Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 8184440 | Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply c... | 05/22/2012 |
| 8102655 | Circuit device Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a ca... | 01/24/2012 |
| 7336491 | Heat sink A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat ... | 02/26/2008 |
| 7303428 | Electrical connector assembly with fastening means An electrical connector assembly (100) includes an electrical connector (2) with a first plurality of holes (230) thereon, a heat sink (3) mounted onto the electrical connector and including a second plurality of holes (300) thereo... | 12/04/2007 |
| 7301229 | Electrostatic discharge (ESD) protection for integrated circuit packages An integrated circuit package includes a package substrate with a plurality of pins coupled to a semiconductor chip having a plurality of bond pads, some of which are ic bond pads coupled to an integrated circuit formed on the semiconductor chip and others of which ... | 11/27/2007 |
| 7250673 | Signal isolation in a package substrate Signal traces are patterned on a top surface of a substrate. A ground trace is patterned on the top surface of the substrate for at least one pair of the signal traces. A die paddle is patterned on the top surface of the substrate, and the die paddle is connected di... | 07/31/2007 |
| 7242584 | Housing for power semiconductor modules A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection trac... | 07/10/2007 |
| 7163845 | Internal package heat dissipator A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally condu... | 01/16/2007 |
| 7152316 | Hybrid integrated circuit device and method of manufacturing the same To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a... | 12/26/2006 |
| 7142433 | Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor A method of embedding at least one flexible conductive track foil in a plastics material, wherein a prefabricated stiffening element is provided, said stiffening element accommodates said at least one flexible conductive track foil and secures it against bending, an... | 11/28/2006 |
| 7122892 | Multi-chip integrated circuit module for high-frequency operation A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relat... | 10/17/2006 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an inte... | 09/26/2006 |
| 7084490 | Leads under chip IC package A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantia... | 08/01/2006 |
| 7064420 | Integrated circuit leadframe with ground plane A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief ... | 06/20/2006 |
| 7049166 | Methods and apparatus for making integrated circuit package including opening exposing portion of the IC A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel p... | 05/23/2006 |
| 7042730 | Non-isolated heatsink(s) for power modules A power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body. ... | 05/09/2006 |
| 7031155 | Electronic thermal management Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, s... | 04/18/2006 |
| 7016200 | Module support for electrical/electronic components In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conducti... | 03/21/2006 |
| 6977214 | Die paddle clamping method for wire bond enhancement A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an ... | 12/20/2005 |
| 6921706 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. ... | 07/26/2005 |
| 6919525 | Thermal management components An article comprises a heat source, a heat sink, and a high-efficiency diamond material interposed between and thermally coupled to the heat source and the heat sink. The heat source and the high-efficiency diamond material have a contact area greater than 1 square ... | 07/19/2005 |
| 6891581 | Assembly structure for aluminum frame of liquid crystal display An assembly structure for aluminum frame of LCD, comprising a front frame, a middle frame and a rear frame. These frames are composed of two sets of long rectangular horizontally matching frames and two sets of short rectangular vertically matching frames. The front... | 05/10/2005 |
| 6838755 | Leadframe for integrated circuit chips having low resistance connections A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the s... | 01/04/2005 |
| 6777790 | Redundant pinout configuration for signal enhancement in IC packages A semiconductor device assembly package includes a semiconductor device having components thereon which are generic to a variety of applications by manipulation of the pinout configuration. The lead frame includes redundant leads for connection to the semiconductor ... | 08/17/2004 |
| 6713851 | Lead over chip semiconductor device including a heat sink for heat dissipation The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 that is in thermal contact with the surface opposite the princi... | 03/30/2004 |
| 6713836 | Packaging structure integrating passive devices In a leadframe packaging structure, a leadframe includes a plurality of first leads, a plurality of second leads, and a die pad. The first leads define a chip-bonding region in which is arranged the die pad. The second leads extend and terminate into a plurality of ... | 03/30/2004 |
| 6703261 | Semiconductor device and manufacturing the same A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink ... | 03/09/2004 |
| 6653934 | Electro-magnetic audio transducer for surface-mounted devices An electromagnetic audio transducer for SMD applications. The transducer comprises a lead frame with external terminals, which are formed into a predetermined shape. The transducer has a case with inside and outside surfaces, where the case is integrated ... | 11/25/2003 |
| 6643142 | Module having a lead frame equipped with components on both sides A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of... | 11/04/2003 |
| 6636429 | EMI reduction in power modules through the use of integrated capacitors on the substrate level A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference ("EMI"). In one embodiment, capacitance is electrically connected to at least one of the positive conducting... | 10/21/2003 |
| 6621714 | Apparatus and method for harnessing optical fiber to a circuit board An apparatus and method for retaining a length of fiber optic cable to a circuit board includes a body portion. The body portion of the apparatus includes at least a pair of spaced legs extending from the body portion, each of the legs is adapted to be re... | 09/16/2003 |
| 6614655 | Method of controlling cooling system for a personal computer and personal computer In an information processing apparatus such as a space-saving type personal computer having a liquid-cooling type cooling system, the presence of a cooling liquid, the presence of a frozen state of the cooling liquid and the temperature of the cooling liq... | 09/02/2003 |
| 6552901 | Apparatus and system for cooling electronic circuitry, heat sinks, and related components Apparatus and systems for cooling heat sinks, integrated circuit boards, and electronic components by providing internal passageways in the heat sinks, circuit boards, and electronic components that connect to a fluid manifold. The internal passageways co... | 04/22/2003 |
| 6552420 | Redundant pinout configuration for signal enhancement in IC packages A semiconductor device assembly package includes a semiconductor device having components thereon which are generic to a variety of applications by manipulation of the pinout configuration. The lead frame includes redundant leads for connection to the sem... | 04/22/2003 |
| 6545868 | Electronic module having canopy-type carriers An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite... | 04/08/2003 |
| 6528868 | Lead frame device and method for producing the same A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made ... | 03/04/2003 |
| 6518508 | Ag-pre-plated lead frame for semiconductor package A lead frame for a semiconductor package includes a base metal layer made of copper (Cu), Cu alloy or iron-nickel (Fe-Ni) alloy, an underlying plating layer formed on at least one surface of the base metal layer and made of Ni or Ni alloy, an intermediate... | 02/11/2003 |
| 6487078 | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite... | 11/26/2002 |
| 6483178 | Semiconductor device package structure A semiconductor device package structure is proposed, which allows the encapsulation body to be highly secured in position to the leads, making the encapsulation body hardly delaminated from the leads. The proposed semiconductor device package structure c... | 11/19/2002 |
| 6466446 | Integrated circuit package with diamond heat sink An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermall... | 10/15/2002 |
