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| Number | Title | Issue Date |
| 8107245 | Proximity active connector and cable A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a c... | 01/31/2012 |
| 7656670 | Electronic blast with remote capacitor placement An electronic ballast with remote capacitor placement includes a first housing (34); a second housing (36); an AC/DC converter (22); a DC bus (24) operably connected to the AC/DC converter (22); a lamp driver (26) operably c... | 02/02/2010 |
| 7432593 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 10/07/2008 |
| 7414299 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/19/2008 |
| 7371078 | Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested To attain an object of providing an insert for holding wide-ranging kinds of area array type electronic components and realizing certain connection between external terminals of an area array type electronic component and connection terminals of a socket, and an ele... | 05/13/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
| 7355265 | Semiconductor integrated circuit A semiconductor integrated circuit comprising a power supply wiring and a ground wiring and a decoupling capacitor formed between the power supply wiring and the ground wiring, wherein at least one electrode of the decoupling capacitor consists of a shield layer for... | 04/08/2008 |
| 7338300 | Static electricity conductive mechanism The present invention discloses a static electricity conductive mechanism including a plurality of conductive bumps and conductive members, for conducting static electricity generated by a connector device to a base thereof, the connector device having a connector b... | 03/04/2008 |
| 7312402 | Method and apparatus for providing improved loop inductance of decoupling capacitors A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on opposite sides of the capacitor, these vias are moved around to the same sid... | 12/25/2007 |
| 7301217 | Decoupling capacitor design A thin-dielectric unit capacitor is disclosed having a first node coupled to a first circuit connection point and a second node coupled to a second circuit connection point. It further contains a first and second thin-dielectric capacitors connected in series betwee... | 11/27/2007 |
| 7264482 | Anisotropic conductive sheet An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix memb... | 09/04/2007 |
| 7265995 | Array capacitors with voids to enable a full-grid socket An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adja... | 09/04/2007 |
| 7256068 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/14/2007 |
| 7248036 | Method and apparatus to probe bus signals using repeaters An assembly including a processor socket having a cut region. The assemble further including a probe board having a repeater positioned in alignment with the cut region. The repeater is to receive at least a first signal. The repeater is to tap the first signal. The... | 07/24/2007 |
| 7221040 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 05/22/2007 |
| 7197348 | Mobile phone with interchangeable housing A mobile phone with an interchangeable housing. The mobile phone includes a body, a front housing, a rear cover, a battery cover, and a battery pack. The body includes an engaging member. The front housing is detachably disposed on the body via the engaging member. ... | 03/27/2007 |
| 7177158 | Press-activated electronic component discharging facilitating apparatus A press-activated electronic component discharging facilitating apparatus is proposed, which is designed for use with a battery-powered electronic component, such as a CMOS (Complementary Metal Oxide Semiconductor) memory unit installed on a computer motherboard, fo... | 02/13/2007 |
| 7176566 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 02/13/2007 |
| 7166918 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 01/23/2007 |
| 7148554 | Discrete electronic component arrangement including anchoring, thermally conductive pad An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electric... | 12/12/2006 |
| 7145233 | Decoupling capacitor closely coupled with integrated circuit An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plu... | 12/05/2006 |
| 7123118 | Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequen... | 10/17/2006 |
| 7091607 | Semiconductor package A semiconductor package includes a substrate, a chip, and at least one capacitor. The chip adheres to the substrate and has an active surface, a grounding area disposed on the active surface and at least one power pad mounted on the active surface. The capacitor is ... | 08/15/2006 |
| 7091584 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/15/2006 |
| 7053466 | High-speed signaling interface with broadside dynamic wave coupling A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric me... | 05/30/2006 |
| 7039374 | Transmitting and amplifying unit for wireless communication device A transmitting and amplifying unit for a wireless communication device. The transmitting and amplifying unit includes a C-shaped frame having an upper plate having a first cutout, a lower plate having a second cutout aligned with the first cutout, and a side plate c... | 05/02/2006 |
| 7026910 | GMR module So that the parts and connections of a component, particularly a Giant Magneto-Resistor, may withstand external forces, a meander group (13M, 14M) with at least one meander element (13.1, . . . , 13.n, 14.1, . . . , 14.n) is positioned in... | 04/11/2006 |
| 6995448 | Semiconductor package including passive elements and method of manufacture A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath the semiconductor die on the substrate. The semiconductor die may be... | 02/07/2006 |
| 6995747 | Capacitive sensing and data input device power management Capacitive proximity sensing is carried out by detecting a relative change in the capacitance of a “scoop” capacitor formed by a conductor and a surrounding ground plane. The conductor may be a plate provided in the form of an adhesive label printed with conduct... | 02/07/2006 |
| 6974909 | IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted ... | 12/13/2005 |
| 6922341 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 07/26/2005 |
| 6900986 | Power module A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconduc... | 05/31/2005 |
| 6822868 | Heat sink with integrated electronics A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities t... | 11/23/2004 |
| 6762937 | Power module A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on ... | 07/13/2004 |
| 6717071 | Coaxial via hole and process of fabricating the same A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner... | 04/06/2004 |
| 6707680 | Surface applied passives Surface applied passive devices for use on electronic circuit boards are formed by applying layers of conductive, insulating, and other material to a thin polymer film carrier. The surface applied passives are thin enough to fit underneath standard integrated circui... | 03/16/2004 |
| 6707146 | Semiconductor apparatus with decoupling capacitor A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power... | 03/16/2004 |
| 6608375 | Semiconductor apparatus with decoupling capacitor A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminal... | 08/19/2003 |
| 6522544 | Power module A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a si... | 02/18/2003 |
| 6478909 | Method for surface mounting electrical components to a substrate A method for surface mounting electrical components to a substrate, such as a printed circuitboard, involves use of an anisotropically conductive adhesive or Z-Axis adhesive between facing conductive surface areas on the component and substrate. Pressure ... | 11/12/2002 |
