Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8023269 | Wireless telemetry electronic circuit board for high temperature environments A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold past... | 09/20/2011 |
| 7532481 | Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent ... | 05/12/2009 |
| 7417867 | Printed wiring board and display apparatus A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to each other via said through-holes, and a sealing member composed of a si... | 08/26/2008 |
| 7265674 | Thin flexible, RFID labels, and method and apparatus for use A radio frequency identification (REID) device may include a first, thin, flexible sheet, an antenna, and an integrated circuit. A surface portion of the first sheet may be affixed to a second, thin, flexible sheet to form a thin, flexible label. Such a label may be... | 09/04/2007 |
| 7255573 | Data signal interconnection with reduced crosstalk Data signal interconnections are described that offer reduced cross talk particularly with high speed differential signaling. In one example, the invention includes a plurality of interconnects to carry data signals between a first component and a second component, ... | 08/14/2007 |
| 7237330 | Method for making conductive circuits using powdered metals Conductive circuits and methods of making conductive circuits are disclosed. ... | 07/03/2007 |
| 7195493 | Land grid array socket connector with location members A land grid array (LGA) socket connector (10) includes a number of contact segments (120, 140, 160, 180) and location members (122, 142, 162, 182). The contact segments are combined to form a substantially rectangular contact region. The locatio... | 03/27/2007 |
| 7131193 | Heat-shrinkable retainer for PCB double-sided assembly An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same... | 11/07/2006 |
| 7120030 | Housing structure of vehicle-mounted electronic equipment A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential ... | 10/10/2006 |
| 7113400 | Housing structure of electronic control unit and mounting structure of the same A housing for enclosing an electronic control unit is constructed of a resinous cover and a metallic case having heat conductivity higher than that of the resinous cover. An air intake module is mounted on an engine inside an engine compartment. The air intake modul... | 09/26/2006 |
| 7112873 | Flip chip metal bonding to plastic leadframe A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-m... | 09/26/2006 |
| 7072188 | Power distribution module for personal recreational vehicle A power distribution module for a personal recreational vehicle includes a housing and a cover. The housing defines an interior and includes a wall having an array of receptacle openings. The receptacle openings are adapted to receive and secure electrical component... | 07/04/2006 |
| 7010629 | Apparatus and method for coupling to a memory module Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC C... | 03/07/2006 |
| 7005106 | Lead-free solder alloy and electronic components using it Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire h... | 02/28/2006 |
| 6924168 | Method of forming a structure for supporting an integrated circuit chip A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory str... | 08/02/2005 |
| 6916182 | Connection arrangements for electrical devices having a ledge on which contact terminals are provided The present disclosure relates to connection arrangements for electrical devices. In the connection arrangements, an electrical device having at least one ledge that includes a plurality of contact terminals provided thereon is electrically connected to an electrica... | 07/12/2005 |
| 6805940 | Method for making conductive circuits using powdered metals A method for making an electrically conductive pattern, including: (a) depositing on a substrate a metal powder composition consisting essentially of at least one metal powder, wherein the substrate is selected from the group consi... | 10/19/2004 |
| 6803114 | Manufacturing process for laminated cards with intermediate PETG layer The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first la... | 10/12/2004 |
| 6774971 | LCD with flexible connecting means to hard transparent circuit substrate With the embodiment of the present invention, a liquid crystal display can be produced at a low cost, which employs the COG technology, saves installation space, mounts LSIs, and, after the LSIs are mounted, can visibly check and inspect the mounted state thereof (t... | 08/10/2004 |
| 6757174 | Switching power-supply module A switching power-supply module includes a coil pattern of a transformer or an inductor disposed on a substrate. A portion of the coil pattern projects into an edge portion of the substrate. A plurality of terminals are arranged in the substrate edge portion so that... | 06/29/2004 |
| 6496382 | Radio frequency identification tag A radio frequency identification tag is made with printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent the antenna coil for carrying circuit elements. The radio frequency identification tag is d... | 12/17/2002 |
