illuminated sign The light emitting diode assembly for an illuminated sign is disclosed having an enhanced waterproofs function and an enhanced durability. The light emitting diode assembly includes a case being open upwards, in which a connecting recess is formed on upper portions ... | 08/02/2005 |
| 6822873 | Structure of electronic device providing decreased fatigue of wire An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an electronic element mounted on the casing through wires. The buffer is ... | 11/23/2004 |
| 6805940 | Method for making conductive circuits using powdered metals A method for making an electrically conductive pattern, including: (a) depositing on a substrate a metal powder composition consisting essentially of at least one metal powder, wherein the substrate is selected from the group consi... | 10/19/2004 |
| 6803114 | Manufacturing process for laminated cards with intermediate PETG layer The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first la... | 10/12/2004 |
| 6784765 | Multilayer ceramic device A mulitlayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer 1 has a first multilayer circuit pattern 2 electrically connected through vi... | 08/31/2004 |
| 6717794 | Composite multilayered ceramic board and manufacturing method thereof A composite multilayered ceramic board includes a multilayered ceramic board made of dielectric ceramics, a multilayered ceramic board made of magnetic ceramics and an adhesive layer made of thermosetting resin such as polyimide and the like. In this composite multi... | 04/06/2004 |
| 6690580 | Integrated circuit structure with dielectric islands in metallized regions This disclosure describes use of dielectric islands embedded in metallized regions of a semiconductor device. The islands are formed in a cavity of a dielectric layer, as upright pillars attached at their base to an underlying dielectric. The islands brea... | 02/10/2004 |
| 6650539 | Modular backup power housing A modular backup power housing consists of at least one module and a base. Additional modules may be stacked to accommodate a larger bank of power cells. Each module has a cuboid frame, multiple top rails and multiple bottom tracks. The top rails and the ... | 11/18/2003 |
| 6613987 | Insulating resin composition for multilayer printed-wiring board Herein is disclosed an insulating resin composition for a multilayer printed-wiring board, comprising two or more kinds of resins which are different in etching rate by plasma treatment and which are not compatible with each other, so that the surface of ... | 09/02/2003 |
| 6570469 | Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes... | 05/27/2003 |
| 6498309 | Circuit board and manufacturing method thereof The present invention provides a circuit board, which can reduce a conduction loss and generate no trouble in electric/electronic apparatuses in the case of being mounted to electric/electronic apparatuses adapting a high frequency current. A circuit boar... | 12/24/2002 |
| 6492599 | Multilayer wiring board, manufacturing method thereof, and wafer block contact board In a multilayer wiring board comprising: an insulating board (for example, a glass board 1); and a wiring layer (for example, wiring patterns 2a, 5a and 8a) superimposed on the insulating board through an insulating film (for example, insulating films 3 a... | 12/10/2002 |
| 6486398 | Sealing arrangement for an electronic circuit module A sealing arrangement is provided for sealing an orifice between an interior and an exterior surface of an electronic module. An air-permeable, water-impermeable membrane is disposed in the orifice. A portion of the exterior surface is provided with at le... | 11/26/2002 |
| 6478909 | Method for surface mounting electrical components to a substrate A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure ... | 11/12/2002 |
| 6479760 | Printed wiring board for semiconductor plastic package Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, ... | 11/12/2002 |
| 6473314 | RF power amplifier assembly employing multi-layer RF blocking filter A low cost radio frequency interference filter assembly comprises a multiple layer structure including a middle trace layer disposed between an upper ground layer and lower ground layer. Non-conductive insulation layers are disposed between the middle tra... | 10/29/2002 |
| 6449168 | Circuit board and a method for manufacturing the same The present invention refers to circuit board (10), in particular a multilayer circuit board including at least a first carrying section (11) and a second section (12), conductor pattern (17a, 17b, 17c) and via holes (14, 14b, 14c), at least one of the se... | 09/10/2002 |
| 6441313 | Printed circuit board employing lossy power distribution network to reduce power plane resonances An interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board includes a lossy power distribution network formed by a pair of parallel planar conductors separated by ... | 08/27/2002 |
| 6399891 | Multilayer boards A multilayer board free from breakage at connecting parts due to thermal fatigue is provided. A multilayer board 1 of the present invention comprises alternating polyimide films 11-16 and copper films 21-26. The polyimide films 11-16 have a thermal expans... | 06/04/2002 |
| 6380622 | Electric apparatus having a contact intermediary member and method for manufacturing the same A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric resistance and a thermal resistance between the main elec... | 04/30/2002 |
| 6377467 | Surface mountable over-current protecting device The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to la... | 04/23/2002 |
| 6301122 | Radio frequency module with thermally and electrically coupled metal film on insulating substrate The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a ... | 10/09/2001 |
| 6295206 | Memory card, and receptacle for same A memory card is disclosed which has a card body (2) having a concavity (9) formed at the forward end thereof in the inserting direction and in which terminals (5) are disposed and projections (10) are formed between the terminals (5) to prevent the termi... | 09/25/2001 |
| 6184576 | Packaging and interconnection of contact structure A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation. The packaging and interconnection is formed of a contact structure made of conductiv... | 02/06/2001 |
| 6147870 | Printed circuit assembly having locally enhanced wiring density A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a cond... | 11/14/2000 |
| 6147860 | External storage device An external storage device includes an external storage device main includes a thin type external storage device module formed into a package sealed on one side from a storage element containing at least one non-volatile semiconductor memory device, and a... | 11/14/2000 |
| 6122170 | Power module board and power module using the board A ceramic base plate of aluminum nitride ceramics, for example, as a power module board has a metal layer on a surface of the ceramic base plate at a fixing portion at which the ceramic base plate is fixed onto a heat radiating plate. Further, a metal fil... | 09/19/2000 |
| 6114005 | Laminate and multilayer printed circuit board A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a... | 09/05/2000 |
| 6097612 | Radio frequency module and method for fabricating the radio frequency module The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a ... | 08/01/2000 |
| 6088233 | Semiconductor device and assembly board having through-holes filled with filling core A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pat... | 07/11/2000 |
| 6013357 | Power module circuit board and a process for the manufacture thereof A conductor pattern is formed on at least one surface of an AlN- or Si3 N4 -based ceramic substrate which is such that the ratio between the principal metal component binding with N to form the ceramic mass and the B in the BN remain... | 01/11/2000 |
| 5993946 | Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board A lattice of a wiring or terminal pattern is varied at areas on a wiring board. The spacing of the wiring lattice is reduced only in a predetermined area for a device having many terminals. An alignment pattern is provided in the predetermined area. The s... | 11/30/1999 |
| 5995374 | Resin-coated mount substrate and method of producing the same A substrate unit is constituted by a printed substrate on which electronic parts such as a relay block is mounted, and at least printed circuit conductors and terminals in the printed substrate and relay block are buried in a sealing resin material harden... | 11/30/1999 |
