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| Number | Title | Issue Date |
| 8179679 | Airflow guides using silicon walls/creating channels for heat control An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the b... | 05/15/2012 |
| 8125783 | Printed circuit board and electronic apparatus According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. A reinforcing plate secured to the other of the... | 02/28/2012 |
| 8120921 | Device having electronic components mounted therein and method for manufacturing such device A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surfac... | 02/21/2012 |
| 8081477 | Heat sink assembly having a clip A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink,... | 12/20/2011 |
| 8059411 | Vehicular electronics assembly An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive... | 11/15/2011 |
| 8054630 | Electronic components on trenched substrates and method of forming same A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trench... | 11/08/2011 |
| 7974099 | Apparatus and methods for thermal management of light emitting diodes An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multi... | 07/05/2011 |
| 7957149 | Top actuated, force limiting heatsink retention system Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module in... | 06/07/2011 |
| 7916486 | Circuit board, connection structure, and apparatus A circuit board is connected to a connector including a connection port and contact portions located at upper and lower positions of the connection port. The contact portions face each other in the vertical direction, and each contact portion is connected electrical... | 03/29/2011 |
| 7817428 | Enclosure with integrated heat wick An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housi... | 10/19/2010 |
| 7817429 | Printed circuit board assembly and liquid crystal display having the same A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring ca... | 10/19/2010 |
| 7782624 | Electronic apparatus An electronic apparatus includes a semiconductor chip 15, a first substrate 10A having an antenna 12 formed on a first face 10a thereof and having the semiconductor chip 15 loaded on a second face 10b thereof, ... | 08/24/2010 |
| 7742307 | High performance power device A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly ha... | 06/22/2010 |
| 7738253 | Power supply assembly A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which d... | 06/15/2010 |
| 7724517 | Case for a liquid submersion cooled electronic device A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. ... | 05/25/2010 |
| 7710729 | Method and system of real-time estimation of transmission line parameters in on-line power flow calculations A system and method for estimating parameters of transmission lines employing phasor measurement units is provided, wherein measurements are provided from the phasor measurement units relating to a transmission line. These measurements are filtered to remove invalid... | 05/04/2010 |
| 7663887 | Heat dissipation device assembly with retainer device A heat dissipation device assembly includes a heat dissipation device mounted on a printed circuit board and a retainer device mounted below the printed circuit board. The retainer device includes a back plate and a crank pivotably mounted to the back plate. The cra... | 02/16/2010 |
| 7660125 | Heat management in circuit card assemblies A circuit card assembly (CCA) comprises a printed circuit board (PCB) having first and second opposing major faces with a first pair of elongated edges extending therebetween. Heat management layers are disposed within the CCA and/or PCB, which extend to said edges,... | 02/09/2010 |
| 7619896 | Electrical junction box The present invention improves heat dissipation of an electrical junction box. An electrical junction box includes a housing which houses a control circuit board disposed perpendicular to a power distribution board. The control circuit board includes a control circu... | 11/17/2009 |
| 7606038 | Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on the second surface facing the mounting surface. Viaholes are provide... | 10/20/2009 |
| 7599180 | Air baffle with integrated tool-less expansion card attachment An air baffle with an integrated expansion card attachment is disposed in a computer for receiving an expansion card having a handle attached thereto. The air baffle includes a first wall including a first guide and a second guide projecting from a side surface of t... | 10/06/2009 |
| 7593231 | Adhesive sheet for attaching an electronic part and an electronic device having such an electronic part An electronic device includes an element having a surface, an electronic part having a surface to be adhesively attached to the surface of the element, and an adhesive sheet having a first adhesive layer releasably attached to the surface of the element, a second ad... | 09/22/2009 |
| 7486519 | System for cooling a heat-generating electronic device with increased air flow A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a botto... | 02/03/2009 |
| 7474534 | Methods and apparatuses for thermal dissipation A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot ... | 01/06/2009 |
| 7468890 | Graphics card heat-dissipating device A graphics card heat-dissipating device includes: a main body, a support seat, and a fixed element. The main body has a first heat-dissipating portion and a second heat-dissipating portion, and the first heat-dissipating portion has a first opening and the second he... | 12/23/2008 |
| 7443686 | Electronic system An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole... | 10/28/2008 |
| 7433200 | Wired circuit board A wired circuit board has a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer and including at least one pair of wires arranged in mutually spaced-apart and opposed relatio... | 10/07/2008 |
| 7433229 | Flash memory device with shunt A shunt activation signal is transmitted by an external control terminal through an external transmission interface to switch a flash memory controller in a shunt mode. The shunt activation signal of the external transmission interface can set up a switch as shunt. ... | 10/07/2008 |
| 7428151 | Cooling arrangement A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be co... | 09/23/2008 |
| 7428152 | Localized thermal management system A localized thermal management system for efficiently thermally managing a plurality of heat producing devices. The localized thermal management system includes a thermal management unit and a plurality of thermal vias in thermal communication with the thermal manag... | 09/23/2008 |
| 7420811 | Heat sink structure for light-emitting diode based streetlamp A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower ... | 09/02/2008 |
| 7405933 | Cooling device, substrate, and electronic equipment A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other an... | 07/29/2008 |
| 7405945 | Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead f... | 07/29/2008 |
| 7388753 | Methods and apparatuses for thermal dissipation A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot ... | 06/17/2008 |
| 7388752 | Series-connected heat dissipater coupled by heat pipe A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main d... | 06/17/2008 |
| 7375287 | Assembly for accommodating the power electronics and control electronics of an electric motor An arrangement to receive and accommodate the power and control electronics of an electric motor comprises a first circuit board mounted with control electronic components, a second circuit board mounted with power electronic components which has a substrate that no... | 05/20/2008 |
| 7375974 | Electronic device A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members intervene between rear surfaces of the electronic components and bottom su... | 05/20/2008 |
| 7372705 | Portable data routing device and method of use A data communications device, such as a router, is configured for use in an outdoor environment. The router includes wireless communications circuit boards mounted within an environmentally sealed housing. The housing protects the circuit boards from exposure to ext... | 05/13/2008 |
| 7365981 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and... | 04/29/2008 |
| 7365989 | Heat dissipating device for computer add-on cards A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecti... | 04/29/2008 |
