Bizarre Patents
Behavior Modification Wristwatch
A wristwatch including a watch band and a watch body having an octagon shaped perimeter and being red in color and having the word STOP thereon to resemble a stop sign.
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| Number | Title | Issue Date |
| 8130502 | Modular stackable angled patch panel for enclosure A modular patch panel module is mountable on an electronics enclosure and includes an angled patch face and mounting structure that enables stacking of modular patch panels without interference of patch panel cords with the top of the enclosure or another patch pane... | 03/06/2012 |
| 8004848 | Stack module, card including the stack module, and system including the stack module Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate... | 08/23/2011 |
| 7978465 | Function expanding method for small-sized display device The function expanding method for a display device comprises: a step of preparing a plurality of types of function expanding modules; a step of selecting a function expanding module or modules from the plurality of types of function expanding modules; and a step of ... | 07/12/2011 |
| 7933127 | Memory card and memory card manufacturing method A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the f... | 04/26/2011 |
| 7929310 | Cell board interconnection architecture According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which ... | 04/19/2011 |
| 7821792 | Cell board interconnection architecture According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which ... | 10/26/2010 |
| 7710735 | Multichip package system A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom s... | 05/04/2010 |
| 7656671 | Expansion module and system thereof An expansion module includes a housing, at least one first wedging device, a connecting device, and a module socket. At one side of the housing, there is at least one plugging pin. The first wedging device is located in the housing. The first wedging device correspo... | 02/02/2010 |
| 7649740 | Stacked mounting structure In a stacked mounting structure At least a pair of a first connecting terminal and a second connecting terminal is formed, and further, the stacked mounting structure includes a protruding electrode which is provided on at least any one of the first connecting termi... | 01/19/2010 |
| 7589974 | Modular server and method A modular computer system is provided. In one embodiment, the system includes a computer server having a first printed circuit assembly disposed within a first housing and an expansion connector. The computer server is configured to be coupled to a modular expansion... | 09/15/2009 |
| 7505276 | Semiconductor module provided with contacts extending through the package A semiconductor module includes a package, a plastic molding compound and contacts extending through the package from an underside of the package to an upper side of the package. The package includes least two layers of plastic, the first layer of plastic having ext... | 03/17/2009 |
| 7457129 | Multilayer printed wiring board There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first printed wiring board 10 having a semiconductor element 2... | 11/25/2008 |
| 7435619 | Method of fabricating a 3-D package stacking system The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package an... | 10/14/2008 |
| 7432593 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 10/07/2008 |
| 7420814 | Package stack and manufacturing method thereof A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may inclu... | 09/02/2008 |
| 7391342 | Low-cost keypad encoding circuit A keypad encoding circuit contains a voltage dividing network and an integrated circuit. The voltage dividing network includes a string of resistors that generates an encoding signal voltage. The integrated circuit converts the encoding signal voltage into a digital... | 06/24/2008 |
| 7372170 | Flip chip interconnection pad layout A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard from the signal pads; and has the signal pads on the corresponding packag... | 05/13/2008 |
| 7371609 | Stacked module systems and methods The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical f... | 05/13/2008 |
| 7369090 | Ball Grid Array package having integrated antenna pad An apparatus for an improved Ball Grid Array (BGA) package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a BGA package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupl... | 05/06/2008 |
| 7352589 | Modular computer system mechanical interconnection A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The ap... | 04/01/2008 |
| 7348660 | Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package A leadframe includes a multiplicity of leads. The leads have a board level contact portion, an intermediate portion and a chip level contact portion. The intermediate portion is disposed between the board level contact portion and the chip level contact portion. The... | 03/25/2008 |
| 7348183 | Self-contained microelectrochemical bioassay platforms and methods Methods and devices for improved chemical and biomass detection assays combined well defined microstructures having independently addressable electrodes with various surface immobilization electrochemical assays. Combining known chemical detection immobilization ass... | 03/25/2008 |
| 7342308 | Component stacking for integrated circuit electronic package Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a compon... | 03/11/2008 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7327580 | Electronic board device comprising a rack and an electronic board chassis for insertion into the rack This device is of the type comprising a rack, a chassis that can be inserted into the rack, and at least one electronic board that can be inserted into the chassis. According to one aspect of the invention, the chassis is arranged so as to enable the insertio... | 02/05/2008 |
| 7324346 | Plug-in module for portable computing device A plug-in module adds functionality to a portable electronic device. The module includes a housing that is accepted by a housing port of the portable electronic device. The module includes at least one latch to secure the module to the electronic device. Each latch ... | 01/29/2008 |
| 7321164 | Stack structure with semiconductor chip embedded in carrier A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and inactive surfaces corresponding thereto placed in the cavities of the... | 01/22/2008 |
| 7315456 | Configurable IO subsystem An enclosure for an input-output (IO) subsystem comprises: a backplane; a plurality of first slots for accepting corresponding IO option modules; a second slot for accepting an IO controller module; a plurality of first connectors corresponding to the plurality of f... | 01/01/2008 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7303138 | Integrated circuit card having staggered sequences of connector terminals An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in stagge... | 12/04/2007 |
| 7298625 | Expansion structure of memory module slot An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the motherboard, at least one second memory module slot is disposed on on... | 11/20/2007 |
| 7291235 | Thermal dissipating capacitor and electrical component comprising same An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circui... | 11/06/2007 |
| 7285847 | Chip stack package, connecting board, and method of connecting chips A chip stack package, a connecting board, and a method of connecting multiple, stacked semiconductor chips multi-chip package comprises a plurality of stacked packages including an upper package and a lower package. Each connecting board includes a board, including ... | 10/23/2007 |
| 7282789 | Back-to-back semiconductor device assemblies A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semicond... | 10/16/2007 |
| 7280350 | Computing devices Each of a cluster of computing balls (1) contains within its housing (3) a photosensitive device (51) for receiving light from a light source (5) and converting it into energy to power a processing chip (2). There is thus wireless ... | 10/09/2007 |
| 7274110 | Semiconductor component having a CSP housing The invention relates to a semiconductor component for mounting on a printed circuit board. The semiconductor component includes a housing that at least partially surrounds at least one flat semiconductor chip. Electrical contacts are assigned to the semiconductor c... | 09/25/2007 |
| 7265992 | Negotiating electrical signal pathway compatibility between reconfigurable circuit modules An electrical signal pathway compatibility is negotiated between a first reconfigurable circuit module and a second, connected, reconfigurable circuit module. The first reconfigurable circuit module includes a circuit board, a programmable device possessing a plural... | 09/04/2007 |
| 7253091 | Process for assembling three-dimensional systems on a chip and structure thus obtained A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate con... | 08/07/2007 |
| 7253510 | Ball grid array package construction with raised solder ball pads The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductiv... | 08/07/2007 |
