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| Number | Title | Issue Date |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7394657 | Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pres... | 07/01/2008 |
| 7388753 | Methods and apparatuses for thermal dissipation A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot ... | 06/17/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7352581 | Cooling device and electronic apparatus According to one embodiment, a cooling device includes: a heat transfer unit thermally connected to a mounted first heating element and a mounted second heating element whose mounted height is higher than that of the first heating element, the heat transfer unit inc... | 04/01/2008 |
| 7330352 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 02/12/2008 |
| 7321100 | Housing for high-speed electro-optical assembly incorporating latching and EMI shielding A system and method for placing an electro-optical assembly inside a panel. In accordance with various embodiments of the invention, the system includes a housing to house the electro-optical assembly. The housing comprises a top section, a bottom section, a front e... | 01/22/2008 |
| 7307841 | Electronic package and method of cooling electronics An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry... | 12/11/2007 |
| 7289327 | Active cooling methods and apparatus for modules A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling comp... | 10/30/2007 |
| 7246681 | Radio frequency shielded and acoustically insulated enclosure A radio frequency (“RF”) shielded and acoustically isolated enclosure that efficiently employs multiple layers of sound insulation and absorbs airborne noise and the noise provided by magnetic resonance imaging (“MRI”) equipment through the supports of such ... | 07/24/2007 |
| 7212408 | Multi-slot socket for mounting integrated circuits on circuit board An apparatus includes a socket and a dynamic random access memory (DRAM) module installed in the socket. ... | 05/01/2007 |
| 7202559 | Method of assembling a ball grid array package with patterned stiffener layer Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantiall... | 04/10/2007 |
| 7180736 | Microelectronic package within cylindrical housing A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. Th... | 02/20/2007 |
| 7075789 | Mechanical housing An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing ... | 07/11/2006 |
| 7067905 | Packaged microelectronic devices including first and second casings The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a fi... | 06/27/2006 |
| 7030343 | Controller system for bathing installation A controller system for a bathing installation such as a spa is disclosed. The system distributes line voltage from a line voltage service to one or more line voltage loads and controls operation of a service system for the bathing installation. The system includes ... | 04/18/2006 |
| 7031163 | Mechanical cooling fin for interconnects In one embodiment, an integrated circuit includes an electrically active interconnect line within a dielectric layer having a top and bottom surface, the bottom surface of the dielectric layer being coupled to the top surface of a substrate underlying the dielectric... | 04/18/2006 |
| 6975512 | Thermally enhanced heat sink BGA package Provided are heat sink BGA packages with thermally enhanced mold compounds to further facilitate heat transfer from the die out of the package. Packages in accordance with the present invention incorporate mold compounds with ceramic fillers. The ceramic filled mold... | 12/13/2005 |
| 6965515 | Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks A base station for a wireless communications system having a tower-mounted amplifier system with a low-noise amplifier transistor and a thermoelectric cooler that reduces the operating temperature of the low-noise amplifier transistor. The amplifier system has addit... | 11/15/2005 |
| 6950305 | Overmolded device with contoured surface An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be mol... | 09/27/2005 |
| 6950229 | Electrical insulating ring located between an end cap and a tension sleeve of an undersea pressure vessel housing an optical amplifier module A pressure vessel is provided for use in an undersea environment. The pressure vessel including a pressure housing and at least two cable receiving elements disposed on opposing ends of the pressure housing for respectively receiving ends of optical cables that each... | 09/27/2005 |
| 6944021 | Ventilation system for electrical wiring arrangements of electrical circuits A ventilation system is described for electrical wiring arrangements of electrical circuits comprising a plurality of electrical connection terminals arranged within an insulating element; the ventilation system comprising a plurality of electrical ventilation cable... | 09/13/2005 |
| 6940720 | Integrated circuit having a thermally shielded electric resistor trace An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on ... | 09/06/2005 |
| 6917465 | Method and apparatus for electrically isolating an optical amplifier module housed in a universal cable joint An optical amplifier module is provided that contains at least one optical amplifier. The module includes an internal housing having an outer dimension substantially equal to an outer dimension of an internal fiber splice housing of an undersea optical fiber cable j... | 07/12/2005 |
| 6900389 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 05/31/2005 |
| 6891724 | Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond d... | 05/10/2005 |
| 6882858 | Flexible board and method of fabricating the same There is provided a flexible board including (a) an internal layer, (b) a line formed in a first area of the internal layer, the line radiating unnecessary radiation, (c) a first ground layer formed on an upper surface of the internal layer, the first ground layer d... | 04/19/2005 |
| 6867378 | Solder paste and terminal-to-terminal connection structure A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is co... | 03/15/2005 |
| 6858792 | Tool-less coupling assembly Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a p... | 02/22/2005 |
| 6853551 | Telecommunication chassis A telecommunications chassis includes one or more vents on a first side of the chassis and one or more vents in a second side of the chassis, one or more fans mounted inside the chassis and oriented to direct air flow inside the chassis from side to side, one or mor... | 02/08/2005 |
| 6819565 | Cavity-down ball grid array semiconductor package with heat spreader A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate... | 11/16/2004 |
| 6817405 | Apparatus having forced fluid cooling and pin-fin heat sink A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing ... | 11/16/2004 |
| 6813154 | Reversible heat sink packaging assembly for an integrated circuit A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302... | 11/02/2004 |
| 6671176 | Method of cooling heat-generating electrical components A method of cooling heat-generating electrical components during service has a heat-removing element. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged e... | 12/30/2003 |
| 6621704 | Clip for heat sink A clip (1) for securing a heat sink (10) to an electronic device includes a fastener (30) and a handle (40). The fastener includes a lower engaging portion (31), a horizontal U-shaped spring portion (32) extending from the engaging portion, and an inverte... | 09/16/2003 |
| 6522542 | Power distribution panel with heat sink A power distribution panel with a heat sink integrated as a portion of a surface of the power distribution panel and a heat generating component of an electrical circuit within the power distribution panel being connected to the heat sink to allow heat co... | 02/18/2003 |
| 6480385 | Electronic assembly and cooling thereof An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that extends to at least one outer edge of the die to extract ... | 11/12/2002 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same A TBGA (Tape Ball Grid Array) package assembly with grounded heat sink and method of fabricating the same is provided, which is constructed of a tape, a heat sink, and at least one semiconductor chip. The proposed TBGA technology is characterized by that ... | 10/22/2002 |
| 6469895 | Integrated circuit mounting structure including a switching power supply A semiconductor packaging structure comprising a hybrid IC package having at least one IC chip mounted therein is disclosed. The semiconductor packaging structure includes a DC-DC switching power supply mounted within the hybrid IC package that is electri... | 10/22/2002 |
| 6418022 | Heat sink clip with operating bar A clip (1) comprises a main body (10) and an operating bar (30). The main body has a pressing section (12) adapted to press onto a heat sink (40). First and second arms (14, 15) extend outwardly and upwardly from opposite ends of the pressing section. A p... | 07/09/2002 |
