Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7371608 | Method of fabricating a stacked die having a recess in a die BGA package Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided. ... | 05/13/2008 |
| 7371609 | Stacked module systems and methods The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical f... | 05/13/2008 |
| 7368924 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated... | 05/06/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7349227 | Electronic control device An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible por... | 03/25/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7332820 | Stacked die in die BGA package Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recess... | 02/19/2008 |
| 7332819 | Stacked die in die BGA package Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with ... | 02/19/2008 |
| 7316582 | Piled-up audio-source socket A piled-up audio-source socket includes plural socket units and at least a connecting member, and each is provided on each side thereof with a first engaging portion, each connecting member is provided on its two mutually opposite sides each with a second engaging p... | 01/08/2008 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7282945 | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof A structure useful as a probe for testing electrical interconnections to integrated circuit devices and other electronic components having a substrate with a bond wire elongated electrical conductor extending away from the surface of the substrate. Each of the bond ... | 10/16/2007 |
| 7276919 | High density integral test probe A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flat... | 10/02/2007 |
| 7274196 | Apparatus and method for testing electrical characteristics of semiconductor workpiece An apparatus for testing electrical characteristics of a semiconductor workpiece includes a probe card having probes and signal pads electrically connected to the probes, wherein the probes are in contact with a workpiece during a test process; a test head electrica... | 09/25/2007 |
| 7243815 | Thermoformed package A container is formed in a blank having two body halves interconnected by a hinge. The container body is at least partially clear to allow inspection of an article held in the interior. The container optionally includes an integrally formed carrying handle. Empty co... | 07/17/2007 |
| 7213330 | Method of fabricating an electronic device A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relations... | 05/08/2007 |
| 7199440 | Techniques for joining an opto-electronic module to a semiconductor package The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using... | 04/03/2007 |
| 7185426 | Method of manufacturing a semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 03/06/2007 |
| 7180165 | Stackable electronic assembly On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked arch... | 02/20/2007 |
| 7176063 | High density 3-D integrated circuit package A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fi... | 02/13/2007 |
| 7145238 | Semiconductor package and substrate having multi-level vias A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 12/05/2006 |
| 7142083 | Electronics component and method for fabricating same An electronic component for mounting on a mating component. The electronic component includes a case and a plurality of electrical contacts. The case is fabricated from an electrically insulative material, such as a liquid crystal polymer material, and is sized and ... | 11/28/2006 |
| 7140883 | Contact carriers (tiles) for populating larger substrates with spring contacts An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first... | 11/28/2006 |
| 7135950 | Thin transformer A thin transformer includes a hollow coil bobbin around which a coil is wound, an iron core provided to pass through a portion of the coil bobbin, and a terminal section having several terminals electrically connected to drawn-out lines of the coil and electrically ... | 11/14/2006 |
| 7116204 | Leakage transformer A leakage transformer capable of preventing occurrence of a short-circuit of a secondary winding and is also capable of restraining a distance between terminals from becoming wide is provided. A leakage transformer (10) has a structure such that a secondary w... | 10/03/2006 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to as... | 08/08/2006 |
| 7072052 | Efficient rasterization system and method An image processing method and system is provided wherein a plurality of processors perform a conversion process from a page description language format of data into raster image data, and a printing engine which continuously receives color image data having at leas... | 07/04/2006 |
| 7066741 | Flexible circuit connector for stacked chip module The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from a... | 06/27/2006 |
| 7045443 | Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from ... | 05/16/2006 |
| 7026708 | Low profile chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a variety of methods and materials. A consolidated low profile contact stru... | 04/11/2006 |
| 7022553 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The... | 04/04/2006 |
| 6972487 | Multi chip package structure having a plurality of semiconductor chips mounted in the same package The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first... | 12/06/2005 |
| 6958531 | Multi-substrate package and method for assembling same A multi-substrate, microsystem package and a method for assembling same including a high-density flexible connector array are disclosed for use in compact and multi-substrate packages containing circuits, sensors, and actuators in a re-workable and modular approach.... | 10/25/2005 |
| 6958533 | High density 3-D integrated circuit package A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fi... | 10/25/2005 |
| 6956284 | Integrated circuit stacking system and method The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules... | 10/18/2005 |
| 6940729 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 09/06/2005 |
| 6934152 | Systems and methods for connecting an electronic apparatus to a backplane An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of that circuit board, and a heat sink disposed over the front side of tha... | 08/23/2005 |
| 6930257 | Integrated circuit substrate having laminated laser-embedded circuit layers An integrated circuit substrate having laminated laser-embedded circuit layers provides a multi-layer high-density mounting and interconnect structure for integrated circuits. A prepared substrate, which may be a rigid double-sided dielectric or film dielectric with... | 08/16/2005 |
| 6919626 | High density integrated circuit module The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external po... | 07/19/2005 |
| 6916682 | Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing A package device (10, 100) has one integrated circuit (22, 122) in a cavity (20, 120) in a package substrate (12, 122) and electrically coupled to one side (50, 150) of the package substrate. A second integrated circuit (32, 132... | 07/12/2005 |
