Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 8169782 | Electronic circuit device An electronic circuit device that suppresses deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and suppresses deterioration of the circuit board caused by deformation of the adhesive layer. The electronic ... | 05/01/2012 |
| 8094455 | High-density integrated circuit module structure A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat ... | 01/10/2012 |
| 8035974 | Integrated circuit package support system A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The stru... | 10/11/2011 |
| 8004846 | Heat radiator A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between... | 08/23/2011 |
| 7995345 | Single fan tray in a midplane architecture A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially or... | 08/09/2011 |
| 7990722 | Fastener and electronic device having the same A fastener comprises a fastener post, a clasping element and an elastic element. The fastener post comprises a head, a post body and a threaded portion. The post body has a first extension section connecting with the head, a second extension section connecting with ... | 08/02/2011 |
| 7839645 | Module having at least two surfaces and at least one thermally conductive layer therebetween A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the ... | 11/23/2010 |
| 7808792 | Single fan tray in a midplane architecture A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially or... | 10/05/2010 |
| 7796395 | Heat dissipation device for semiconductor package module, and semiconductor package module having the same A semiconductor package module having a heat dissipation device includes one or more semiconductor packages with each semiconductor package having semiconductor chips and solder balls connected to the semiconductor chips. A printed circuit board is electrically conn... | 09/14/2010 |
| 7791889 | Redundant power beneath circuit board One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away ... | 09/07/2010 |
| 7710730 | Fixing heat dissipating unit and electronic device having fixing heat dissipating unit A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold ... | 05/04/2010 |
| 7688593 | Servo damper control of airflow within an electronics chassis Provided is an apparatus and a system. The apparatus, in one embodiment, includes a chassis having one or more slots configured to hold circuit boards and a plenum coupled to the chassis. The apparatus, in this embodiment, further includes a fan assembly coupled to ... | 03/30/2010 |
| 7679920 | Cooling air distribution scheme for communication boards A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cool... | 03/16/2010 |
| 7630202 | High density module having at least two substrates and at least one thermally conductive layer therebetween A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality... | 12/08/2009 |
| 7626824 | Switching device with two controlled phases In a switching device with two controlled phases, in which each phase is associated with a respective printed circuit board assembly with at least one component to be cooled on a heat sink, the heat sink has a T-shaped cross section transversely with respect to its ... | 12/01/2009 |
| 7595994 | Heat dissipation device for expansion card and bracket thereof The invention relates to a heat dissipation device with a bracket for dissipating heat of a heating element of an expansion card. The heat dissipation device also includes an auxiliary card, a heat dissipating element. The bracket includes a securing element configu... | 09/29/2009 |
| 7593232 | Electronic apparatus and circuit board unit An electronic apparatus is provided with a housing, a circuit board section and a heat transfer member. The circuit board section is accommodated in the housing. The circuit board section includes a heat generating component, a heat receiving region thermally connec... | 09/22/2009 |
| 7532480 | Power delivery for electronic assemblies Embodiments of methods, apparatuses, devices, and/or systems for power delivery for electronic assemblies are disclosed. ... | 05/12/2009 |
| 7499281 | Multi-chip module with power system Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically abov... | 03/03/2009 |
| 7495924 | Electronic device An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate... | 02/24/2009 |
| 7489514 | LSI package equipped with interface module, interface module and connection holding mechanism I an LSI package, an interface module includes with an interposer having a signal processing LSI mounted thereon and has electric connection terminals for connection to a mounting board and a transmission line for transmitting a high-speed signal to an external wiri... | 02/10/2009 |
| 7480147 | Heat dissipation apparatus utilizing empty component slot A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector tha... | 01/20/2009 |
| 7443687 | Heat sink mounting device and mounting method, and server blade using the same A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even when a dual central processing unit (CPU) is constituted by extension... | 10/28/2008 |
| 7408782 | Multiple printed circuit board heat transfer guide plates A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured thr... | 08/05/2008 |
| 7400506 | Method and apparatus for cooling a memory device A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is op... | 07/15/2008 |
| 7394654 | Method and apparatus for providing thermal management in an electronic device An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is co... | 07/01/2008 |
| 7375287 | Assembly for accommodating the power electronics and control electronics of an electric motor An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board mounted with power electronic components which has a substrate that no... | 05/20/2008 |
| 7375970 | High density memory module using stacked printed circuit boards A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit ... | 05/20/2008 |
| 7372701 | Cantilever mounted electronic module with rigid center backbone A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electroni... | 05/13/2008 |
| 7372705 | Portable data routing device and method of use A data communications device, such as a router, is configured for use in an outdoor environment. The router includes wireless communications circuit boards mounted within an environmentally sealed housing. The housing protects the circuit boards from exposure to ext... | 05/13/2008 |
| 7365974 | Method for electronics equipment cooling having improved EMI control and reduced weight An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a backplane region. The apparatus further includes a plurality of air flo... | 04/29/2008 |
| 7365990 | Circuit board arrangement including heat dissipater A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices o... | 04/29/2008 |
| 7365424 | Microelectronic component assemblies with recessed wire bonds and methods of making same The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a subs... | 04/29/2008 |
| 7359203 | Combination of inverter casing and heat sink member The present invention provides an inverter assembly which comprises a casing with a top part, a base and two sidewalls, and the top part. The base and the two sidewalls are integrally manufactured as a one-piece. A printed circuit board with a plurality of electroni... | 04/15/2008 |
| 7359191 | Storage device system and cooling structure for logic circuit board for storage device system In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on a control section 1D of a disc array device 1. The... | 04/15/2008 |
| 7345885 | Heat spreader with multiple stacked printed circuit boards A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein. ... | 03/18/2008 |
| 7342789 | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few... | 03/11/2008 |
| 7342794 | Heat sink with integral card guide A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least on... | 03/11/2008 |
| 7342797 | Interposable heat sink for adjacent memory modules A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first ... | 03/11/2008 |
| 7342314 | Device having a useful structure and an auxiliary structure The present invention provides a device having a useful structure which is arranged on a substrate and has a useful structure side edge. In addition, an auxiliary structure is arranged on the substrate adjacent to the useful structure, the auxiliary structure having... | 03/11/2008 |