| 6496377 | Vehicle electric power distribution system A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of electrically insulating plastic material between each of the ... | 12/17/2002 |
| 6449167 | Method and apparatus for building and testing electronic circuits A method and system with a magnetically attractive breadboard and associated devices for constructing and testing electronic circuits. The breadboard can comprise a single or multi-layer circuit board with metallic foil conductors that can be connected to... | 09/10/2002 |
| 6359233 | Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for a printed circuit board. Also disclosed is printed circuit... | 03/19/2002 |
| 6294744 | Multilayer print circuit board and the production method of the multilayer print circuit board The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other... | 09/25/2001 |
| 6294743 | Multilayer print circuit board and the production method of the multilayer print circuit board The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other... | 09/25/2001 |
| 6195257 | Apparatus and method of adapting a rectifier module to enhance cooling A module mount for use in electrically and mechanically mounting an encapsulated power rectifier module, having a plurality of rigid leads protruding from a major mounting surface thereof, in an orientation in which the major mounting surface is substanti... | 02/27/2001 |
| 6090468 | Multilayer wiring board for mounting semiconductor device and method of producing the same A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal exp... | 07/18/2000 |
| 6075707 | Radio frequency identification tag A radio frequency identification tag is made with printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent the antenna coil for carrying circuit elements. The radio frequency identification tag is d... | 06/13/2000 |
| 6060150 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and bec... | 05/09/2000 |
| 6005766 | Multi-layered printed circuit board and its manufacturing method A multi-layered printed circuit board (PCB) for use in items of portable electronic equipment which use a housing having a convex-concave part and/or a bent part, includes a PCB section having a uniformly thick PCB, and a resin board formed over the PCB i... | 12/21/1999 |
| 5776662 | Method for fabricating a chip carrier with migration barrier, and resulating chip carrier To inhibit the migration of conductive layers in a multilayer chip carrier, e.g., a multilayer printed circuit board, an optically cured layer 13, which is an anti-migration layer, is formed in an insulating layer 12 located between a first conductive lay... | 07/07/1998 |
| 5763060 | Printed wiring board Described is a printed wiring board comprising a composite of an electrically conductive core laminated with layers of dielectric material and electrically conductive material.... | 06/09/1998 |
| 5703761 | Shielding for flat modules For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive ma... | 12/30/1997 |
| 5541813 | Portable telephone apparatus having case with wiring member embedded in a molded plastic hinge A case houses a portable telephone apparatus having a display portion, an operating portion, a speaker portion and a microphone portion provided with respect to two main portions and a hinge portion which connects the main portions so as to be opened and ... | 07/30/1996 |
| 5434748 | Hermetic electronic equipment with flexible diaphragm, fastened to case by elastic U-shaped ring, for absorbing pressure fluctuations An electronic circuit equipment including a substantially box-shaped case main body (10) for defining a sealed interior space therein and an electronic circuit board (11) having a plurality of electronic components (12) thereon. The case main body (10) co... | 07/18/1995 |
| 5432676 | Electronic apparatus case with wiring member embedded in a molded plastic hinge A case for housing an electronic apparatus has two main portions and a hinge portion which connects the main portions so as to be opened and closed. The case is formed of plastic molding. The hinge portion is formed of a soft resin having a resiliency, an... | 07/11/1995 |
| 5371407 | Electronic circuit with diamond substrate and conductive vias The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond su... | 12/06/1994 |
| 5315239 | Circuit module connections Low temperature, co-fired ceramic (LTCC) modules (10, 80, 82, 110, 102, 140, 160) are interconnected to one another, stacked and automatically connected to other modules by rigid LTCC interconnecting modules (104), or provided with covers or hermetically ... | 05/24/1994 |
| 5243495 | Removable enclosure housing a rigid disk drive A removable self-contained rigid disk drive has a head and disk assembly (HDA) and controller enclosed by a top and bottom cover. The industry standard form factor drive is externally dimensioned to be removably installable in a disk bay of the same form ... | 09/07/1993 |
